PA.11 Taoglas Limited, PA.11 Datasheet
PA.11
Specifications of PA.11
PA.11
Q6367834
Related parts for PA.11
PA.11 Summary of contents
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... Part No. : Specification No : Product Name : Description : SPE-11-8-091/A PA.11 PA-2400-15-10-A-02 2.4GHz Band Dielectric Ceramic PIFA SMT Antenna for Bluetooth/WLAN/Zigbee Applications 2400-2484Mhz, 1.5dBi Peak Gain Size: 10mm*4mm*3mm Designed for the top right hand corner edge of the Component side of the board (bottom left corner edge) ...
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Scope This specification covers the Dielectric PIFA Antenna for 2400-2484MHz, covering such applications as Wi-Fi, Bluetooth and Zigbee. A ceramic dielectric PIFA antenna offers smallest footprint, superior gain characteristics and improved isolation over traditional PCB based antennas. This antenna ...
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S11 Response Curve * Gain is measured on test PCB (40*80*0.8) * Ant position: Right side, top corner edge, horizontal 4.0 Test Position SPE-11-8-091 05-Sep-11 Page ...
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Summary of Test Results 5.1 Gain & Efficiency Frequency (GHz) 1 2.400 2 2.442 3 2.450 4 2.4835 5 2.500 5.2 Power Average Gain Frequency (GHz) 1 2.400 2 2.442 3 2.450 4 2.4835 5 2.500 SPE-11-8-091/A Peak Gain(dBi) ...
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Antenna Pattern – Wi-Fi & Bluetooth Frequency: 2.400 GHz SPE-11-8-091/A 05-Sep-11 Page ...
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Frequency: 2.442 GHz SPE-11-8-091/A 05-Sep-11 Page ...
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SPE-11-8-091/A 05-Sep-11 Page ...
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Frequency: 2.450 GHz SPE-11-8-091/A 05-Sep-11 Page ...
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Frequency: 2.4835 GHz SPE-11-8-091/A 05-Sep-11 Page ...
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SPE-11-8-091/A 05-Sep-11 Page ...
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Frequency: 2.500 GHz SPE-11-8-091/A 05-Sep-11 Page ...
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Drawing SPE-11-8-091/A 05-Sep-11 Page ...
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Silver Copper Solder Area Ground Clearance Area SPE-11-8-091/A 05-Sep-11 Page ...
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Recommended foot print for Evaluation Board SPE-11-8-091/A 05-Sep-11 Page ...
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... Delivery Mode 1 Blister tape to IEC 286-3，polyester 2 Pieces/tape：1000 Product code Units per Reel PA.11 1000 SPE-11-8-091/A C (mm) D (mm) W2 (mm) 1 0.5 330± 62± 05-Sep-11 24± 1 Page ...
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SPE-11-8-091/A Index Spec. (mm) A 4 8.5 T 3.5 D 1.5 05-Sep-11 Page ...
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Recommended Reflow Temperature Profile 1. Time shown in the above figures is measured from the point when chip surface reaches temperature. 2. Temperature difference in high temperature part should be within 110°C. 3. After soldering, do not force cool, ...
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Cleaning: When using ultrasonic cleaning, the board may resonate if the output power is too high. Since this vibration can cause cracking or a decrease in the adherence of the termination, we recommend that you use the conditions below. Frequency: ...