595D107X0016D2T Sprague / Vishay, 595D107X0016D2T Datasheet - Page 10

• Manufacturer Part Number: 595D107X0016D2T
• Description: Capacitor, Tantalum; 100uF; Solid Chip; +/-20%; Case D; SMD; 16WVDC; 20V; 0.14Ohms ESR
• Manufacturer: Sprague / Vishay

Specifications of 595D107X0016D2T

• Capacitance: 100 μF
• Case Code: D
• Dimensions: 0.293 in. L x 0.170 in. W x 0.110 in. H
• Dissipation Factor: 8% (Max.)
• Esr: 0.14 Ohms
• Material, Element: Tantalum
• Termination: SMT
• Tolerance: ±20 %
• Voltage, Rating: 16 VDC
• Terminations: 100% Tin (2) Standard
• Capacitance Range: 0.1 μF to 1500 μF
• Lead Free Status / Rohs Status: RoHS Compliant part

GUIDE TO APPLICATION
3.1
3.2
4.
5.
6.
7.
8.
8.1
Document Number: 40007
Revision: 30-Aug-05
The sum of the peak AC voltage plus the applied DC
voltage shall not exceed the DC voltage rating of the
capacitor.
The sum of the negative peak AC voltage plus the
applied DC voltage shall not allow a voltage reversal
exceeding 10 % of the DC working voltage at + 25 °C.
Reverse Voltage: These capacitors are capable of
withstanding peak voltages in the reverse direction
equal to 10 % of the DC rating at + 25 °C and 5 % of
the DC rating at + 85 °C.
Temperature Derating: If these capacitors are to be
operated at temperatures above + 25 °C, the
permissible rms ripple current or voltage shall be
calculated using the derating factors as shown:
Power Dissipation: Power dissipation will be
affected by the heat sinking capability of the mounting
surface. Non-sinusoidal ripple current may produce
heating effects which differ from those shown. It is
important that the equivalent Irms value be
established when calculating permissible operating
levels. (Power dissipation calculated using + 25 °C
temperature rise.)
Printed Circuit Board Materials: The capacitors are
compatible with most commonly used printed circuit
board materials (alumina substrates, FR4, FR5, G10,
PTFE-fluorocarbon and porcelanized steel). If your
desired board material is not shown there please
contact the Tantalum Marketing Department for
assistance in determining compatibility.
Attachment:
Solder Paste: The recommended thickness of the
solder paste after application is 0.007" ± 0.001"
[0.178 mm ± 0.025 mm]. Care should be exercised in
selecting the solder paste. The metal purity should be
Temperature
Case Code
+ 125 °C
+ 25 °C
+ 85 °C
M
G
S
A
B
C
D
H
R
T
Maximum Permissible Power
+ 25 °C (watts) in Free Air
(Continued)
Derating Factor
Dissipation at
For technical questions, contact: [e-mail]
TANTAMOUNT® Conformal Coated,
Solid Tantalum Chip Capacitors
0.030
0.060
0.075
0.085
0.095
0.110
0.150
0.115
0.125
0.250
1.0
0.9
0.4
Maximum CV
8.2
RECOMMENDED REFLOW SOLDERING PROFILE
25 °C
25 °C
25 °C
as high as practical. The flux (in the paste) must be
active enough to remove the oxides formed on the
metallization prior to the exposure to soldering heat.
Soldering:
conventional soldering techniques, vapor phase
convection, infrared reflow, wave soldering and hot
plate methods. The Soldering Profile charts show
typical recomended time/temperature conditions for
soldering. Preheating is recommended to reduce
thermal stress. The recommended maximum preheat
rate is 2 °C per second. Attachment with a soldering
iron is not recommended due to the difficulty of
controlling temperature and time at temperature. The
soldering iron must never come in contact with the
capacitor.
Recommended Pb Free Reflow Soldering Profile
Recommended Pb Free Reflow Soldering Profile
Recommended SnPb Reflow Soldering Profile
200°C
150 °C
200 °C
150 °C
150 °C
100 °C
245 °C
260 °C
225 °C
Small Case Codes: A, B, C, T, G, H, M, S
217 °C
217 °C
183 °C
Capacitors
Large Case Codes: D, R
TIME (SECONDS)
TIME (SECONDS)
TIME (SECONDS)
All Case Codes
60 - 150 sec
60 - 150 sec
60 - 90 sec
Preheat
Preheat
Preheat
can
Vishay Sprague
60 sec
60 sec
60 sec
10 sec
10 sec
10 sec
be
www.vishay.com
attached
595D
by
10