25LC160-I/SN Microchip Technology Inc., 25LC160-I/SN Datasheet

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25LC160-I/SN

Manufacturer Part Number
25LC160-I/SN
Description
16K, 2K X 8 , 2.5V SER EE IND
Manufacturer
Microchip Technology Inc.
Datasheet

Specifications of 25LC160-I/SN

Capacitance, Input
7 pF
Capacitance, Output
7 pF
Current, Input, Leakage
±10 μA
Current, Operating
1 mA (Read), 5 mA (Write)
Current, Output, Leakage
±10
Data Retention
>200 yrs.
Density
16K
Interface
SPI Bus
Memory Type
Serial EEPROM
Organization
2048×8
Package Type
SOIC
Temperature, Operating
-40 to +85 °C
Time, Access
150 ns
Time, Address Hold
250
Time, Address Setup
250
Time, Fall
2 μs
Time, Rise
2 μs
Voltage, Esd
>4 kV
Voltage, Input, High
3.5 V
Voltage, Input, Low
0.75 V
Voltage, Output, High
2 V
Voltage, Output, Low
0.4 V
Voltage, Supply
2.5 to 5.5 V
Lead Free Status / Rohs Status
RoHS Compliant part Electrostatic Device

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
25LC160-I/SN
Manufacturer:
MCP
Quantity:
19 863
Part Number:
25LC160-I/SN
Manufacturer:
MICROCHIP
Quantity:
12 000
Part Number:
25LC160-I/SN
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
*25XX160 is used in this document as a generic part number
for the 25AA160/25LC160/25C160 devices
SPI™ is a trademark of Motorola Inc
Device Selection Table
Features:
• Low-power CMOS technology:
• 2048 x 8-bit organization
• 16 byte page
• Write cycle time: 5 ms max.
• Self-timed erase and write cycles
• Block write protection:
• Built-in write protection:
• Sequential read
• High reliability:
• 8-pin PDIP and SOIC packages
• Temperature ranges supported:
 2004 Microchip Technology Inc.
25AA160
25LC160
25C160
- Write current: 3 mA maximum
- Read current: 500 A typical
- Standby current: 500 nA typical
- Protect none, 1/4, 1/2 or all of array
- Power on/off data protection circuitry
- Write enable latch
- Write-protect pin
- Endurance: 1 M cycles
- Data retention: > 200 years
- ESD protection: > 4000V
- Industrial (I):
- Automotive (E) (25C160):
Number
Part
1.8-5.5V
2.5-5.5V
4.5-5.5V
Range
V
CC
16K SPI
Max Clock
Frequency
1 MHz
2 MHz
3 MHz
.
-40 C to +85 C
-40°C to +125°C
.
25AA160/25LC160/25C160
Ranges
Temp
I,E
I
I
Bus Serial EEPROM
Description:
The Microchip Technology Inc. 25AA160/25LC160/
25C160 (25XX160
Erasable PROMs. The memory is accessed via a
simple Serial Peripheral Interface™ (SPI™) compati-
ble serial bus. The bus signals required are a clock
input (SCK) plus separate data in (SI) and data out
(SO) lines. Access to the device is controlled through a
Chip Select (CS) input.
Communication to the device can be paused via the
hold pin (HOLD). While the device is paused, transi-
tions on its inputs will be ignored, with the exception of
chip select, allowing the host to service higher priority
interrupts.
Package Types
Block Diagram
HOLD
SCK
WP
SO
CS
SI
PDIP/SOIC
I/O Control
Not recommended for new designs –
Please use 25AA160A/B or 25LC160A/B.
Register
Status
Logic
*
) are 16 Kbit Serial Electrically
V
V
V
WP
SO
CS
SS
CC
SS
Memory
Control
Logic
1
2
3
4
Dec
X
8
7
6
5
DS21231D-page 1
Sense Amp.
R/W Control
Y Decoder
HV Generator
Page Latches
V
HOLD
SCK
SI
CC
EEPROM
Array

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25LC160-I/SN Summary of contents

Page 1

... Microchip Technology Inc. Not recommended for new designs – Please use 25AA160A/B or 25LC160A/B. 25AA160/25LC160/25C160 ™ Bus Serial EEPROM Description: The Microchip Technology Inc. 25AA160/25LC160/ Temp 25C160 (25XX160 Ranges Erasable PROMs. The memory is accessed via a I simple Serial Peripheral Interface™ (SPI™) compati- ble serial bus ...

Page 2

... ELECTRICAL CHARACTERISTICS (†) Absolute Maximum Ratings V .............................................................................................................................................................................7.0V CC All inputs and outputs w.r.t. V ........................................................................................................ -0. Storage temperature .................................................................................................................................-65°C to 150°C Ambient temperature under bias ...............................................................................................................-40°C to 125°C Soldering temperature of leads (10 seconds) .......................................................................................................+300°C ESD protection on all pins ......................................................................................................................................... 4 KV † NOTICE: Stresses above those listed under “Maximum ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational listings of this specification is not implied ...

Page 3

... Note 1: This parameter is periodically sampled and not 100% tested. 2: This parameter is not tested but ensured by characterization. For endurance estimates in a specific application, please ™ consult the Total Endurance  2004 Microchip Technology Inc. 25AA160/25LC160/25C160 Industrial (I -40°C to +85°C A Automotive (E -40° ...

Page 4

... Plastic Small Outline (SN) – Narrow, 150 mil (SOIC Dimension Limits Number of Pins Pitch Overall Height Molded Package Thickness Standoff § Overall Width Molded Package Width Overall Length Chamfer Distance Foot Length Foot Angle Lead Thickness Lead Width Mold Draft Angle Top ...

Page 5

... Microchip Technology Inc. 25AA160/25LC160/25C160 XXX Examples: Pattern a) 25AA160-I/P: Industrial Temp., PDIP package b) 25AA160-I/SN: Industrial Temp., SOIC package c) 25LC160-I/SN: Industrial Temp., SOIC package d) 25LC160T-I/SN: Tape and Reel, Industrial Temp., SOIC package e) 25C160-E/P: Extended Temp., PDIP package f) 25C160-E/SN: Extended Temp., SOIC package . ...

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