C1206C103KARACTU/BKN Kemet, C1206C103KARACTU/BKN Datasheet - Page 2

• Manufacturer Part Number: C1206C103KARACTU/BKN
• Description: CAPACITORS, CERAMIC SMD, TIP AND RING, .010UF 250V, 10%, X7R; CUT REEL
• Manufacturer: Kemet

Specifications of C1206C103KARACTU/BKN

• Capacitance: 0.01 μF
• Case Size: 1206
• Dielectric Characteristic: X7R
• Material, Element: Ceramic
• Special Features: Tip and Ring
• Termination: SMT
• Tolerance: ±10 %
• Voltage, Rating: 250 VDC
• Lead Free Status / Rohs Status: RoHS Compliant part

© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • [phone] • www.kemet.com
These chips are supplied unmarked. If required, they can be laser-marked as an extra cost option. Details on the
marking format are included in KEMET Surface Mount Catalog F3102 on page 96.
The 0805 and 1206 sizes are suitable for either reflow or wave soldering. Sizes 1210 and larger should be limited
to reflow soldering only. All sizes incorporate the standard KEMET barrier layer of pure nickel with an overplating
of pure tin for excellent solderability and resistance to leaching of the termination.
KEMET High Voltage Surface Mount MLCC capacitors are available packaged in tape and reel configuration.
EIA Case Sizes
Capacitance Range
Test Parameters
Operating Temperature Range
Temperature Characteristic
Capacitance Tolerances
Dissipation Factor
Aging Rate
Voltage Rating
25°C IR @ Rated Voltage
Dielectric Strength (DMV)
Chip Size
0805
1206
1210
1812
1825
2220
2225
Style
C - Ceramic
Capacitance Tolerance
J = ±5%, K = ±10%, M = ±20%
Size Code
0805, 1206, 1210, 1812, 1825, 2220, 2225
Specification
C - Standard
Capacitance Code, pF
First two digits represent significant figures.
Third digit specifies number of zeros. 100 pF = 101.
General Performance Characteristics & Electrical Parameters 250 VDC
T - Total Length S - Separation
3.30
4.50
4.50
5.90
5.90
7.00
7.00
Recommended Solder Pad Dimensions
mm
0.130
0.177
0.177
0.232
0.232
0.276
0.276
C
in.
0805
0.70
1.50
1.50
2.30
2.30
3.30
3.30
mm
Capacitor Ordering Information
0805, 1206, 1210, 1812, 1825, 2220, 2225
0.001μF to 1.2μF
Capacitance and Dissipation Factor measured at 1.0 ± 0.2 Vrms and 1.0 ± 0.2 kHz
-55°C to +125°C
-55°C to +125°C X7R: ±15% (0% VDC)
J = ±5%, K = ±10%, M = ±20%
≤2.5%
2.5% per decade hour
250 VDC
1000MΩ−μF or 100GΩ, whichever is less
250% of Rated Voltage 5 ± 1 seconds and charge/discharge not exceeding 50mA
C
0.028
0.059
0.059
0.091
0.091
0.130
0.130
in.
103
Soldering Process
W - Pad Width L - Pad Length
1.60
2.00
2.90
3.70
6.90
5.50
6.80
mm
Packaging
Marking
K
0.063
0.079
0.146
0.272
0.217
0.268
0.114
in.
A
1.30
1.50
1.50
1.80
1.80
1.85
1.85
mm
R
0.051
0.059
0.059
0.071
0.071
0.073
0.073
in.
A
Change over Temperature Range
R – X7R (±15%) (-55°C +125°C)
C
Temperature Characteristic
Designated by Capacitance
Failure Rate Level
A = Not Applicable
End Metallization
C = 100% Sn Std.
A = 250V
Voltage