FTR-B4SA4.5Z-B05 Fujitsu Components, FTR-B4SA4.5Z-B05 Datasheet - Page 9

• Manufacturer Part Number: FTR-B4SA4.5Z-B05
• Manufacturer: Fujitsu Components
• Type: Ultra Miniature Relayr

Specifications of FTR-B4SA4.5Z-B05

• Relay Construction: Non-Latching
• Contact Arrangement: DPDT
• Coil Voltage Dc: 4.5V
• Coil Current: 31.03mA
• Contact Form: 2 Form C
• Voltage Rating (vdc): 220V
• Voltage Rating (vac): 250V
• Dropout Volt (min): 0.45VDCV
• Coil Resistance: 145Ohm
• Pick-up Voltage (max): 3.38VDC
• Maximum Power Rating: 30W/62.5VA
• Operate Time: 3ms
• Contact Current Rating: 2A
• Contact Material: Au/AgNi
• Coil Suppression Diode: No
• Push To Test Button: No
• Led Indicator: No
• Seal: Unsealed
• Product Height (mm): 9.7mm
• Product Depth (mm): 5.7mm
• Product Length (mm): 10.6mm
• Operating Temp Range: -40C to 85C
• Pin Count: 8
• Mounting Style: Surface Mount
• Termination Style: Gull Wing
• Lead Free Status / Rohs Status: Compliant

RoHS Compliance and Lead Free Information
1. General Information
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2. Recommended Lead Free Solder Profile
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3. Moisture Sensitivity
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4. Tin Whiskers
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Recommended solder Sn-3.0Ag-0.5Cu or Sn-3.0 Cu-Ni (only FTR-B3 and FTR-B4)
(Amendment to Directive 2002/95/EC)
This material has been verified to be compatible with PbSn assembly process.
Moisture Sensitivity Level standard is not applicable to electromechanical relays, unless otherwise indicated.
Dipped SnAgCu solder is known as presenting a low risk to tin whisker development. No considerable length
whisker was found by our in house test.
All signal and power relays produced by Fujitsu Components are compliant with RoHS directive 2002/95EC including
Cadmium as used in electrical contacts is exempted from the RoHS directives on October 21st, 2005.
All of our signal and power relays are lead-free. Please refer to Lead-Free Status Info for older date codes
at: http://www.fujitsu.com/us/downloads/MICRO/fcai/relays/lead-free-letter.pdf
Lead free solder plating on relay terminals is Sn-3.0Cu-Ni for FTR-B3 and FTR-B4 series relays.
amendments.
We highly recommend that you confirm your actual solder conditions
FTR-K1 SERIES
Flow Solder condition:
Pre-heating:
Soldering:
Solder by Soldering Iron:
Soldering Iron
Temperature:
Duration:
FTR-B4 SERIES
maximum 120˚C
dip within 5 sec. at
260˚C solder bath
maximum 360˚C
maximum 3 sec.
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