MCP2200-I/MQ Microchip Technology, MCP2200-I/MQ Datasheet - Page 18

• Manufacturer Part Number: MCP2200-I/MQ
• Description: IC USB TO UART 20QFN
• Manufacturer: Microchip Technology
• Type: USB to UART Protocol Converterr

Specifications of MCP2200-I/MQ

• Package / Case: 20-VQFN Exposed Pad
• Features: USB to UART
• Number Of Channels: 8
• Fifo's: 256 Byte
• Protocol: USB 2.0
• Voltage - Supply: 3 V ~ 5.5 V
• With Auto Flow Control: Yes
• Mounting Type: Surface Mount
• Mounting Style: SMD/SMT
• Operating Temperature Range: - 40 C to + 85 C
• Supply Current: 13 mA
• Operating Supply Voltage: 3 V to 5.5 V
• Usb Version: 2.0
• Data Rate: 12Mbps
• Supply Voltage Range: 3V To 5.5V
• Digital Ic Case Style: QFN
• No. Of Pins: 20
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

MCP2200
TABLE 3-2:
DS22228A-page 18
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40C  T
Param
Legend: TBD = To Be Determined.
Note 1:
TH01
TH02
TH03
TH04
TH05
TH06
TH07
No.
2:
3:
P
INTERNAL
I
T
T
T
DD
P
Sym
A
J
P
θ
θ
JMAX
PD
DER
I
= Junction Temperature.
JA
JC
= Ambient Temperature.
/
is the current to run the chip alone without driving any load on the output pins.
O
THERMAL CONSIDERATIONS
Thermal Resistance Junction to
Ambient
Thermal Resistance Junction to
Case
Maximum Junction Temperature
Power Dissipation
Internal Power Dissipation
I/O Power Dissipation
Derated Power
Characteristic
A
 +85C (I-Temp)
108.1
TBD
85.2
Typ
150
24
24
24
—
—
—
—
Units
C/W
C/W
C/W
C/W
C/W
C/W
C
W
W
W
W
20-pin SOIC package
20-pin SSOP package
20-pin QFN 5x5mm package
20-pin SOIC package
20-pin SSOP package
20-pin QFN 6x6mm package
PD = P
P
P
V
P
INTERNAL
I
OH
DER
/
O
))
=  (I
= PD
INTERNAL
 2010 Microchip Technology Inc.
OL
= I
MAX
Conditions
* V
DD
(T
OL
+ P
x V
J
) +  (I
- T
I
DD
/
O
A
(1)
)/θ
OH
JA
(2,3)
* (V
DD
–