SI3452A-B01-GM Silicon Laboratories Inc, SI3452A-B01-GM Datasheet - Page 32

• Manufacturer Part Number: SI3452A-B01-GM
• Description: IC POE CONTROLLER MIDSPAN 40QFN
• Manufacturer: Silicon Laboratories Inc

Specifications of SI3452A-B01-GM

• Package / Case: 40-QFN
• Controller Type: Power over Ethernet Controller (POE)
• Interface: I²C
• Voltage - Supply: 3 V ~ 3.6 V
• Current - Supply: 14mA
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Maximum Power Dissipation: 1.2 W
• Minimum Operating Temperature: - 40 C
• Mounting Style: SMD/SMT
• Product: Ethernet Controllers
• Standard Supported: IEEE 802.3at, IEEE 802.3af
• Supply Voltage (max): 3.6 V
• Supply Voltage (min): 3 V
• Supply Current (max): 14 mA
• Maximum Operating Temperature: + 85 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 336-1831-5

Si3452
11. Recommended PCB Footprint
32
Notes:
General
Solder Mask Design
Stencil Design
Card Assembly
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. Dimensioning and Tolerancing is per the ANSI Y14.5M-1994 specification.
3. This Land Pattern Design is based on IPC-SM-782 guidelines.
4. All dimensions shown are at Maximum Material Condition (MMC). Least Material Condition
5. All metal pads are to be non-solder mask defined (NSMD). Clearance between the solder
6. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used
7. The stencil thickness should be 0.125 mm (5 mils).
8. The ratio of stencil aperture to land pad size should be 1:1 for the perimeter pads.
9. A 4x4 array of 0.80 mm square openings on 1.05 mm pitch should be used for the center Vee
10. A No-Clean, Type-3 solder paste is recommended.
11. The recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small
(LMC) is calculated based on a Fabrication Allowance of 0.05 mm.
mask and the metal pad is to be 60 µm minimum, all the way around the pad.
to assure good solder paste release.
pad.
Body Components.
Dimension
GE
GD
D2
ZE
ZD
E2
E
D
X
Y
e
Table 27. PCB Land Pattern Dimensions
Figure 8. PCB Land Pattern
Rev. 1.2
4.00
4.00
4.53
4.53
Min
—
—
—
0.50 BSC
0.89 REF
5.42 REF
5.42 REF
Max
4.20
4.20
0.28
6.31
6.31
—
—