PIC32MX440F512HT-80V/MR Microchip Technology, PIC32MX440F512HT-80V/MR Datasheet - Page 152

• Manufacturer Part Number: PIC32MX440F512HT-80V/MR
• Description: 512 KB Flash, 32 KB RAM, USB-OTG, 80 MHz, 10-Bit ADC, DMA 64 QFN 9x9x0.9mm T/R
• Manufacturer: Microchip Technology
• Series: PIC® 32MXr

Specifications of PIC32MX440F512HT-80V/MR

• Core Processor: MIPS32® M4K™
• Core Size: 32-Bit
• Speed: 80MHz
• Connectivity: I²C, IrDA, LIN, PMP, SPI, UART/USART, USB OTG
• Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
• Number Of I /o: 53
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Eeprom Size: -
• Ram Size: 32K x 8
• Voltage - Supply (vcc/vdd): 2.3 V ~ 3.6 V
• Data Converters: A/D 16x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C
• Package / Case: 64-VFQFN Exposed Pad
• Core: MIPS
• Processor Series: PIC32MX4xx
• Data Bus Width: 32 bit
• Maximum Clock Frequency: 80 MHz
• Data Ram Size: 32 KB
• Number Of Programmable I/os: 5
• Number Of Timers: 5
• Operating Supply Voltage: 2.3 V to 3.6 V
• Operating Temperature Range: - 40 C to + 105 C
• Mounting Style: SMD/SMT
• Interface Type: USB, I2C, UART, RS-232, RS-485, SPI
• Maximum Operating Temperature: + 105 C
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

PIC32MX3XX/4XX
29.1
TABLE 29-1:
TABLE 29-2:
TABLE 29-3:
TABLE 29-4:
DS61143H-page 152
DC5
DC5b
Note 1:
Industrial Temperature Devices
V-Temp Temperature Devices
Power Dissipation:
Internal Chip Power Dissipation:
I/O Pin Power Dissipation:
Maximum Allowed Power Dissipation
Package Thermal Resistance, 121-Pin XBGA (10x10x1.1 mm)
Package Thermal Resistance, 100-Pin TQFP (12x12x1 mm)
Package Thermal Resistance, 64-Pin TQFP (10x10x1 mm)
Package Thermal Resistance, 64-Pin QFN (9x9x0.9 mm)
Note 1:
DC CHARACTERISTICS
Operating Voltage
DC10
DC12
DC16
DC17
Note 1:
Characteristic
Param.
No.
Operating Junction Temperature Range
Operating Junction Temperature Range
DC Characteristics
P
I/O = S ({V
Operating Ambient Temperature Range
Operating Ambient Temperature Range
V
V
V
S
Symbol
INT
DD
DR
POR
VDD
40 MHz maximum for PIC32MX320F032H and PIC32MX420F032H devices.
Junction to ambient thermal resistance, Theta-
This is the limit to which V
= V
DD
OPERATING MIPS VS. VOLTAGE
THERMAL OPERATING CONDITIONS
THERMAL PACKAGING CHARACTERISTICS
DC TEMPERATURE AND VOLTAGE SPECIFICATIONS
DD
Supply Voltage
RAM Data Retention Voltage
(Note 1)
V
to Ensure Internal
Power-on Reset Signal
V
to Ensure Internal
Power-on Reset Signal
x (I
DD
DD
– V
V
DD
2.3V-3.6V
2.3V-3.6V
(in Volts)
Start Voltage
Rise Rate
DD
Characteristics
OH
– S I
Characteristics
Range
} x I
Rating
OH
OH
)
) + S (V
DD
can be lowered without losing RAM data.
OL
x I
OL
-40°C to +105°C
-40°C to +85°C
))
Temp. Range
Standard Operating Conditions: 2.3V to 3.6V
(unless otherwise stated)
Operating temperature
(in °C)
Min.
1.75
1.75
0.05
2.3
JA
(
θ
JA
) numbers are achieved by package simulations.
Typical
—
—
—
—
Symbol
Symbol Typical
P
DMAX
θ
θ
θ
θ
P
T
T
T
T
JA
JA
JA
JA
A
A
D
J
J
Max.
1.95
3.6
—
—
-40°C ≤ T
-40°C ≤ T
Min.
-40
-40
-40
-40
40
43
47
28
Units
V/ms
(T
PIC32MX3XX/4XX
V
V
V
© 2011 Microchip Technology Inc.
P
A
A
Max. Frequency
80 MHz (Note 1)
80 MHz (Note 1)
J
INT
Typical
≤ +85°C for Industrial
≤ +105°C for V-Temp
– T
Max.
—
—
—
—
—
—
—
—
+ P
A
)/θ
I
/
O
JA
Conditions
°C/W
°C/W
°C/W
°C/W
Max.
+125
+140
+105
Unit
+85
—
—
—
—
Notes
Unit
°C
°C
°C
°C
W
W
1
1
1
1