MC14513BCP ON Semiconductor, MC14513BCP Datasheet - Page 5

• Manufacturer Part Number: MC14513BCP
• Description: Decoder; CMOS Gate; -0.5 to .0 VDC; 0.005 mAdc (Typ.) @ 5 VDC, degC; 5 VDC
• Manufacturer: ON Semiconductor

Specifications of MC14513BCP

• Capacitance, Input: 5 pF (Typ.) @ +25 °C
• Circuit Type: Low-Power Schottky
• Current, Output: ±10 mA
• Current, Output Drive: 5 mAdc
• Current, Quiescent Supply: 0.005 mAdc (Typ.) @ 5 VDC, +25 °C
• Current, Supply: 600 μA
• Function Type: 1-Channel
• Logic Function: Decoder/Driver/Latch
• Logic Type: CMOS
• Package Type: PDIP-16
• Power Dissipation: 500 mW
• Special Features: BCD to 7-Segment, Tri-State
• Temperature, Operating, Maximum: 150 °C
• Temperature, Operating, Minimum: -65 °C
• Temperature, Operating, Range: -55 to +125 °C
• Time, Delay, Propagation: 640 ns (Typ.) @ 5 VDC
• Time, Fall, Output: 125 ns (Typ.) @ 5 VDC
• Time, Rise, Output: 100 ns (Typ.) @ 5 VDC, +25 °C
• Voltage, Input: 5 VDC
• Voltage, Supply: 3 to 18 VDC

18
1
H
F
G
A
D
10
9
SEATING
PLANE
N
C
B
K
L
PACKAGE DIMENSIONS
CASE 707−02
MC14513B
J
M
PDIP−18
ISSUE D
10
NOTES:
1. POSITIONAL TOLERANCE OF LEADS (D), SHALL
2. DIMENSION L TO CENTER OF LEADS WHEN
3. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
4. CONTROLLING DIMENSION: INCH.
BE WITHIN 0.25 mm (0.010) AT MAXIMUM
MATERIAL CONDITION, IN RELATION TO SEATING
PLANE AND EACH OTHER.
FORMED PARALLEL.
DIM
M
A
B
C
D
F
G
H
K
L
N
J
0.875
0.240
0.140
0.014
0.050
0.040
0.008
0.020
0.115
MIN
0.100 BSC
0.300 BSC
0
INCHES
_
0.915
0.260
0.180
0.022
0.070
0.060
0.012
0.135
0.040
MAX
15
_
22.22
MILLIMETERS
MIN
6.10
3.56
0.36
1.27
1.02
0.20
2.92
0.51
0
2.54 BSC
7.62 BSC
_
MAX
23.24
MC14513B/D
6.60
4.57
0.56
1.78
1.52
0.30
3.43
1.02
15
_