XC5VLX110T-1FF1738C Xilinx Inc, XC5VLX110T-1FF1738C Datasheet - Page 306

IC FPGA VIRTEX-5 110K 1738FBGA

XC5VLX110T-1FF1738C

Manufacturer Part Number
XC5VLX110T-1FF1738C
Description
IC FPGA VIRTEX-5 110K 1738FBGA
Manufacturer
Xilinx Inc
Series
Virtex™-5 LXTr

Specifications of XC5VLX110T-1FF1738C

Number Of Logic Elements/cells
110592
Number Of Labs/clbs
8640
Total Ram Bits
5455872
Number Of I /o
680
Voltage - Supply
0.95 V ~ 1.05 V
Mounting Type
Surface Mount
Operating Temperature
0°C ~ 85°C
Package / Case
1738-BBGA, FCBGA
For Use With
HW-V5-ML523-FXT-UNI-G-J - BOARD EVAL FOR VIRTEX-5HW-V5-ML523-FXT-UNI-G - BOARD EVAL FOR VIRTEX-5HW-V5-ML523-UNI-G - EVALUATION PLATFORM VIRTEX-5HW-AFX-FF1738-500-G - BOARD DEV VIRTEX 5 FF1738
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Number Of Gates
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
XC5VLX110T-1FF1738C
Manufacturer:
Xilinx Inc
Quantity:
10 000
Part Number:
XC5VLX110T-1FF1738C
Manufacturer:
XILINX
0
Chapter 6: SelectIO Resources
306
Nominal PCB Specifications
PCB Construction
Signal Return Current Management
Load Traces
Power Distribution System Design
The nominal SSO table
parameters meet the following requirements.
Note:
SSO Calculator must be used to determine the SSO limit, according to the physical factors of the
unique PCB.
V
Total board thickness must be no greater than 62 mils (1575 µ).
Traces must be referenced to a plane on an adjacent PCB layer.
The reference plane must be either GND or the V
driver.
The reference layer must remain uninterrupted for its full length from device to
device.
All IOB output buffers must drive controlled impedance traces with characteristic
impedance of 50Ω ± 10%.
Total capacitive loading at the far end of the trace (input capacitance of receiving
device) must be no more than 10 pF.
Designed according to the Virtex-5 FPGA PCB Designer’s Guide.
V
CCO
CCO
In cases where PCB parameters do not meet all requirements listed below, the Virtex-5 FPGA
Decoupling capacitors per the device guideline
Approved solder land patterns
and GND vias should have a drill diameter no less than 11 mils (279 µ).
and GND planes cannot be separated by more than 5.0 mils (152 µ)
(Table
www.xilinx.com
6-40) contains SSO limits for cases where the PCB
CCO
associated with the output
Virtex-5 FPGA User Guide
UG190 (v5.3) May 17, 2010

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