MAX9717DEBL+T Maxim Integrated Products, MAX9717DEBL+T Datasheet - Page 12

• Manufacturer Part Number: MAX9717DEBL+T
• Description: IC AMP AUDIO PWR 1.4W STER 9UCSP
• Manufacturer: Maxim Integrated Products
• Type: Class ABr

Specifications of MAX9717DEBL+T

• Output Type: 1-Channel (Mono)
• Max Output Power X Channels @ Load: 1.4W x 1 @ 4 Ohm
• Voltage - Supply: 2.7 V ~ 5.5 V
• Features: Depop, Shutdown, Thermal Protection
• Mounting Type: Surface Mount
• Package / Case: 9-UCSP®
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

BIAS is the output of the internally-generated V
voltage. The BIAS bypass capacitor, C
power-supply rejection ratio by reducing power supply
and other noise sources at the common-mode bias node.
C
bias waveform for the speaker amplifiers. Bypass BIAS
with a 1µF capacitor to GND. Larger C
improve PSRR but slow down t
external loads to BIAS.
Proper power-supply bypassing ensures low-noise,
low-distortion performance. Connect a 1µF ceramic
capacitor from V
capacitance as required by the application. Connect
the bypass capacitor as close to the device as possible.
Low-Cost, Mono, 1.4W BTL Audio
Power Amplifiers
Figure 4. MAX9716 Differential Input
12
BIAS
______________________________________________________________________________________
also generates the clickless/popless startup DC
AUDIO
AUDIO
VALUES SHOWN FOR 0dB GAIN.
INPUT
INPUT
CC
0.33μF
0.33μF
to GND. Add additional bulk
C
C
IN
IN
220pF
20kΩ
20kΩ
R
R
IN
IN
ON
Supply Bypassing
time. Do not connect
BIAS Capacitor
C
BIAS
BIAS
, improves the
BIAS
CC
BIAS
IN+
IN-
values
/2 bias
V
CC
V
CC
Proper PC board layout and grounding is essential for
optimizing performance. Use large traces for the
power-supply inputs and amplifier outputs to minimize
losses due to parasitic trace resistance. Large traces
also aid in moving heat away from the package. Proper
grounding improves audio performance and prevents
digital switching noise from coupling into the audio signal.
The MAX9716/MAX9717 TDFN and µMAX packages
feature exposed thermal pads on their undersides. This
pad lowers the thermal resistance of the package by
providing a direct-heat conduction path from the die to
the printed circuit board. Connect the exposed pad to
the ground plane using multiple vias, if required.
MAX9716
220pF
20kΩ
20kΩ
20kΩ
R
R
CLICKLESS/POPLESS
F
F
SHUTDOWN
20kΩ
CONTROL
SHDN
OUT+
OUT-
GND
Layout and Grounding
OFF
ON