NCP2890DMR2G ON Semiconductor, NCP2890DMR2G Datasheet
NCP2890DMR2G
Specifications of NCP2890DMR2G
NCP2890DMR2GOS
NCP2890DMR2GOSTR
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NCP2890DMR2G Summary of contents
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NCP2890, NCV2890 1.0 Watt Audio Power Amplifier The NCP2890 is an audio power amplifier designed for portable communication device applications such as mobile phone applications. The NCP2890 is capable of delivering 1 continuous average power to an 8.0 ...
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Ci Ri INM AUDIO INPUT INP 20 kW 390 nF BYPASS bypass SHUTDOWN VIH VIL Figure 1. Typical Audio Amplifier Application Circuit with Single Ended Input INM 20 kW 390 nF AUDIO INP INPUT ...
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PIN DESCRIPTION 9−Pin Flip−Chip CSP Micro8 Type Symbol BYPASS SHUTDOWN MAXIMUM RATINGS (Note ...
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ELECTRICAL CHARACTERISTICS Limits apply for T Characteristic Supply Quiescent Current Common Mode Voltage Shutdown Current Shutdown Voltage High Shutdown Voltage Low Turning On Time (Note 8) Output Swing Rms Output Power Maximum Power Dissipation (Note 8) Output Offset Voltage Signal−to−Noise ...
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TYPICAL PERFORMANCE CHARACTERISTICS 250 mW out 0.1 0.01 0.001 10 100 1000 FREQUENCY (Hz) Figure 1. THD + N versus Frequency 1 V ...
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TYPICAL PERFORMANCE CHARACTERISTICS 3 kHz 0.1 0.01 0.001 0 100 200 300 P , POWER OUT (mW) out Figure 7. THD + N versus ...
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TYPICAL PERFORMANCE CHARACTERISTICS − − Float in − 200 mV ripple pk−pk − bypass −60 −70 −80 −90 ...
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TYPICAL PERFORMANCE CHARACTERISTICS − − Float − − 200 mV ripple pk− −50 bypass −60 −70 −80 ...
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TYPICAL PERFORMANCE CHARACTERISTICS − − − − 200 mV ripple pk−pk −50 − −60 −65 −70 2.2 ...
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TYPICAL PERFORMANCE CHARACTERISTICS 0.7 0.6 0 kHz 0.2 THD + N < 0.1% 0 0.2 0.4 0.6 0 OUTPUT POWER (W) ...
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Detailed Description The NCP2890 audio amplifier can operate under 2.6 V until 5.5 V power supply. It delivers 320 mW rms output power to 4.0 W load (V = 2.6 V) and 1.0 W rms output p power to 8.0 ...
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Gain−Setting Resistor Selection ( and R set the closed−loop gain of the amplifier order to optimize device and system performance, the NCP2890 should be used in low gain configurations. The low gain configuration minimizes THD ...
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NCP2890, NCV2890 Silkscreen Layer Top Layer Figure 38. Demonstration Board for 9−Pin Flip−Chip CSP Device − PCB Layers http://onsemi.com Bottom Layer 13 ...
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... Device NCP2890AFCT2 NCP2890AFCT2G NCP2890DMR2 NCP2890DMR2G NCV2890DMR2G NOTE: This product is offered with either eutectic (SnPb−tin/lead) or lead−free solder bumps (G suffix) depending on the PCB assembly process. The NCP2890AFCT2G version requires a lead−free solder paste and should not be used with a SnPb solder paste. ...
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... A B 0.03 C BOTTOM VIEW SOLDERING FOOTPRINT* 0.265 0.01 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 9 PIN FLIP−CHIP CASE 499E−01 ISSUE A NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14 ...
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... A A1 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. Micro8 is a trademark of International Rectifier Corporation. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein ...