VNC2-48L1B-TRAY FTDI, Future Technology Devices International Ltd, VNC2-48L1B-TRAY Datasheet - Page 89

• Manufacturer Part Number: VNC2-48L1B-TRAY
• Description: IC USB HOST VINCULUM-II 48LQFP
• Manufacturer: FTDI, Future Technology Devices International Ltd
• Series: Vinculum-IIr

Specifications of VNC2-48L1B-TRAY

• Mfg Application Notes: Vinculum-II IO Cell Description AppNote Vinculum-II Debug Interface Description AppNote Vinculum-II IO Mux Explained AppNote Vinculum-II PWM Example AppNote Migrating Vinculum Designs AppNote
• Controller Type: USB 2.0 Controller
• Interface: SPI Serial, USB, UART
• Voltage - Supply: 1.62 V ~ 1.98 V
• Current - Supply: 25mA
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 48-LQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: VNC2-48L1A-TRAY; VNC2-48L1A-TRAY

Document No.: FT_000138
VINCULUM-II EMBEDDED DUAL USB HOST CONTROLLER IC Datasheet
1.2
Version -
143
Clearance No.: FTDI#
Figure 7-1 USB Modes ................................................................................................................. 68
Figure 10-1 VNC2 Schematic (MCU - UART Interface) ...................................................................... 76
Figure 11-1 Package Markings ...................................................................................................... 77
Figure 11-2 Markings – 32 QFN .................................................................................................... 77
Figure 11-3 LQFP-32 Package Dimensions ..................................................................................... 78
Figure 11-4 QFN-32 Package Dimensions ....................................................................................... 79
Figure 11-5 LQFP-48 Package Dimensions ..................................................................................... 80
Figure 11-6 64 pin LQFP Package Details ....................................................................................... 82
Figure 11-7 64 pin QFN Package Details ........................................................................................ 83
Figure 11-8 All packages Reflow Solder Profile ................................................................................ 84
Copyright © 2010 Future Technology Devices International Limited
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