BA15DD0WT Rohm Semiconductor, BA15DD0WT Datasheet - Page 5

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BA15DD0WT

Manufacturer Part Number
BA15DD0WT
Description
Low Dropout (LDO) Regulators
Manufacturer
Rohm Semiconductor
Datasheet

Specifications of BA15DD0WT

Number Of Outputs
1
Polarity
Positive
Output Voltage
1.5 V
Output Type
Fixed
Dropout Voltage (max)
0.5 V at 1 A
Output Current
2 A
Line Regulation
50 mV
Load Regulation
200 mV
Voltage Regulation Accuracy
1 %
Maximum Power Dissipation
2 W
Maximum Operating Temperature
+ 125 C
Mounting Style
Through Hole
Package / Case
TO-220FP
Minimum Operating Temperature
- 40 C
Lead Free Status / Rohs Status
 Details
●Block Diagrams
BA□□CC0WFP/ BA□□DD0WHFP/ BA□□CC0WT(V5)/ BA□□DD0WT
BA□□CC0T/ BA□□CC0FP/ BA□□DD0T
●Input / Output Equivalent Circuit Diagrams
●Thermal Design
When using at temperatures over Ta=25℃, please refer to the heat reducing characteristics shown in Fig.29 through 31. The IC
characteristics are closely related to the temperature at which the IC is used and if the temperature exceeds the maximum
junction temperature Tj
long-term operating reliability, it is necessary give sufficient consideration to IC heat. In order to protect the IC from thermal
damage, it is necessary to operate it at temperatures lower than the maximum junction temperature Tj
10
9
8
7
6
5
4
3
2
1
0
< BA□□DD0 Series >
0
③7.3W
②5.5W
①2.3W
HRP-5
Board size : 70×70×1.6 ㎜
Board front copper foil area : 10.5×10.5 ㎜
①2-layer board (back surface copper foil area :15×15 ㎜
②2-layer board (back surface copper foil area :70×70 ㎜
③4-layer board (back surface copper foil area :70×70 ㎜
CTL
25
CTL
Vref
1
Vref
Vcc
1
Ambient temperature:Ta(℃)
50
31kΩ
Fig.29
Vcc
39kΩ
Vcc
Fig.26
OVP
2
Fig.25
OVP
75
3
2kΩ
(board contains a thermal via)
Fin
TSD
Fin
TSD
GND
N.C.
GND
N.C.
(TO252-5)
(TO252-3)
3
(TO220FP-5,-5(V5),HRP5)
MAX
(TO220FP-3)
2
100
GND
Driver
GND
Driver
., the elements may be damaged or destroyed. From the standpoints of instantaneous destruction and
OCP
OCP
2
(TO252-5・HRP5)
Fig.27
(TO252-3)
OUT
4
125
OUT
2
2
2
3
)
)
)
N.C.
150
5
Vcc
Vcc
R2
R1
R2
R1
25
20
15
10
10kΩ
5
0
(1)20.0
(2)2.0
0
TO220FP-5
(1)
(2)
1 2 3 4 5
TO252-5
TOP VIEW
TOP VIEW
TO220FP-5
25
1 2 3 4 5
FIN
TO252-3
1
When using a maximum heat sick : θj-c=6.25(℃/W)
When using an IC alone : θj-6=62.5(℃/W)
FIN
Vcc
R2
R1
TOP VIEW
2
Ambient temperature:Ta(℃)
50
3
Fig.30
5/8
TO220FP-5(V5)
TOP VIEW
TOP VIEW
TO220FP-3
1 2 3 4 5
1 2 3 4 5
1
75
HRP5
2 3
OUT
100
< BA□□CC0 Series >
CTL
125
PIN No.
*1 TO252-5 is N.C.,and TO220FP-5,-5(V5),and HRP5 are GND
*2 Only for TO252-5 and HRP5
*1 TO252-3 is N.C.,and TO-220FP-3,is GND
*2
PIN No.
Fin
1
2
3
Fin
1
2
3
4
5
150
Only for TO252-3 and HRP5
Pin Name
N.C/GND
25kΩ
25kΩ
GND
Pin Name
OUT
N.C/GND
CTL
Vcc
N.C
2.0
1.6
1.2
0.8
0.4
0.0
GND
OUT
Vcc
0
TO252-5
1.30
Mounted on a Rohm standard board
Board size : 70×70×1.6 ㎜
Copper foil area :7×7 ㎜
TO252-5θja=96.2(℃/W)
25
Fig.28
Unconnected terminal/GND
Output voltage ON/OFF control
MAX
Unconnected terminal/GND*
Power supply voltage input
Ambient temperature:Ta(℃)
50
Unconnected terminal
Power supply voltage input
Fig.31
of the IC.
Voltage output
GND
Voltage output
Function
75
Function
GND
R2
Vcc
R1
100
125
OUT
*
1
*
*
1
2
2
150

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