M24C16-MN6T STMicroelectronics, M24C16-MN6T Datasheet

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M24C16-MN6T

Manufacturer Part Number
M24C16-MN6T
Description
EEPROM Serial-I2C 16K-Bit 2K x 8 5V 8-Pin SO N T/R
Manufacturer
STMicroelectronics
Datasheet

Specifications of M24C16-MN6T

Package
8SO N
Interface Type
Serial-I2C
Density
16 Kb
Maximum Operating Frequency
0.4 MHz
Maximum Random Access Time
900 ns
Typical Operating Supply Voltage
5 V
Organization
2Kx8
Data Retention
40(Min) Year
Hardware Data Protection
Yes
Operating Temperature
-40 to 85 °C

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Part Number:
M24C16-MN6T
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M24C16-MN6T
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M24C16-MN6TP
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FEATURES SUMMARY
March 2004
Two Wire I
Supports 400kHz Protocol
Single Supply Voltage:
Write Control Input
BYTE and PAGE WRITE (up to 16 Bytes)
RANDOM and SEQUENTIAL READ Modes
Self-Timed Programming Cycle
Automatic Address Incrementing
Enhanced ESD/Latch-Up Behavior
More than 1 Million Erase/Write Cycles
More than 40 Year Data Retention
16Kbit, 8Kbit, 4Kbit, 2Kbit and 1Kbit Serial I²C Bus EEPROM
4.5 to 5.5V for M24Cxx
2.5 to 5.5V for M24Cxx-W
1.8 to 5.5V for M24Cxx-R
2
C Serial Interface
M24C04, M24C02, M24C01
Figure 1. Packages
M24C16, M24C08
3x3mm² body size (MSOP)
UFDFPN8 (MB)
TSSOP8 (DS)
TSSOP8 (DW)
2x3mm² (MLP)
8
150 mil width
169 mil width
8
PDIP8 (BN)
SO8 (MN)
1
1
1/29

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M24C16-MN6T Summary of contents

Page 1

... BYTE and PAGE WRITE ( Bytes) RANDOM and SEQUENTIAL READ Modes Self-Timed Programming Cycle Automatic Address Incrementing Enhanced ESD/Latch-Up Behavior More than 1 Million Erase/Write Cycles More than 40 Year Data Retention March 2004 M24C16, M24C08 M24C04, M24C02, M24C01 Figure 1. Packages 8 PDIP8 (BN) 8 SO8 (MN) 150 mil width ...

Page 2

... M24C16, M24C08, M24C04, M24C02, M24C01 TABLE OF CONTENTS FEATURES SUMMARY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Figure 1. Packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 SUMMARY DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Figure 2. Logic Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Table 1. Signal Names . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Power On Reset: VCC Lock-Out Write Protect . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Figure 3. DIP, SO, TSSOP and MLP Connections (Top View SIGNAL DESCRIPTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Serial Clock (SCL Serial Data (SDA Chip Enable (E0, E1, E2) ...

Page 3

... Table 22. TSSOP8 3x3mm² – 8 lead Thin Shrink Small Outline, 3x3mm² body size, Mechanical Data 25 PART NUMBERING . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 Table 23. Ordering Information Scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 Table 24. How to Identify Current and New Products by the Process Identification Letter . . . . . . . 27 REVISION HISTORY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 Table 25. Document Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 M24C16, M24C08, M24C04, M24C02, M24C01 3/29 ...

Page 4

... M24C16, M24C08, M24C04, M24C02, M24C01 SUMMARY DESCRIPTION 2 These I C-compatible electrically erasable pro- grammable memory (EEPROM) devices are orga- nized as 2048/1024/512/256/128 x 8 (M24C16, M24C08, M24C04, M24C02, M24C01). Figure 2. Logic Diagram E0-E2 M24Cxx SCL uses a two wire serial interface, comprising a bi-directional data line and a clock line. The devic- ...

Page 5

... M24C16, M24C08, M24C04, M24C02, M24C01 rial Data (SDA the value of the pull-up resistor can be calculated). Chip Enable (E0, E1, E2). These input signals are used to set the value that looked for on the three least significant bits (b3, b2, b1) of the 7- bit Device Select Code. These inputs must be tied ...

Page 6

... M24C16, M24C08, M24C04, M24C02, M24C01 2 Figure Bus Protocol SCL SDA START Condition SCL MSB SDA START Condition 1 SCL MSB SDA Table 2. Device Select Code b7 M24C01 Select Code 1 M24C02 Select Code 1 M24C04 Select Code 1 M24C08 Select Code 1 M24C16 Select Code 1 Note: 1. The most significant bit, b7, is sent first. ...

Page 7

... E2 is not available for devices that need to use address line A10 (see details). Using the E0, E1 and E2 inputs eight M24C02 (or M24C01), four M24C04, two M24C08 or one M24C16 devices can be connect one I cases, this gives a total memory capacity of 16 Kbits, 2 KBytes (except where M24C01 devic- es are used) ...

Page 8

... M24C16, M24C08, M24C04, M24C02, M24C01 Figure 6. Write Mode Sequences with WC=1 (data write inhibited) WC Byte Write WC Page Write WC (cont'd) Page Write (cont'd) Write Operations Following a Start condition the bus master sends a Device Select Code with the RW bit reset to 0. The device acknowledges this, as shown in 7 ...

Page 9

... Figure 7. Write Mode Sequences with WC=0 (data write enabled) WC BYTE WRITE WC PAGE WRITE WC (cont'd) PAGE WRITE (cont'd) M24C16, M24C08, M24C04, M24C02, M24C01 byte address counter (the 4 least significant ad- dress bits only) is incremented. The transfer is ter- minated by the bus master generating a Stop condition. ACK ACK DEV SEL ...

Page 10

... M24C16, M24C08, M24C04, M24C02, M24C01 Figure 8. Write Cycle Polling Flowchart using ACK First byte of instruction with already decoded by the device NO ReSTART STOP Minimizing System Delays by Polling On ACK During the internal Write cycle, the device discon- nects itself from the bus, and writes a copy of the data from its internal latches to the memory cells ...

Page 11

... Start condition, and repeats the Device Select Code, with the RW bit set to 1. The device acknowledges this, and out- puts the contents of the addressed byte. The bus M24C16, M24C08, M24C04, M24C02, M24C01 ACK NO ACK DEV SEL ...

Page 12

... M24C16, M24C08, M24C04, M24C02, M24C01 Sequential Read This operation can be used after a Current Ad- dress Read or a Random Address Read. The bus master does acknowledge the data byte output, and sends additional clock pulses so that the de- vice continues to output the next byte in sequence. ...

Page 13

... Note: 1. Compliant with JEDEC Std J-STD-020B (for small body, Sn- assembly), the ST ECOPACK the European directive on Restrictions on Hazardous Substances (RoHS) 2002/95/EU 2. JEDEC Std JESD22-A114A (C1=100 pF, R1=1500 M24C16, M24C08, M24C04, M24C02, M24C01 plied. Exposure to Absolute Maximum Rating con- ditions for extended periods may affect device reliability ...

Page 14

... M24C16, M24C08, M24C04, M24C02, M24C01 DC AND AC PARAMETERS This section summarizes the operating and mea- surement conditions, and the DC and AC charac- teristics of the device. The parameters in the DC and AC Characteristic tables that follow are de- rived from tests performed under the Measure- Table 5. Operating Conditions (M24Cxx) ...

Page 15

... Input High Voltage V IH (E2, E1, E0, SCL, SDA, WC) V Output Low Voltage OL Note: 1. This range is Not for New Design, and will soon be replaced by the M24Cxx-Wxx6 range. M24C16, M24C08, M24C04, M24C02, M24C01 Parameter Input Levels Timing Reference Levels 0.8V CC 0.2V CC 1,2 Test Condition V < ...

Page 16

... M24C16, M24C08, M24C04, M24C02, M24C01 Table 11. DC Characteristics (M24Cxx, Device Grade 3) Symbol Parameter Input Leakage Current I LI (SCL, SDA) I Output Leakage Current LO I Supply Current CC I Stand-by Supply Current CC1 Input Low Voltage (E2, E1, E0, SCL, SDA Input Low Voltage (WC) Input High Voltage ...

Page 17

... Supply Current CC I Stand-by Supply Current CC1 Input Low Voltage (E2, E1, E0, SCL, SDA Input Low Voltage (WC) Input High Voltage V IH (E2, E1, E0, SCL, SDA, WC) V Output Low Voltage OL M24C16, M24C08, M24C04, M24C02, M24C01 Test Condition (in addition to those in Table SDA in Hi-Z OUT SS CC ...

Page 18

... M24C16, M24C08, M24C04, M24C02, M24C01 Table 15. AC Characteristics (M24Cxx, Device Grade 6) Test conditions specified in Symbol Alt Clock Frequency C SCL t t Clock Pulse Width High CHCL HIGH t t Clock Pulse Width Low CLCH LOW 2 t SDA Fall Time t F DL1DL2 t t Data In Set Up Time ...

Page 19

... To avoid spurious START and STOP conditions, a minimum delay is placed between SCL=1 and the falling or rising edge of SDA. 4. 100kHz clock frequency is offered on the standard device. 400kHz clock frequency is offered on new products bearing the Process Identification letter “W” or “G” on the package, as described in M24C16, M24C08, M24C04, M24C02, M24C01 Table 8. Parameter Min ...

Page 20

... M24C16, M24C08, M24C04, M24C02, M24C01 Figure 11. AC Waveforms tCHCL SCL tDLCL SDA In tCHDX START Condition SCL SDA In tCHDH STOP Condition SCL tCLQV SDA Out 20/29 tCLCH tCLDX tDXCX SDA Change SDA Input tW Write Cycle tCLQX Data Valid tCHDH tDHDL STOP START ...

Page 21

... Table 18. PDIP8 – 8 pin Plastic DIP, 0.25mm lead frame, Package Mechanical Data Symb. Typ 3.30 b 0.46 b2 1.52 c 0.25 D 9.27 E 7.87 E1 6.35 e 2. 3.30 M24C16, M24C08, M24C04, M24C02, M24C01 Min. Max. 5.33 0.38 2.92 4.95 0.36 0.56 1.14 1.78 0.20 0.36 9.02 10 ...

Page 22

... M24C16, M24C08, M24C04, M24C02, M24C01 Figure 13. SO8 narrow – 8 lead Plastic Small Outline, 150 mils body width, Package Outline SO-a Note: Drawing is not to scale. Table 19. SO8 narrow – 8 lead Plastic Small Outline, 150 mils body width, Package Mechanical Data Symb. Typ. ...

Page 23

... Table 20. UFDFPN8 (MLP8) 8-lead Ultra thin Fine pitch Dual Flat Package No lead 2x3mm², Data Symbol Typ 0.25 D 2.00 D2 ddd E 3. 0. M24C16, M24C08, M24C04, M24C02, M24C01 D L3 ddd mm Min. Max. 0.50 0.60 0.022 0.00 0.05 0.20 0.30 0.010 0.079 1.55 1.65 0.05 0.118 0.15 0.25 – ...

Page 24

... M24C16, M24C08, M24C04, M24C02, M24C01 Figure 15. TSSOP8 – 8 lead Thin Shrink Small Outline, Package Outline A CP Note: Drawing is not to scale. Table 21. TSSOP8 – 8 lead Thin Shrink Small Outline, Package Mechanical Data Symbol Typ 1.000 3.000 e 0.650 E 6.400 E1 4.400 L 0.600 L1 1.000 24/29 ...

Page 25

... Table 22. TSSOP8 3x3mm² – 8 lead Thin Shrink Small Outline, 3x3mm² body size, Mechanical Data Symbol Typ 0.850 3.000 E 4.900 E1 3.000 e 0.650 CP L 0.550 L1 0.950 M24C16, M24C08, M24C04, M24C02, M24C01 Min. Max. 1.100 0.050 0.150 0.750 0.950 0.250 0.400 0.130 ...

Page 26

... M24C16, M24C08, M24C04, M24C02, M24C01 PART NUMBERING Table 23. Ordering Information Scheme Example: Device Type 2 M24 = I C serial access EEPROM Device Function Kbit (2048 Kbit (1024 Kbit (512 Kbit (256 Kbit (128 x 8) Operating Voltage 4 blank = V = 4.5 to 5.5V (400kHz 2.5 to 5.5V (400kHz) ...

Page 27

... Note: 1. This example comes from the S08 package. Other packages have similar information. For further information, please ask your ST Sales Office for Process Change Notices PCN MPG/EE/0061 and 0062 (PCEE0061 and PCEE0062). M24C16, M24C08, M24C04, M24C02, M24C01 device, please contact your nearest ST Sales Of- fice ...

Page 28

... M24C16, M24C08, M24C04, M24C02, M24C01 REVISION HISTORY Table 25. Document Revision History Date Version TSSOP8 Turned-Die package removed (p 2 and order information) 10-Dec-1999 2.4 Lead temperature added for TSSOP8 in table 2 18-Apr-2000 2.5 Labelling change to Fig-2D, correction of values for ‘E’ and main caption for Tab-13 05-May-2000 2 ...

Page 29

... Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States M24C16, M24C08, M24C04, M24C02, M24C01 All other names are the property of their respective owners. © 2004 STMicroelectronics - All rights reserved STMicroelectronics GROUP OF COMPANIES www ...

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