AM29LV033C-120EI AMD (ADVANCED MICRO DEVICES), AM29LV033C-120EI Datasheet

AM29LV033C-120EI

Manufacturer Part Number

AM29LV033C-120EI

Description

Manufacturer

AMD (ADVANCED MICRO DEVICES)

Datasheet

1.AM29LV033C-120EI.pdf (13 pages)

Specifications of AM29LV033C-120EI

Cell Type

NOR

Density

32Mb

Access Time (max)

90ns

Interface Type

Parallel

Boot Type

Top

Address Bus

22/21Bit

Operating Supply Voltage (typ)

3/3.3V

Operating Temp Range

-40C to 85C

Package Type

TSOP

Program/erase Volt (typ)

Sync/async

Asynchronous

Operating Temperature Classification

Industrial

Operating Supply Voltage (min)

2.7V

Operating Supply Voltage (max)

3.6V

Word Size

8/16Bit

Number Of Words

4M/2M

Supply Current

35mA

Mounting

Surface Mount

Pin Count

Lead Free Status / Rohs Status

Not Compliant

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General Description

Distinctive Characteristics

S29AL032D Known Good Die

16 Megabit (2 M x 8-Bit/1 M x 16-Bit)

CMOS 3.0 Volt-only, Boot Sector Flash Memory

Supplement

Single power supply operation

– 2.7 to 3.6 V for read, program, and erase operations

Manufactured on 200 µm process technology

High performance

– Access times as fast as 90 ns

Ultra low power consumption (typical values at 5 MHz)

– 200 nA Automatic Sleep mode current

– 200 nA standby mode current

– 9mA read current

– 20 mA program/erase current

Flexible sector architecture

– Eight 8 Kbyte, sixty-three 64 Kbyte; top or bottom boot block

– Supports full chip erase

Sector Protection

– A hardware method of locking a sector to prevent any program or

– Sectors can be locked in-system or via programming equipment

– Temporary Sector Unprotect feature allows code changes in

Unlock Bypass Program Command

– Reduces overall programming time when issuing multiple program

configurations available

erase operations within that sector

previously locked sectors

command sequences

The S29AL032D in Known Good Die (KGD) form is 32 Mbit, 3.0 volt-only Flash memory. Spansion defines

KGD as standard product in die form, tested for functionality and speed. Spansion KGD products have the

same reliability and quality as Spansion products in packaged form.

Publication Number S29AL032D_KGD_SP

Revision 02

Embedded Algorithms

– Embedded Erase algorithm automatically preprograms and erases

– Embedded Program algorithm automatically writes and verifies data

Compatibility with JEDEC standards

– Pinout and software compatible with single-power supply Flash

– Superior inadvertent write protection

CFI (Common Flash Interface) compliant

– Provides device-specific information to the system, allowing host

Data# Polling and toggle bits

– Provides a software method of detecting program or erase operation

Ready/Busy# pin (RY/BY#)

– Provides a hardware method of detecting program or erase cycle

Erase Suspend/Erase Resume

– Suspends an erase operation to read data from, or program data to,

Hardware reset pin (RESET#)

– Hardware method to reset the device to reading array data

20-year typical data retention

1,000,000 cycle typical endurance per sector

Tested to data sheet specifications at temperature

Quality and reliability levels equivalent to standard packaged

components

the entire chip or any combination of designated sectors

at specified addresses

software to easily reconfigure for different Flash devices

completion

a sector that is not being erased, then resumes the erase operation

Issue Date July 18, 2007

Related parts for AM29LV033C-120EI

AM29LV033C-120EI Summary of contents

Page 1

... Supplement General Description The S29AL032D in Known Good Die (KGD) form is 32 Mbit, 3.0 volt-only Flash memory. Spansion defines KGD as standard product in die form, tested for functionality and speed. Spansion KGD products have the same reliability and quality as Spansion products in packaged form. ...

Page 2

... S29AL032D Features The S29AL032D Mbit, 3.0 volt-only Flash memory organized as 4,194,304 bytes or 2,097,152 words. The word-wide data (x16) appears on DQ15–DQ0; the byte-wide (x8) data appears on DQ7–DQ0. To eliminate bus contention, the device has separate chip enable (CE#), write enable (WE#) and output enable (OE#) controls. ...

Page 3

Table of Contents General Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...

Page 4

Electrical Specifications Refer to the S29AL032D data sheet, publication number S29AL032D_00, for full electrical specifications on the S29AL032D in KGD form. Family Part Number Speed Option (V = 2.7 – 3 Max Access Time, t (ns) ACC ...

Page 5

Pad Description 3.1 Pad Relative to Die Center See pad description relative to die center in Pad Center (mils) Pad No. Signal A15 71.057 151.857 2 A14 65.954 151.857 3 A13 60.852 151.857 4 A12 55.750 ...

Page 6

Pads Relative to V See pad description relative to V Pad Center (mils) Pad No. Signal A15 66.643 303.487 2 A14 61.540 303.487 3 A13 56.438 303.487 4 A12 51.336 303.487 5 A11 46.233 303.487 6 ...

Page 7

... D = Die with KGD test flow W = Wafer with KGD test flow SPEED OPTION Access Speed DEVICE NUMBER/DESCRIPTION S29AL032D 32 Megabit Flash Memory manufactured using 200 nm process technology 3.0 Volt-only Read, Program, and Erase S29AL032D Valid Combinations Package Type, and Temperature Range WHI, WHV, 90 ...

Page 8

Packaging Information 5.1 Surftape Packaging Direction of Feed 5.2 Waffle Pack Packaging Orientation relative to top left corner of Waffle Pack cavity plate S29AL032D Known Good Die Orientation ...

Page 9

Product Test Flow Figure 6.1 provides an overview of Spansion’s Known Good Die test flow. For more detailed information, refer to the S29AL032D product qualification database supplement for KGD. Spansion implements quality assurance procedures throughout the product test flow. ...

Page 10

Physical Specifications Description Die dimensions Die Thickness Bond Pad Size Pad Area Free of Passivation Pads Per Die Bond Pad Metalization Die Backside Passivation 8. DC Operating Conditions Description V (Supply Voltage) CC Operating Temperature 9. Manufacturing Information Description ...

Page 11

Terms and Conditions of Sale for Spansion Non-Volatile Memory Die All transactions relating to unpackaged die under this agreement shall be subject to Spansion’s standard terms and conditions of sale, or any revisions thereof, which revisions Spansion reserves the ...

Page 12

Revision History Section Revision 01 (December 20, 2006) Global Initial release. Revision 02 (July 18, 2007) Packaging Information Removed references to Gel-Pak, replaced die photo Valid Combinations Table Modified table ...

Page 13

Colophon The products described in this document are designed, developed and manufactured as contemplated for general use, including without limitation, ordinary industrial use, general office use, personal use, and household use, but are not designed, developed and manufactured as contemplated ...

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