AT28C256E-20TI

Manufacturer Part NumberAT28C256E-20TI
ManufacturerAtmel
AT28C256E-20TI datasheet
 

Specifications of AT28C256E-20TI

Density256KbInterface TypeParallel
Organization32Kx8Access Time (max)200ns
Write ProtectionYesData Retention10Year
Operating Supply Voltage (typ)5VPackage TypeTSOP-I
Operating Temp Range-40C to 85CSupply Current50mA
Operating Supply Voltage (min)4.5VOperating Supply Voltage (max)5.5V
Operating Temperature ClassificationIndustrialMountingSurface Mount
Pin Count28Lead Free Status / Rohs StatusNot Compliant
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Features
Fast Read Access Time – 150 ns
Automatic Page Write Operation
– Internal Address and Data Latches for 64 Bytes
– Internal Control Timer
Fast Write Cycle Times
– Page Write Cycle Time: 3 ms or 10 ms Maximum
– 1 to 64-byte Page Write Operation
Low Power Dissipation
– 50 mA Active Current
– 200 µA CMOS Standby Current
Hardware and Software Data Protection
DATA Polling for End of Write Detection
High Reliability CMOS Technology
4
5
– Endurance: 10
or 10
Cycles
– Data Retention: 10 Years
Single 5V ± 10% Supply
CMOS and TTL Compatible Inputs and Outputs
JEDEC Approved Byte-wide Pinout
Full Military and Industrial Temperature Ranges
Green (Pb/Halide-free) Packaging Option
1. Description
The AT28C256 is a high-performance electrically erasable and programmable read-
only memory. Its 256K of memory is organized as 32,768 words by 8 bits. Manufac-
tured with Atmel’s advanced nonvolatile CMOS technology, the device offers access
times to 150 ns with power dissipation of just 440 mW. When the device is deselected,
the CMOS standby current is less than 200 µA.
The AT28C256 is accessed like a Static RAM for the read or write cycle without the
need for external components. The device contains a 64-byte page register to allow
writing of up to 64 bytes simultaneously. During a write cycle, the addresses and 1 to
64 bytes of data are internally latched, freeing the address and data bus for other
operations. Following the initiation of a write cycle, the device will automatically write
the latched data using an internal control timer. The end of a write cycle can be
detected by DATA Polling of I/O7. Once the end of a write cycle has been detected a
new access for a read or write can begin.
Atmel’s AT28C256 has additional features to ensure high quality and manufacturabil-
ity. The device utilizes internal error correction for extended endurance and improved
data retention characteristics. An optional software data protection mechanism is
available to guard against inadvertent writes. The device also includes an extra
64 bytes of EEPROM for device identification or tracking.
256K (32K x 8)
Paged Parallel
EEPROM
AT28C256
0006K–PEEPR–01/08

AT28C256E-20TI Summary of contents

  • Page 1

    ... DATA Polling of I/O7. Once the end of a write cycle has been detected a new access for a read or write can begin. Atmel’s AT28C256 has additional features to ensure high quality and manufacturabil- ity. The device utilizes internal error correction for extended endurance and improved data retention characteristics ...

  • Page 2

    Pin Configurations Pin Name A0 - A14 I/ 2.1 28-lead TSOP Top View OE 1 A11 A13 VCC 7 A14 8 A12 9 A7 ...

  • Page 3

    Block Diagram 4. Device Operation 4.1 Read The AT28C256 is accessed like a Static RAM. When CE and OE are low and WE is high, the data stored at the memory location determined by the address pins is asserted ...

  • Page 4

    ... A software controlled data protection feature has been implemented on the AT28C256. When enabled, the software data protection (SDP), will prevent inadvertent writes. The SDP feature may be enabled or disabled by the user; the AT28C256 is shipped from Atmel with SDP disabled. SDP is enabled by the host system issuing a series of three write commands; three specific bytes of data are written to three specific addresses (refer to “ ...

  • Page 5

    DC and AC Operating Range Ind. Operating Temperature (Case) Mil. V Power Supply CC 6. Operating Modes Mode Read (2) Write Standby/Write Inhibit Write Inhibit Write Inhibit Output Disable Chip Erase Notes can ...

  • Page 6

    AC Read Characteristics Symbol Parameter t Address to Output Delay ACC ( Output Delay CE ( Output Delay OE (3)( Output Float DF Output Hold from OE, CE ...

  • Page 7

    Input Test Waveforms and Measurement Level 12. Output Test Load 13. Pin Capacitance ( MHz 25°C Symbol Typ OUT Note: 1. This parameter is characterized and is not 100% ...

  • Page 8

    AC Write Characteristics Symbol Parameter Address, OE Setup Time AS OES t Address Hold Time AH t Chip Select Setup Time CS t Chip Select Hold Time CH t Write Pulse Width (WE or CE) WP ...

  • Page 9

    Page Mode Characteristics Symbol Parameter t Write Cycle Time (option available Address Setup Time AS t Address Hold Time AH t Data Setup Time DS t Data Hold Time DH t Write Pulse Width WP t Byte ...

  • Page 10

    Software Data Protection (1) Enable Algorithm LOAD DATA AA TO ADDRESS 5555 LOAD DATA 55 TO ADDRESS 2AAA LOAD DATA A0 TO ADDRESS 5555 WRITES ENABLED LOAD DATA XX TO (4) ANY ADDRESS LOAD LAST BYTE TO LAST ADDRESS ...

  • Page 11

    Data Polling Characteristics Symbol Parameter t Data Hold Time Hold Time OEH ( Output Delay OE t Write Recovery Time WR Notes: 1. These parameters are characterized and not 100% tested. 2. See“AC ...

  • Page 12

    Normalized I Graphs CC AT28C256 12 0006K–PEEPR–01/08 ...

  • Page 13

    Ordering Information 27.1 Standard Package I (mA ACC (ns) Active Standby 150 50 0.2 0.3 200 50 0.3 250 50 0.3 28D6 28-lead, 0.600" Wide, Non-windowed, Ceramic Dual Inline Package (Cerdip) 28F 28-lead, Non-windowed, Ceramic Bottom-brazed Flat ...

  • Page 14

    Standard Package (Continued) I (mA ACC (ns) Active Standby (3) 150 50 0.3 28D6 28-lead, 0.600" Wide, Non-windowed, Ceramic Dual Inline Package (Cerdip) 28F 28-lead, Non-windowed, Ceramic Bottom-brazed Flat Package (Flatpack) 32J 32-lead, Plastic J-leaded Chip Carrier ...

  • Page 15

    Standard Package (Continued) I (mA ACC (ns) Active Standby (3) 150 50 0.3 (3) 200 50 0.3 50 0.3 (3) 250 50 0.3 28D6 28-lead, 0.600" Wide, Non-windowed, Ceramic Dual Inline Package (Cerdip) 28F 28-lead, Non-windowed, Ceramic ...

  • Page 16

    ... Electrical specifications for these speeds are defined by Standard Microcircuit Drawing 5962-88525. 2. See “Valid Part Numbers” on page 3. SMD specifies Software Data Protection feature for device type, although Atmel product supplied to every device type in the SMD is 100% tested for this feature. 28D6 28-lead, 0.600" ...

  • Page 17

    Green Package Option (Pb/Halide-free) I (mA ACC (ns) Active Standby 150 50 0.2 32J 32-lead, Plastic J-leaded Chip Carrier (PLCC) 28P6 28-lead, 0.600" Wide, Plastic Dual Inline Package (PDIP) 28S 28-lead, 0.300" Wide, Plastic Gull Wing Small ...

  • Page 18

    ... AT28C256F 15 AT28C256 20 AT28C256E 20 AT28C256F 20 AT28C256 25 AT28C256E 25 AT28C256F 25 29. Die Products Reference Section: Parallel EEPROM Die Products AT28C256 18 Package and Temperature Combinations JI, JU, PI, PU, SI, SU, TI, TU, DM/883, FM/883, LM/883, UM/883 JI, JU, PI, PU, SI, SU, TI, TU, DM/883, FM/883, LM/883, UM/883 JI, JU, PI, PU, SI, SU, TI, TU, DM/883, FM/883, LM/883, UM/883 ...

  • Page 19

    Packaging Information 29.1 28D6 – Cerdip Dimensions in Millimeters and (Inches). Controlling dimension: Inches. MIL-STD 1835 D-10 Config A (Glass Sealed) 5.72(0.225) MAX SEATING PLANE 5.08(0.200) 3.18(0.125) 2.54(0.100)BSC 0.46(0.018) 0.20(0.008) 2325 Orchard Parkway San Jose, CA 95131 R 0006K–PEEPR–01/08 37.85(1.490) ...

  • Page 20

    Flatpack Dimensions in Millimeters and (Inches). Controlling dimension: Inches. MIL-STD 1835 F-12 Config B PIN #1 ID 18.49(0.728) 18.08(0.712) 10.57(0.416) 0.23(0.009) 0.10(0.004) 2325 Orchard Parkway San Jose, CA 95131 R AT28C256 20 9.75(0.384) 1.96(0.077) 1.09(0.043) 7.26(0.286) 6.96(0.274) ...

  • Page 21

    PLCC 1.14(0.045) X 45˚ 0.51(0.020)MAX 45˚ MAX (3X) Notes: 1. This package conforms to JEDEC reference MS-016, Variation AE. 2. Dimensions D1 and E1 do not include mold protrusion. Allowable protrusion is .010"(0.254 mm) per ...

  • Page 22

    LCC Dimensions in Millimeters and (Inches). Controlling dimension: Inches. MIL-STD 1835 C-12 14.22(0.560) 13.72(0.540) 10.16(0.400) BSC 1.27(0.050) TYP 2325 Orchard Parkway San Jose, CA 95131 R AT28C256 22 11.63(0.458) 11.23(0.442) PIN 1 1.40(0.055) 1.14(0.045) 2.41(0.095) 1.91(0.075) 0.305(0.012) ...

  • Page 23

    PDIP A SEATING PLANE Notes: 1. This package conforms to JEDEC reference MS-011, Variation AB. 2. Dimensions D and E1 do not include mold Flash or Protrusion. Mold Flash or Protrusion shall not exceed ...

  • Page 24

    SOIC Dimensions in Millimeters and (Inches). Controlling dimension: Millimeters. 2325 Orchard Parkway San Jose, CA 95131 R AT28C256 24 0.51(0.020) 0.33(0.013) 7.60(0.2992) 7.40(0.2914) PIN 1 1.27(0.50) BSC TOP VIEW 18.10(0.7125) 17.70(0.6969) 0.30(0.0118) 0.10(0.0040) 0º ~ 8º 1.27(0.050) ...

  • Page 25

    TSOP Pin 1 Identifier Area e E Notes: 1. This package conforms to JEDEC reference MO-183. 2. Dimensions D1 and E do not include mold protrusion. Allowable protrusion 0.15 mm per side and on ...

  • Page 26

    PGA Dimensions in Millimeters and (Inches). Controlling dimension: Inches. 16.71(0.658) 16.31(0.642) 2325 Orchard Parkway San Jose, CA 95131 R AT28C256 26 13.74(0.540) 2.57(0.101) 13.36(0.526) 2.06(0.081) 15.24(0.600) 14.88(0.586) 14.17(0.558) 13.77(0.542) 2.54(0.100) TYP 12.70(0.500) TYP 2.54(0.100) TYP 10.41(0.410) 9.91(0.390) ...

  • Page 27

    ... Disclaimer: The information in this document is provided in connection with Atmel products. No license, express or implied, by estoppel or otherwise, to any intellectual property right is granted by this document or in connection with the sale of Atmel products. EXCEPT AS SET FORTH IN ATMEL’S TERMS AND CONDI- TIONS OF SALE LOCATED ON ATMEL’S WEB SITE, ATMEL ASSUMES NO LIABILITY WHATSOEVER AND DISCLAIMS ANY EXPRESS, IMPLIED OR STATUTORY WARRANTY RELATING TO ITS PRODUCTS INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTY OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, OR NON-INFRINGEMENT ...