IT1-168S-SV(46) Hirose Electric Co Ltd, IT1-168S-SV(46) Datasheet
IT1-168S-SV(46)
Specifications of IT1-168S-SV(46)
Related parts for IT1-168S-SV(46)
IT1-168S-SV(46) Summary of contents
Page 1
... Supports Multiple Connectors per board Designed with a tolerance of +/- 0.2mm for both the X and Y-axis. The three-piece structure and the +/- 0.2mm tolerance allows 3 or more IT1’ mounted on a single board. 3. Customized Board-to-Board Distance Board-to-board distance can be customized, from 16mm to 40mm ...
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... Without Locating Post 3 Number of contacts : 168, 252 4 Connector S : Receptacle Socket P : Transmission Plug Module IT1 Series High Speed, Matched-Impedance, Parallel Board-to-board Connector System + Specification Measured at 100V DC 150 V AC/one minute Measured at 100 mA Frequency Hz, 0.75mm single amplitude, for 10 cycles in each of 3 directions Acceleration of 490 m/s waveform, 3 cycles in each of the 3 axis ...
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... IT1 Series High Speed, Matched-Impedance, Parallel Board-to-board Connector System Receptacles - 168 Contacts Part Number IT1-168S-SV IT1A-168S-SV BRecommended PCB mounting pattern A296 Locating Post Type CL No. 641-0002-0 With Locating Post 641-0012-4 Without Locating Post Not required for products without Locating Post. RoHS ...
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... Receptacles - 252 Contacts Part Number IT1-252S-SV IT1A-252S-SV BRecommended PCB mounting pattern IT1 Series High Speed, Matched-Impedance, Parallel Board-to-board Connector System CL No. Locating Post Type 641-0003-3 With Locating Post 641-0013-7 Without Locating Post . Not required for products without locating Post. RoHS YES ...
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... IT1 Series High Speed, Matched-Impedance, Parallel Board-to-board Connector System Transmission Module - 168 Contacts Part Number IT1-168P/28-19H 641-0192-8 IT1-168P/28-30H 641-0303-7 Connection Table The connection table indicates contact numbers in the mated condition,as illustrated in Fig. 1. Signal Ground Fig. 1 Signal Ground Signal Ground Signal Ground A298 CL No ...
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... Signal ı ı Signal ı ı ı ı a41 - a86 a42 - a85 Ground Ground a43 - a84 IT1 Series High Speed, Matched-Impedance, Parallel Board-to-board Connector System Board-to-board Distance A 23mm 10.4 30mm 13.9 a row - - a44 - a83 a86 - a41 b01 - b126 ı ı ...
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... IT1 Series High Speed, Matched-Impedance, Parallel Board-to-board Connector System BIT1 Series Extraction Tool Part Number IT1-PICKER ( 1 ) 641-1001-3 A300 CL No. Remarks RoHS 2-piece Package YES ...
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... IT1 Series High Speed, Matched-Impedance, Parallel Board-to-board Connector System Installation and Use Instruction Manual Table of Contents 1. System Components ¡Receptacles ¡Transmission Module Assembly ¡Extraction Tool 2. Recommended Design Guidelines 2-1 Recommended Solder Land Pattern 2-2 Board-to-Board Spacer Heights 3. Connector Placement 3-1 Receptacle Packaging Types ...
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... IT1 Series High Speed, Matched-Impedance, Parallel Board-to-board Connector System BConnector Handling Precautions 1. System components Receptacles ¡Contacts ¡Row A and row B contacts are arranged alternately starting with No.1 in row B. Placement on board is polarized. ¡Metal Fittings ¡Permanently inserted to provide lock with the Transmission Module and additional solder areas with the PCB. ...
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... Fig. 1 IT1-168S-SV Recommended Solder Land Pattern 2-2 Board-to-Board Spacer heights The two parallel boards connected by the IT1 connectors should be fastened to additional spacers between them. Fig. 3 indicates the connector height tolerance and the spacer’s height. When designing the spacer’s height, consideration should be given to the solder paste thickness and any other features, which may affect the full mating of the connector ...
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... IT1 Series High Speed, Matched-Impedance, Parallel Board-to-board Connector System 3. Connector Placement 3-1 Packaging Types ¡Two types of packaging are available: semi-hard tray and hard tray. Customers may specify a packaging type suitable for their automatic placement machines. * Refer to the separate drawings for the detailed dimensions of the trays. ...
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... The orientation posts serve as a prevention measure to avoid incorrect placement of the receptacle assemblies on the board. The contact terminals must be placed correctly over the corresponding solder pad as shown on Fig. 4-1. Correct Fig. 4-1 = 3-4 Recommended Reflow Conditions IT1 Series High Speed, Matched-Impedance, Parallel Board-to-board Connector System Incorrect Fig. 4-2 = Incorrect Fig. 4-3 = ...
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... IT1 Series High Speed, Matched-Impedance, Parallel Board-to-board Connector System 3-5 Solder Repairs Assure that flux is not reaching the contact areas of the connector. Wash the assembly as recommended below. SCleaning ConditionsS <Organic Solvent Cleaning> <Water Based Cleaning> When using water based cleaning agents (e.g., terpene, and alkali saponifiers), select the cleaning agent based on the documentation issued by the various manufacturers, which describes its effects on metals and resins ...
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... Mating/un-mating Assure that the receptacle assembly is correctly aligned with the Transmission Module. Fully insert the receptacle assembly on the Transmission Module critical that the insertion is done straight and uniformly. Step 4 IT1 Series High Speed, Matched-Impedance, Parallel Board-to-board Connector System Connection completed A307 ...
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... IT1 Series High Speed, Matched-Impedance, Parallel Board-to-board Connector System 5. Un-mating of Connectors Recommended Method ¡Pull uniformly straight up. Prohibited un-mating Methods A308 ...
Page 16
... Transmission Module frame. Ref. Fig. 2 Step 2 Pull out the transmission module holding the tools straight. extraction tool Insertion Area IT1 Series High Speed, Matched-Impedance, Parallel Board-to-board Connector System Fig. 1 Fig. 2 Inappropriate area Insertion area ...
Page 17
... IT1 Series High Speed, Matched-Impedance, Parallel Board-to-board Connector System 7. Precautions When Mounting Multiple Connectors Note: Observe the requirements as listed in paragraph 7-1 and 7-2. The mating/un-mating forces will increase with use of multiple assemblies recommended that a dedicated tooling is used for mating / un-mating of multiple connector assemblies in a single operation. ...