NCP2809BDMR2G ON Semiconductor, NCP2809BDMR2G Datasheet - Page 24

• Manufacturer Part Number: NCP2809BDMR2G
• Description: IC AMP STEREO AUD 135ME MICRO-10
• Manufacturer: ON Semiconductor
• Series: NOCAP™r
• Type: Class ABr

Specifications of NCP2809BDMR2G

• Output Type: Headphones, 2-Channel (Stereo)
• Max Output Power X Channels @ Load: 135mW x 2 @ 16 Ohm
• Voltage - Supply: 2.2 V ~ 5.5 V
• Features: Depop, Short-Circuit and Thermal Protection, Shutdown
• Mounting Type: Surface Mount
• Package / Case: 10-MSOP, Micro10™, 10-uMAX, 10-uSOP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: NCP2809BDMR2G; NCP2809BDMR2GOSTR

PUBLICATION ORDERING INFORMATION
NOCAP is a trademark of Semiconductor Components Industries, LLC (SCILLC).
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to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any
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damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over
time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under
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10X
2X
2X
REFERENCE
0.10 C
0.08 C
PIN ONE
10X
10X
0.15 C
K
L
0.15 C
Í Í Í Í
Í Í Í Í
Í Í Í Í
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
BOTTOM VIEW
10
1
SIDE VIEW
TOP VIEW
D2
D
5
6
A1
b
e
A3
10X
0.10 C
0.05 C
8X
A
E2
N. American Technical Support: 800−282−9855 Toll Free
Europe, Middle East and Africa Technical Support:
Japan Customer Focus Center
PACKAGE DIMENSIONS
USA/Canada
Phone: [phone]
Phone: 81−3−5773−3850
A
B
E
A
NOTE 3
UDFN10 3x3, 0.5P
http://onsemi.com
C
CASE 506AT−01
B
SEATING
PLANE
ISSUE A
24
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
0.5651
10X
2.1746
0.3008
10X
NOTES:
SOLDERING FOOTPRINT*
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
4. COPLANARITY APPLIES TO THE EXPOSED
ASME Y14.5M, 1994.
TERMINAL AND IS MEASURED BETWEEN
0.25 AND 0.30mm FROM TERMINAL.
PAD AS WELL AS THE TERMINALS.
DIM
A1
A3
D2
E2
A
b
D
E
e
K
L
0.45
0.00
0.18
2.40
1.70
0.30
MIN
2.6016
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your loca
Sales Representative
MILLIMETERS
0.127 REF
3.00 BSC
3.00 BSC
0.50 BSC
0.19 TYP
NOM
0.50
0.03
0.25
2.50
1.80
0.40
DIMENSIONS: MILLIMETERS
MAX
0.55
0.05
0.30
2.60
1.90
0.50
0.5000 PITCH
1.8508
NCP2809/D
3.3048