MAX3346EEUD+ Maxim Integrated Products, MAX3346EEUD+ Datasheet - Page 13

IC USB TXRX ESD PROTECT 14TSSOP

MAX3346EEUD+

Manufacturer Part Number
MAX3346EEUD+
Description
IC USB TXRX ESD PROTECT 14TSSOP
Manufacturer
Maxim Integrated Products
Type
Transceiverr
Datasheet

Specifications of MAX3346EEUD+

Number Of Drivers/receivers
1/1
Protocol
USB 2.0
Voltage - Supply
4 V ~ 5.5 V
Mounting Type
Surface Mount
Package / Case
14-TSSOP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
The IEC 1000-4-2 standard covers ESD testing and
performance of finished equipment; it does not specifi-
cally refer to integrated circuits. The MAX3346E helps
to design equipment that meets Level 2 of IEC 1000-4-
2, without the need for additional ESD-protection com-
ponents.
The major difference between tests done using the
Human Body Model and IEC 1000-4-2 is a higher peak
current in IEC 1000-4-2, because series resistance is
lower in the IEC 1000-4-2 model. Hence, the ESD with-
stand voltage measured to IEC 1000-4-2 is generally
lower than that measured using the Human Body Model.
Figure 7a shows the IEC 1000-4-2 model.
The Air-Gap Discharge test involves approaching the
device with a charged probe. The Contact Discharge
method connects the probe to the device before the
probe is energized.
The Machine Model for ESD tests all pins using a 200pF
storage capacitor and zero discharge resistance. Its
objective is to emulate the stress caused by contact that
occurs with handling and assembly during manufactur-
ing. Of course, all pins require this protection during
manufacturing, not just USB inputs and outputs.
Therefore, after PC board assembly, the Machine Model
is less relevant to I/O ports.
13
___________________________________________________________________________________________________
______________________________________________________________________________________
±15kV ESD-Protected USB Transceiver
Machine Model
IEC 1000-4-2
For the latest application details on UCSP construction,
dimensions, tape carrier information, printed circuit board
techniques, bump-pad layout, and recommended reflow
temperature profile as well as the latest information on
reliability testing results, go to the Maxim website at
www.maxim-ic.com/ucsp for the Application Note,
“UCSP—A Wafer-Level Chip-Scale Package.”
Figure 7a. IEC 1000-4-2 ESD Test Model
VOLTAGE
SOURCE
HIGH-
DC
UCSP Applications Information
CHARGE-CURRENT
LIMIT RESISTOR
50MΩ to 100MΩ
R
C
150pF
C s
STORAGE
CAPACITOR
RESISTANCE
DISCHARGE
330Ω
R
D
in UCSP
DEVICE
UNDER
TEST
13

Related parts for MAX3346EEUD+