MCP23S17-E/SO Microchip Technology, MCP23S17-E/SO Datasheet - Page 40

• Manufacturer Part Number: MCP23S17-E/SO
• Description: IC I/O EXPANDER SPI 16B 28SOIC
• Manufacturer: Microchip Technology

Specifications of MCP23S17-E/SO

• Package / Case: 28-SOIC (7.5mm Width)
• Interface: SPI
• Number Of I /o: 16
• Interrupt Output: Yes
• Frequency - Clock: 10MHz
• Voltage - Supply: 1.8 V ~ 5.5 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Logic Family: MCP23S17
• Propagation Delay Time: 50 ns
• Operating Supply Voltage: 1.8 V to 5.5 V
• Power Dissipation: 700 mW
• Operating Temperature Range: - 40 C to + 125 C
• Input Voltage: 1.8 V to 5.5 V
• Logic Type: I/O Expander
• Maximum Clock Frequency: 10 MHz
• Maximum Operating Frequency: 1.7 MHz
• Mounting Style: SMD/SMT
• Output Current: 25 mA
• Output Voltage: 1.8 V to 4.5 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: MCP23X17EV - BOARD EVAL FOR MCP23X17GPIODM-KPLCD - BOARD DEMO LCD GPIO EXP KEYPAD
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

MCP23017/MCP23S17
28-Lead Plastic Small Outline (SO) – Wide, 7.50 mm Body [SOIC]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
DS21952B-page 40
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
NOTE 1
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
A
A1
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff §
Overall Width
Molded Package Width
Overall Length
Chamfer (optional)
Foot Length
Footprint
Foot Angle Top
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
N
1 2 3
b
D
Dimension Limits
e
Units
A2
E1
A2
A1
E1
L1
N
A
E
D
α
e
h
L
φ
c
b
β
α
E
2.05
0.10
0.25
0.40
0.18
0.31
MIN
φ
0°
5°
5°
–
L1
L
MILLMETERS
10.30 BSC
17.90 BSC
1.27 BSC
7.50 BSC
1.40 REF
h
NOM
28
–
–
–
–
–
–
–
–
–
–
Microchip Technology Drawing C04-052B
h
© 2007 Microchip Technology Inc.
MAX
2.65
0.30
0.75
1.27
0.33
0.51
15°
15°
8°
β
–
c