LTC2856HMS8-1#PBF Linear Technology, LTC2856HMS8-1#PBF Datasheet - Page 17

• Manufacturer Part Number: LTC2856HMS8-1#PBF
• Description: IC TXRX RS485/RS422 8-MSOP
• Manufacturer: Linear Technology
• Type: Transceiverr

Specifications of LTC2856HMS8-1#PBF

• Number Of Drivers/receivers: 1/1
• Protocol: RS422, RS485
• Voltage - Supply: 4.5 V ~ 5.5 V
• Mounting Type: Surface Mount
• Package / Case: 8-MSOP, Micro8™, 8-uMAX, 8-uSOP,
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

PACKAGE DESCRIPTION
3.50 0.05
2.15 0.05
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-2).
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
1.65 0.05
0.25 0.05
CHECK THE LTC WEBSITE DATA SHEET FOR CURRENT STATUS OF VARIATION ASSIGNMENT
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
TOP AND BOTTOM OF PACKAGE
(2 SIDES)
2.38 0.05
(2 SIDES)
0.50
BSC
0.675 0.05
PACKAGE
OUTLINE
10-Lead Plastic DFN (3mm × 3mm)
(Reference LTC DWG # 05-08-1699)
(SEE NOTE 6)
TOP MARK
PIN 1
DD Package
0.200 REF
LTC2857-1/LTC2857-2
LTC2858-1/LTC2858-2
3.00 0.10
0.75 0.05
(4 SIDES)
0.00 – 0.05
1.65 0.10
(2 SIDES)
BOTTOM VIEW—EXPOSED PAD
5
R = 0.115
6
2.38 0.10
(2 SIDES)
TYP
10
1
0.50 BSC
0.25 0.05
0.38 0.10
17
(DD) DFN 1103
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