XC2V1000-4BGG575I Xilinx Inc, XC2V1000-4BGG575I Datasheet - Page 6

• Manufacturer Part Number: XC2V1000-4BGG575I
• Description: IC FPGA VIRTEX-II 2M 575-MBGA
• Manufacturer: Xilinx Inc
• Series: Virtex™-IIr

Specifications of XC2V1000-4BGG575I

• Number Of Labs/clbs: 1280
• Total Ram Bits: 737280
• Number Of I /o: 328
• Number Of Gates: 1000000
• Voltage - Supply: 1.425 V ~ 1.575 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C
• Package / Case: 575-BBGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Number Of Logic Elements/cells: -

Boundary Scan
Boundary scan instructions and associated data registers
support a standard methodology for accessing and config-
uring Virtex-II devices that complies with IEEE standards
1149.1 — 1993 and 1532. A system mode and a test mode
are implemented. In system mode, a Virtex-II device per-
forms its intended mission even while executing non-test
boundary-scan instructions. In test mode, boundary-scan
test instructions control the I/O pins for testing purposes.
The Virtex-II Test Access Port (TAP) supports BYPASS,
PRELOAD, SAMPLE, IDCODE, and USERCODE non-test
instructions. The EXTEST, INTEST, and HIGHZ test instruc-
tions are also supported.
Configuration
Virtex-II devices are configured by loading data into internal
configuration memory, using the following five modes:
•
•
•
•
•
A Data Encryption Standard (DES) decryptor is available
on-chip to secure the bitstreams. One or two triple-DES key
sets can be used to optionally encrypt the configuration
information.
Readback and Integrated Logic Analyzer
Configuration data stored in Virtex-II configuration memory
can be read back for verification. Along with the configura-
tion data, the contents of all flip-flops/latches, distributed
Table 4: Wire-Bond Packages Information
Table 5: Flip-Chip Packages Information
DS031-1 (v3.5) November 5, 2007
Product Specification
Notes:
1. Wire-bond packages include FGGnnn Pb-free versions. See
Pitch (mm)
Size (mm)
I/Os
Pitch (mm)
Size (mm)
I/Os
Slave-serial mode
Master-serial mode
Slave SelectMAP mode
Master SelectMAP mode
Boundary-Scan mode (IEEE 1532)
Package
Package
R
(1)
CSG144
CS144/
12 x 12
0.80
92
31 x 31
FF896
1.00
624
FGG256
FG256/
17 x 17
1.00
172
www.xilinx.com
Virtex-II Ordering Examples (Module
FGG456
FG456/
23 x 23
1.00
324
FF1152
35 x 35
SelectRAM, and block SelectRAM memory resources can
be read back. This capability is useful for real-time debug-
ging.
The Integrated Logic Analyzer (ILA) core and software pro-
vides a complete solution for accessing and verifying
Virtex-II devices.
Virtex-II Device/Package Combinations
and Maximum I/O
Wire-bond and flip-chip packages are available.
Table 5
wire-bond and flip-chip packages, respectively.
shows the number of available user I/Os for all device/pack-
age combinations.
•
•
•
•
•
•
•
•
The number of I/Os per package include all user I/Os except
the 15 control pins (CCLK, DONE, M0, M1, M2, PROG_B,
PWRDWN_B, TCK, TDI, TDO, TMS, HSWAP_EN, DXN,
DXP, and RSVD) and VBATT.
1.00
824
Virtex-II Platform FPGAs: Introduction and Overview
CS denotes wire-bond chip-scale ball grid array (BGA)
(0.80 mm pitch).
CSG denotes Pb-free wire-bond chip-scale ball grid
array (BGA) (0.80 mm pitch).
FG denotes wire-bond fine-pitch BGA (1.00 mm pitch).
FGG denotes Pb-free wire-bond fine-pitch BGA (1.00
mm pitch).
BG denotes standard BGA (1.27 mm pitch).
BGG denotes Pb-free standard BGA (1.27 mm pitch).
FF denotes flip-chip fine-pitch BGA (1.00 mm pitch).
BF denotes flip-chip BGA (1.27 mm pitch).
show the maximum possible number of user I/Os in
FGG676
FG676/
27 x 27
1.00
484
FF1517
40 x 40
1,108
1.00
1).
BGG575
BG575/
31 x 31
1.27
408
40 x 40
BF957
1.27
BGG728
684
BG728/
Module 1 of 4
35 x 35
Table 4
1.27
516
Table 6
and
5