MLF2012DR68KT TDK Corporation, MLF2012DR68KT Datasheet
MLF2012DR68KT
Manufacturer Part Number
MLF2012DR68KT
Description
RF Inductors 0.68uH 10%
Manufacturer
TDK Corporation
Series
MLFr
Datasheet
1.MLF2012A1R5KT.pdf
(3 pages)
Specifications of MLF2012DR68KT
Inductance
680 nH
Tolerance
10 %
Maximum Dc Current
150 mAmps
Maximum Dc Resistance
0.8 Ohms
Self Resonant Frequency
105 MHz
Q Minimum
25
Operating Temperature Range
- 25 C to + 85 C
Termination Style
SMD/SMT
Package / Case
2012
Core Material
Ferrite
Dimensions
1.25 mm W x 2 mm L x 1.25 mm H
Shielding
Shielded
Lead Free Status / Rohs Status
Details
Other names
MLF2012DR68K
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MLF2012DR68KT000
Manufacturer:
TDK
Quantity:
40 000
SMD Inductors(Coils)
For Signal Line(Multilayer, Magnetic Shielded)
MLF Series MLF2012
FEATURES
• High-reliability monolithic structure.
• Ferrite core and magnetic shielding enables the design of com-
• Excellent solderability and high heat resistance permits either
• The products contain no lead and also support lead-free
• It is a product conforming to RoHS directive.
APPLICATIONS
Digital cellular phone, car audio, TV, personal computers, or vari-
ous electronic appliances.
SPECIFICATIONS
Operating temperature range
Storage temperature range
RECOMMENDED SOLDERING CONDITION
REFLOW SOLDERING
• Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific
• Please contact our Sales office when your application are considered the following:
• All specifications are subject to change without notice.
250 to 260˚C
230˚C
180˚C
150˚C
The device’s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.)
bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.
pact circuits with high packing density.
flow or reflow soldering.
soldering.
Preheating
60 to 120s
Time(s)
Soldering
30 to 60s
10s max.
–40 to +85°C
–40 to +85°C
Natural
cooling
PRODUCT IDENTIFICATION
(1) Series name
(2) Dimensions L× W
(3) Material code
(4) Inductance value
(5) Inductance tolerance
(6) Packaging style
PACKAGING STYLE AND QUANTITIES
Packaging style
Taping
HANDLING AND PRECAUTIONS
• Before soldering, be sure to preheat components.
• After mounting components onto the printed circuit board, do not
• The inductance value may change due to magnetic saturation if
• Do not expose the inductors to stray magnetic fields.
• Avoid static electricity discharge during handling.
• When hand soldering, apply the soldering iron to the printed cir-
MLF 2012 A 1R0 K
(1)
The preheating temperature should be set so that the tempera-
ture difference between the solder temperature and product
temperature does not exceed 150°C.
apply stress through board bending or mishandling.
the current exceeds the rated maximum.
cuit board only. Temperature of the iron tip should not exceed
350°C. Soldering time should not exceed 3 seconds.
2012
47N
R15
1R0
100
K
M
T
(2)
(3) (4) (5) (6)
Product’s thickness
0.85mm
1.25mm
T
006-01 / 20090910 / e511_mlf2012.fm
Taping [reel]
47nH[0.047μH]
0.15μH
1μH
10μH
±10%
±20%
2.0× 1.25mm
Conformity to RoHS Directive
Quantity
4000 pieces/reel
2000 pieces/reel
(1/3)
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