TJA1040T/N,518 NXP Semiconductors, TJA1040T/N,518 Datasheet - Page 14

• Manufacturer Part Number: TJA1040T/N,518
• Description: IC TXRX CAN 8BIT 5.25V SOT96-1
• Manufacturer: NXP Semiconductors
• Type: Transceiverr

Specifications of TJA1040T/N,518

• Number Of Drivers/receivers: 1/1
• Protocol: CAN
• Voltage - Supply: 4.75 V ~ 5.25 V
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (3.9mm Width)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 935277289518; TJA1040T/N-T; TJA1040T/N-T

Philips Semiconductors
Suitability of surface mount IC packages for wave and reflow soldering methods
Notes
1. For more detailed information on the BGA packages refer to the “(LF)BGA Application Note ” (AN01026); order a copy
2. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
3. These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no account
4. These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder
5. If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction.
6. Wave soldering is suitable for LQFP, TQFP and QFP packages with a pitch (e) larger than 0.8 mm; it is definitely not
7. Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger than
8. Hot bar or manual soldering is suitable for PMFP packages.
REVISION HISTORY
2003 Oct 14
BGA, LBGA, LFBGA, SQFP, SSOP-T
DHVQFN, HBCC, HBGA, HLQFP, HSQFP, HSOP, HTQFP,
HTSSOP, HVQFN, HVSON, SMS
PLCC
LQFP, QFP, TQFP
SSOP, TSSOP, VSO, VSSOP
PMFP
6
5
High speed CAN transceiver
REV
from your Philips Semiconductors sales office.
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods” .
be processed through more than one soldering cycle or subjected to infrared reflow soldering with peak temperature
exceeding 217 C
must be kept as low as possible.
cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side,
the solder might be deposited on the heatsink surface.
The package footprint must incorporate solder thieves downstream and at the side corners.
suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
(5)
(8)
, SO, SOJ
20031014
20030219
DATE
10 C measured in the atmosphere of the reflow oven. The package body peak temperature
200307014
PACKAGE
CPCN
(3)
(1)
, TFBGA, VFBGA
Product specification (9397 750 11837)
Modification:
Product specification (9397 750 10887)
Change ‘V
Add Chapter REVISION HISTORY
14
th(dif)
= 0.5 V’ in standby mode into ‘V
not suitable
not suitable
suitable
not recommended
not recommended
not suitable
DESCRIPTION
WAVE
(4)
SOLDERING METHOD
(5)(6)
(7)
suitable
suitable
suitable
suitable
suitable
not suitable
dif(th)
Product specification
REFLOW
= 0.4 V’
TJA1040
(2)