HI-1573PST Holt Integrated Circuits, HI-1573PST Datasheet
HI-1573PST
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HI-1573PST Summary of contents
Page 1
... CMOS / TTL data suitable for inputting to a Manchester decoder. Each receiver has a separate enable input which can be used to force the output of the receiver to a logic "0" (HI-1573) or logic 1 (HI-1574). To minimize the package size for this function, the ...
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... The Each set of receiver outputs can also be independently BUSA forced to the bus idle state (logic "0” on HI-1573 or logic “1” on HI-1574) by setting RXENA or RXENB low. MIL-STD-1553 BUS INTERFACE A direct coupled interface (see Figure 2) uses a 1:2.5 ratio TXA B / are ei- isolation transformer and two 55 ohm isolation resistors between the transformer and the bus ...
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... Logic TXA/B TXINHA/B RECEIVER RXA/B Receive Logic RXA/B Comparator RXENA/B TXA/B TXA/B BUSA/B - BUSA/B Vin (Line to Line RXA/B (HI-1573) RXA/B (HI-1573) RXA/B (HI-1574) RXA/B (HI-1574) HI-1573, HI-1574 BUSA/B BUSA/B Input Filter Figure 1. Block Diagram TRANSMIT WAVEFORM - EXAMPLE PATTERN HOLT INTEGRATED CIRCUITS 3 ...
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... Supply Voltage -0 +3.6 V VDD....................................... 3.3V... ±5% 10 Vp-p Temperature Range +1.0 A Industrial Screening.........-40°C to +85°C Hi-Temp Screening........-55°C to +125°C 1.0 W 7mW/°C NOTE: 275°C for 10 sec. ratings or outside recommended operating conditions may cause permanent damage to the 175°C device. These are stress ratings only. Operation at the limits is not recommended. -65° ...
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... OUT TEST CONDITIONS From input zero crossing to RXA/B or RXA/B Spacing between RXA/B and RXA/B pulses From RXENA/B rising or falling edge to RXA/B or RXA/B TXA/B, TXA/B to BUSA/B, BUSA/B 35 ohm load 35 ohm load Inhibited output Active output 1:2.5 BUSA/B BUSA/B Isolation Transformer 2.5 Isolation ...
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... HI-1574PCI/T/M use a plastic chip- scale package (QFN). These packages include a metal heat sink located on the bottom surface of the device. This heat sink should be soldered down to the printed circuit board for optimum thermal dissipation. The heat sink is electrically isolated and may be soldered to any convenient power or ground plane ...
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... Matte Tin (Pb-free RoHS compliant) TEMPERATURE BURN RANGE FLOW -40°C TO +85°C I -55°C TO +125°C T -55°C TO +125°C M PACKAGE DESCRIPTION 44 PIN PLASTIC CHIP-SCALE PACKAGE QFN (44PCS) 20 PIN PLASTIC ESOIC, Thermally Enhanced Wide SOIC w/Heat Sink (20HWE) RXENA = 0 RXENB = 0 RXA RXA RXB RXB ...
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... DS1573 L 09/26/08 Clarification of transmitter and receiver functions in Description, clarification of available temperature ranges, and corrected a dimension in Recommended Transformers table. M 04/13/09 Add ‘M’ Flow option to chip-scale package (QFN). Clarify nomenclature of chip-scale package as QFN. N 07/24/09 Correct typographical errors in package dimensions. O 10/13/09 Clarified status of RXA/B and high (logic “ ...
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... TYP. (1.270 TYP.) .085 ±.009 (2.159 ± .229) .100 BSC (2.54) .017 ±.002 (.432 ±.051) HOLT INTEGRATED CIRCUITS 9 inches (millimeters) Package Type: 20HWE .290 typ (7.37) Bottom typ View Electrically isolated heat sink pad on bottom of package ...
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... PLASTIC CHIP-SCALE PACKAGE (QFN) .276 BSC (7.00) .276 Top View BSC (7.00) .039 max (1.00) BSC = “Basic Spacing between Centers” is theoretical true position dimension and has no tolerance. (JEDEC Standard 95) PACKAGE DIMENSIONS .203 ± .006 (5.15 ± .15) Electrically isolated heat sink ...