S29GL032M10TAIR10 AMD (ADVANCED MICRO DEVICES), S29GL032M10TAIR10 Datasheet - Page 19

• Manufacturer Part Number: S29GL032M10TAIR10
• Manufacturer: AMD (ADVANCED MICRO DEVICES)

Specifications of S29GL032M10TAIR10

• Lead Free Status / Rohs Status: Not Compliant

Notes:
1.
2.
3.
4.
5.
6.
February 7, 2007 S29GL-M_00_B8
S29GL032M
Type 0 is standard. Specify others as required: TSOPs can be packed in Types 0 and 3; BGAs can be packed in Types 0, 2, or 3.
This package is recommended for new designs using TSOPs.
TSOP package marking omits packing type designator from the ordering part number.
BGA package marking omits leading “S29” and packing type designator from the ordering part number.
100% Matte Sn is used for Pb-free TSOP plating.
SnBi is used for Pb-free TSOP plating.
Number
Device
Valid Combinations list configurations planned to be supported in volume for this device. Consult your local sales office to
confirm availability of specific valid combinations and to check on newly released combinations.
90, 10, 11
Option
Speed
90
S29GL032M Valid Combinations
& Temperature Range
Package, Material,
Table 1. S29GL032M Ordering Options
D a t a
BAC,BFC
BAC,BFC
TAC,TFC
TAC,TFC
FAC,FFC
TAC,TFC
FAC,FFC
BAI,BFI
BAI,BFI
TBI,TCI
TAI,TFI
TAI,TFI
TAI,TFI
FAI,FFI
FAI,FFI
S29GL-M MirrorBit
Valid Combinations
S h e e t
TM
Number
Flash Family
R1,R2
R3,R4
R1,R2
R3,R4
Model
R0
R0
(Note
Packing
0,2,3
Type
1)
TS040 (2, 3, 5)
FBC048 (4)
TS056 (2, 3, 5)
LAA064 (4)
TS048 (2, 3, 5)
FBC048 (4)
LAA064 (4)
TS040 (2, 3, 5)
FBC048 (4)
TS056 (2, 3, 5)
LAA064 (4)
TS048 (2, 3, 5)
FBC048 (4)
LAA064 (4)
FPT-48P-M19 (3, 6)
Package Description
(Notes)
TSOP
Fine-Pitch BGA
TSOP
Fortified BGA
TSOP
Fine-Pitch BGA
Fortified BGA
TSOP
Fine-Pitch BGA
TSOP
Fortified BGA
TSOP
Fine-Pitch BGA
Fortified BGA
TSOP
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