MAX3232ECUP+ Maxim Integrated Products, MAX3232ECUP+ Datasheet - Page 2

• Manufacturer Part Number: MAX3232ECUP+
• Description: IC TXRX RS232 250KBPS LP 20TSSOP
• Manufacturer: Maxim Integrated Products
• Type: Transceiverr

Specifications of MAX3232ECUP+

• Number Of Drivers/receivers: 2/2
• Protocol: RS232
• Voltage - Supply: 3 V ~ 5.5 V
• Mounting Type: Surface Mount
• Package / Case: 20-TSSOP
• Propagation Delay Time Ns: 0.15 us
• Operating Supply Voltage: 3 V to 5.5 V
• Supply Current: 0.3 mA
• Operating Temperature Range: 0 C to + 70 C
• Data Rate: 250 Kbps
• Mounting Style: SMD/SMT
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

ABSOLUTE MAXIMUM RATINGS
V
V+ to GND (Note 1) ..................................................-0.3V to +7V
V- to GND (Note 1) ...................................................+0.3V to -7V
V+ + |V-| (Note 1).................................................................+13V
Input Voltages
Output Voltages
Short-Circuit Duration, T_OUT to GND.......................Continuous
Continuous Power Dissipation (T
ELECTRICAL CHARACTERISTICS
(V
±15kV ESD-Protected, Down to 10nA, 3.0V to 5.5V,
Up to 1Mbps, True RS-232 Transceivers
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
2
Note 1: V+ and V- can have maximum magnitudes of 7V, but their absolute difference cannot exceed 13V.
Note 2: This device is constructed using a unique set of packaging techniques that impose a limit on the thermal profile the device
DC CHARACTERISTICS (V
Supply Current
Shutdown Supply Current
LOGIC INPUTS
Input Logic Low
Input Logic High
Transmitter Input Hysteresis
Input Leakage Current
CC
R_OUT, R_OUTB (MAX3237E/MAX3241E)...-0.3V to (V
T_IN, EN, SHDN, MBAUD to GND ........................-0.3V to +6V
R_IN to GND .....................................................................±25V
T_OUT to GND...............................................................±13.2V
16-Pin SSOP (derate 7.14mW/°C above +70°C) ..........571mW
16-Pin TSSOP (derate 9.4mW/°C above +70°C) .......754.7mW
16-Pin TQFN (derate 20.8mW/°C above +70°C) .....1666.7mW
16-Pin Wide SO (derate 9.52mW/°C above +70°C) .....762mW
18-Pin Wide SO (derate 9.52mW/°C above +70°C) .....762mW
18-Pin PDIP (derate 11.11mW/°C above +70°C)..........889mW
CC
_______________________________________________________________________________________
to GND ..............................................................-0.3V to +6V
= +3V to +5.5V, C1–C4 = 0.1µF, T
can be exposed to during board-level solder attach and rework. This limit permits only the use of the solder profiles recom-
mended in the industry-standard specification, JEDEC 020A, paragraph 7.6, Table 3 for IR/VPR and convection reflow.
Preheating is required. Hand or wave soldering is not allowed.
PARAMETER
CC
= +3.3V or +5V, T
A
= +70°C)
T_IN,
T_IN,
T_IN,
T_IN,
A
= T
= V
= GND
= R_IN = GND, T_IN = GND or V
MIN
,
,
,
CC
to T
, MBAUD
, no load
A
MAX
= +25°C)
CC
, MBAUD
, MBAUD
, unless otherwise noted. Typical values are at T
+ 0.3V)
CONDITIONS
MAX3222E, MAX3232E,
MAX3241E, MAX3246E
MAX3237E
V
V
MAX3222E, MAX3232E,
MAX3241E, MAX3246E
MAX3237E (Note 5)
CC
CC
Operating Temperature Ranges
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Soldering Temperature (reflow) .......................................+260°C
Bump Reflow Temperature (Note 2)
20-Pin TQFN (derate 21.3mW/°C above +70°C) ........1702mW
20-Pin TSSOP (derate 10.9mW/°C above +70°C) ........879mW
20-Pin SSOP (derate 8.00mW/°C above +70°C) ..........640mW
28-Pin SSOP (derate 9.52mW/°C above +70°C) ..........762mW
28-Pin Wide SO (derate 12.50mW/°C above +70°C) .............1W
28-Pin TSSOP (derate 12.8mW/°C above +70°C) ......1026mW
32-Pin TQFN (derate 33.3mW/°C above +70°C)...........2666mW
6 x 6 UCSP (derate 12.6mW/°C above +70°C) .............1010mW
MAX32_ _EC_ _ ...................................................0°C to +70°C
MAX32_ _EE_ _.................................................-40°C to +85°C
Infrared, 15s..................................................................+200°C
Vapor Phase, 20s..........................................................+215°C
= +3.3V
= +5.0V
CC
(MAX3237E)
MIN
2.0
2.4
A
= +25°C.) (Notes 3, 4)
±0.01
TYP
0.3
0.5
0.5
10
1
9
MAX
300
2.0
0.8
±1
10
18
1
UNITS
mA
μA
nA
μA
V
V
V