5591S 2.5MM 3M, 5591S 2.5MM Datasheet - Page 3

• Manufacturer Part Number: 5591S 2.5MM
• Description: THERMALLY CONDUCTIVE INTERFACE PAD
• Manufacturer: 3M

Specifications of 5591S 2.5MM

• Thermal Conductivity: 1W/m.K
• Breakdown Voltage Vbr: 200V
• Operating Temperature Range: -60°C To +125°C

3M
General Information
Product selection table for 3M™ Thermally Conductive Materials.
Application Ideas
• 3M™ Thermally Conductive Interface Thermal Pads are designed to provide a preferential heat-transfer path between
3M™ Thermally Conductive Tapes
3M™ Thermally Conductive Adhesives
3M™ Thermally Conductive Interface Pads
3M™ Thermally Conductive Interface Pads (silicone based)
3M™ Thermally Conductive Interface Pads (acrylic)
heat-generating and cooling devices (e.g., fans, heat pipes and heat sinks).
5516/5516S
5519/5519S
™
TC-2707
TC-2810
Product
9889FR
5590H
5591S
5592S
5595S
8805
8810
8815
8820
5592
5595
Thermally Conductive Interface Pads 5591 and 5591S
Thickness
0.5 to 2.0
0.5 to 2.0
0.5 to 2.0
1.0 to 2.0
0.5 to 2.0
1.0 to 2.0
0.5 to 2.0
0.5 to 1.5
0.127
0.375
(mm)
0.25
0.50
1.0
—
—
Bulk Thermal
Conductivity
(W/m-K)
1.0 - 1.4
0.7
0.6
0.5
3.1
4.1
1.0
1.1
1.6
3.0
—
—
Applications requiring thin bonding with good thermal transfer; CPU, flex
circuit and power transformer bonding to heat sinks and other cooling
devices. Superior tack and wetting properties.
Applications requiring gap filling and bonding with good thermal transfer;
IC packages and PCB bonding to heat sinks, metal cases and other cooling
devices.
Applications requiring high adhesive strength, good surface wetting, gap
filling and good thermal transfer. IC package and PCB thermal interfacing
with heat sinks or other cooling devices.
Applications requiring gap filling and superior thermal performance without
bonding. IC package and PCB thermal interfacing with heat sinks or other
cooling devices and metal cases.
Applications requiring gap filling and superior thermal performance without
bonding. IC package and PCB thermal interfacing with heat sinks or other
cooling devices and metal cases.
Applications requiring gap filling and superior thermal performance without
bonding. IC package and PCB thermal interfacing with heat sinks or other
cooling devices and metal cases.
(3)
Typical Applications