MCP23S17-E/SS Microchip Technology, MCP23S17-E/SS Datasheet - Page 34

• Manufacturer Part Number: MCP23S17-E/SS
• Description: IC I/O EXPANDER SPI 16B 28SSOP
• Manufacturer: Microchip Technology

Specifications of MCP23S17-E/SS

• Package / Case: 28-SSOP
• Interface: SPI
• Number Of I /o: 16
• Interrupt Output: Yes
• Frequency - Clock: 10MHz
• Voltage - Supply: 1.8 V ~ 5.5 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Logic Family: MCP23S17
• Propagation Delay Time: 50 ns
• Operating Supply Voltage: 1.8 V to 5.5 V
• Power Dissipation: 700 mW
• Operating Temperature Range: - 40 C to + 125 C
• Input Voltage: 1.8 V to 5.5 V
• Logic Type: I/O Expander
• Maximum Clock Frequency: 10 MHz
• Maximum Operating Frequency: 1.7 MHz
• Mounting Style: SMD/SMT
• Output Current: 25 mA
• Output Voltage: 1.8 V to 4.5 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: MCP23X17EV - BOARD EVAL FOR MCP23X17GPIODM-KPLCD - BOARD DEMO LCD GPIO EXP KEYPAD
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

MCP23017/MCP23S17
TABLE 2-3:
FIGURE 2-7:
DS21952B-page 34
SPI Interface AC Characteristics
Note 1:
Param
No.
10
12
13
14
11
9
SCL/SCK
Register
Loaded
SDA/SI
Output
Input
GPn
GPn
INT
Clock Low Time
Clock Delay Time
Clock Enable Time
Output Valid from Clock Low
Output Hold Time
Output Disable Time
Pin
Pin
Pin
This parameter is characterized, not 100% tested.
In
Characteristic
SPI INTERFACE AC CHARACTERISTICS (CONTINUED)
GPIO AND INT TIMING
D1
INT Pin Active
LSb of data byte zero
during a write or read
command, depending
on parameter
Operating Conditions (unless otherwise indicated):
1.8V ≤ V
4.5V ≤ V
Sym
T
T
T
T
T
T
CLD
CLE
DIS
HO
LO
V
D0
DD
DD
≤ 5.5V at -40°C ≤ T
≤ 5.5V at -40°C ≤ T
Min
90
45
45
50
50
—
—
—
—
0
51
50
Typ
—
—
—
—
—
—
—
—
—
—
Max
100
Inactive
90
45
45
—
—
—
—
—
—
A
A
≤ +85°C (I-Temp)
≤ +125°C (E-Temp) (Note 1)
53
52
Units
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
1.8V–5.5V (I-Temp)
2.7V–5.5V (I-Temp)
4.5V–5.5V (E-Temp)
1.8V–5.5V (I-Temp)
2.7V–5.5V (I-Temp)
4.5V–5.5V (E-Temp)
© 2007 Microchip Technology Inc.
Conditions