P89C669FA Philips Semiconductors, P89C669FA Datasheet

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P89C669FA

Manufacturer Part Number
P89C669FA
Description
80C51 8-bit microcontroller family with extended memory 96 kB Flash with 2 kB RAM
Manufacturer
Philips Semiconductors
Datasheet

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1. General description
The P89C669 represents the first Flash microcontroller based on Philips
Semiconductors’ new 51MX core. The P89C669 features 96 kbytes of Flash program
memory and 2 kbytes of data SRAM. In addition, this device is equipped with a
Programmable Counter Array (PCA), a watchdog timer that can be configured to
different time ranges through SFR bits, as well as two enhanced UARTs and byte
based I
Philips Semiconductors’ 51MX (Memory eXtension) core is an accelerated 80C51
architecture that executes instructions at twice the rate of standard 80C51 devices.
The linear address range of the 51MX has been expanded to support up to 8 Mbytes
of program memory and 8 Mbytes of data memory. It retains full program code
compatibility to enable design engineers to re-use 80C51 development tools,
eliminating the need to move to a new, unfamiliar architecture. The 51MX core also
retains 80C51 bus compatibility to allow for the continued use of 80C51-interfaced
peripherals and Application Specific Integrated Circuits (ASICs).
The P89C669 provides greater functionality, increased performance and overall lower
system cost. By offering an embedded memory solution combined with the
enhancements to manage the memory extension, the P89C669 eliminates the need
for software work-arounds. The increased program memory enables design
engineers to develop more complex programs in a high-level language like C, for
example, without struggling to contain the program within the traditional 64 kbytes of
program memory. These enhancements also greatly improve C Language efficiency
for code size below 64 kbytes.
The P89C669 device contains a non-volatile Flash program memory that is both
parallel programmable and serial In-System and In-Application Programmable.
In-System Programming (ISP) allows the user to download new code while the
microcontroller sits in the application. In-Application Programming (IAP) means that
the microcontroller fetches new program code and reprograms itself while in the
system. This allows for remote programming over a modem link. A default serial
loader (boot loader) program in ROM allows serial In-System programming of the
Flash memory via the UART without the need for a loader in the Flash code. For
In-Application Programming, the user program erases and reprograms the Flash
memory by use of standard routines contained in ROM.
The 51MX core is described in more detail in the 51MX Architecture Reference .
P89C669
80C51 8-bit microcontroller family with extended memory;
96 kB Flash with 2 kB RAM
Rev. 01 — 08 May 2003
2
C-bus serial interface.
Product data

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P89C669FA Summary of contents

Page 1

... SFR bits, as well as two enhanced UARTs and byte based I Philips Semiconductors’ 51MX (Memory eXtension) core is an accelerated 80C51 architecture that executes instructions at twice the rate of standard 80C51 devices. The linear address range of the 51MX has been expanded to support Mbytes of program memory and 8 Mbytes of data memory ...

Page 2

... Philips Semiconductors 2. Features 2.1 Key features Extended features of the 51MX Core: 100% binary compatibility with the classic 80C51 so that existing code is completely reusable MHz CPU clock with 6 clock cycles per machine cycle 96 kbytes of on-chip program Flash 2 kbytes of on-chip data RAM Programmable Counter Array (PCA) ...

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... Ordering information Table 1: Type number P89C669FA P89C669BBD 3.1 Ordering options Table 2: Type number P89C669FA P89C669BBD 9397 750 11359 Product data 80C51 8-bit microcontroller family with extended memory 2 C-bus serial interface (400 kbits/s) Ordering information Package ...

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... Philips Semiconductors 4. Block diagram CODE FLASH DATA RAM PORT 3 PORT 2 PORT 1 PORT 0 CRYSTAL OR OSCILLATOR RESONATOR Fig 1. Block diagram. 9397 750 11359 Product data 80C51 8-bit microcontroller family with extended memory HIGH PERFORMANCE 80C51 CPU 96 kB internal bus 2 kB Rev. 01 — 08 May 2003 ...

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... Philips Semiconductors 5. Functional diagram Address bus 0-7 Data Bus RXD0 TXD0 INT0 INT1 CEX3/T0 CEX4/ EA/V PP ALE/PROG Fig 2. Functional diagram. 9397 750 11359 Product data 80C51 8-bit microcontroller family with extended memory P89C669 RXD1 TXD1 RST XTAL2 XTAL1 PSEN Rev. 01 — 08 May 2003 ...

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... Plastic leaded chip carrier Fig 3. PLCC44 pin configuration. 9397 750 11359 Product data 80C51 8-bit microcontroller family with extended memory 7 P1.5/CEX2 P1.6/SCL 8 P1.7/SDA 9 RST 10 P3.0/RXD0 11 P89C669FA RXD1 12 13 P3.1/TXD0 P3.2/INT0 14 P3.3/INT1 15 16 P3.4/CEX3/T0 P3.5/CEX4/T1 17 Rev. 01 — 08 May 2003 P89C669 39 P0 ...

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... Philips Semiconductors 6.1.2 Plastic low profile quad flat package Fig 4. LQFP44 pin configuration. 9397 750 11359 Product data 80C51 8-bit microcontroller family with extended memory P1.5/CEX2 1 P1.6/SCL 2 3 P1.7/SDA RST 4 P3.0/RXD0 5 P89C669BBD 6 RXD1 P3.1/TXD0 7 P3.2/INT0 8 9 P3.3/INT1 P3.4/CEX3/T0 10 P3.5/CEX4/T1 11 Rev. 01 — ...

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... Philips Semiconductors 6.2 Pin description Table 3: Pin description Symbol Pin Type PLCC LQFP P0 I/O P1 I/O P2 I/O 9397 750 11359 Product data 80C51 8-bit microcontroller family with extended memory Description Port 0: Port open drain, bidirectional I/O port. Port 0 pins that have 1s written to them fl ...

Page 9

... Philips Semiconductors Table 3: Pin description …continued Symbol Pin Type PLCC LQFP P3.0 - P3.7 11 RXD1 TXD1 RST ALE PSEN EA XTAL1 9397 750 11359 Product data 80C51 8-bit microcontroller family with extended memory Description Port 3: Port 8-bit bidirectional I/O port with internal pull-ups. Port 3 pins that have 1s written to them are pulled HIGH by the internal pull-ups and can be used as inputs ...

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... Philips Semiconductors Table 3: Pin description …continued Symbol Pin Type PLCC LQFP XTAL2 (NC (NC 9397 750 11359 Product data 80C51 8-bit microcontroller family with extended memory Description Crystal 2: Output from the inverting oscillator amplifier. Ground reference. Power Supply: This is the power supply voltage for normal operation as well as Idle and Power-down modes ...

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... Philips Semiconductors 7. Functional description 7.1 Flash memory description The P89C669 contains 96 kbytes of Flash program memory organized as 12 separate blocks, each block containing 8 kbytes. The P89C669 Flash memory augments EPROM functionality with in-circuit electrical erasure and programming. The Flash can be read and written as bytes. The Chip Erase operation will erase the entire program memory ...

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... Philips Semiconductors 7.2 Memory arrangement P89C669 has 96 kbytes of Flash (MX universal map range: 80:0000-81:7FFF) and 2 kbytes of on-chip RAM: Table 4: Data memory Type DATA IDATA EDATA XDATA For more detailed information, please refer to the P89C669 User Manual . 7.3 Special function registers Special Function Register (SFR) accesses are restricted in the following ways: • ...

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Table 5: Special function registers Name Description SFR addr. Bit address E7 [1] ACC Accumulator E0H [2] AUXR Auxiliary Function Register 8EH [2] AUXR1 Auxiliary Function Register 1 A2H Bit address F7 ...

Page 14

Table 5: Special function registers …continued Name Description SFR addr. DPH Data Pointer HIGH 83H DPL Data Pointer LOW 82H [2] EPL Extended Data Pointer LOW FCH [2] EPM Extended Data Pointer ...

Page 15

Table 5: Special function registers …continued Name Description SFR addr. Bit address 87 [1] P0 Port 0 80H Bit address 97 [1] P1 Port 1 90H Bit address A7 [1] P2 Port ...

Page 16

Table 5: Special function registers …continued Name Description SFR addr. [2] S1ADEN Serial Port 1 Address Enable 83H [2] S1STAT Serial Port 1 Status 84H SP Stack Pointer (Stack Pointer 81H LOW ...

Page 17

... Philips Semiconductors 7.4 Security bits The P89C669 has security bits to protect users’ firmware codes. With none of the security bits programmed, the code in the program memory can be verified. When only security bit 1 (see external program memory are disabled from fetching code bytes from the internal memory ...

Page 18

... Philips Semiconductors 9. Static characteristics Table 8: DC electrical characteristics for commercial, unless otherwise specified; V amb Symbol Parameter V LOW-level input voltage IL V HIGH-level input voltage IH (ports EA) V HIGH-level input voltage, IH1 XTAL1, RST V LOW-level output voltage, OL [8] ports LOW-level output voltage, OL1 ...

Page 19

... Philips Semiconductors c) Maximum total I for all outputs exceeds the test condition listed test conditions. [9] ALE is tested except when ALE is off then V OH1 [10] Pin capacitance is characterized but not tested. 10. Dynamic characteristics Table 9: AC electrical characteristics +70 C for commercial unless otherwise specified. Formulae including t ...

Page 20

... Philips Semiconductors Table 9: AC electrical characteristics +70 C for commercial unless otherwise specified. Formulae including t amb [1][2][3] 50/50 duty cycle. Symbol Figure Parameter t 7 Data valid to WR transition QVWX t 7 Data hold after WR WHQX t 7 Data valid to WR HIGH QVWH LOW to address float ...

Page 21

... Philips Semiconductors 2 Table 10: I C-bus interface characteristics Symbol Parameter t START condition hold time HD;STA t SCL LOW time LOW t SCL HIGH time HIGH t SCL rise time RC t SCL fall time FC t Data set-up time SU;DAT1 t SDA set-up time SU;DAT2 t SDA set-up time SU ...

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... Philips Semiconductors Examples: t AVLL t LLPL 10.2 Timing diagrams t LHLL ALE t LLPL PSEN t AVLL t LLAX PORT 0 A0-A7 PORT 2 P2.0-P2.7 OR A8-A15 OR A16-A22,P2.7 Fig 5. External program memory read cycle. ALE PSEN RD t LLAX t AVLL PORT 0 A0-A7 t AVWL PORT 2 P2.0-P2.7 OR A8-A15 OR A16-A22,P2.7 Fig 6. External data memory read cycle. ...

Page 23

... Philips Semiconductors ALE PSEN WR t LLAX t AVLL PORT 0 A0-A7 t AVWL PORT 2 P2.0-P2.7 OR A8-A15 OR A16-A22,P2.7 Fig 7. External data memory write cycle. INSTRUCTION 0 ALE CLOCK t QVXH OUTPUT DATA WRITE TO SBUF INPUT DATA CLEAR RI Fig 8. Shift register mode timing. 9397 750 11359 Product data ...

Page 24

... Philips Semiconductors Fig 9. External clock drive. 11. Test information Fig 10. I Fig 11. I 9397 750 11359 Product data 80C51 8-bit microcontroller family with extended memory V DD -0 -0 CHCL V DD RST (NC) XTAL2 CLOCK SIGNAL XTAL1 V SS test condition, active mode (all other pins are disconnected). ...

Page 25

... Philips Semiconductors Fig 12. Clock signal waveform for I Fig 13. I 9397 750 11359 Product data 80C51 8-bit microcontroller family with extended memory V DD -0 -0 CHCL tests in active and idle modes ns). CLCH CHCL RST (NC) XTAL2 XTAL1 V SS test condition, power-down mode (all other pins are disconnected, ...

Page 26

... Philips Semiconductors 12. Package outline PLCC44: plastic leaded chip carrier; 44 leads pin 1 index DIMENSIONS (mm dimensions are derived from the original inch dimensions UNIT max. min. 4.57 0.53 0.81 mm 0.51 0.25 3.05 4.19 0.33 0.66 0.180 0.032 0.021 inches 0.02 0.01 0.12 0.165 ...

Page 27

... Philips Semiconductors LQFP44: plastic low profile quad flat package; 44 leads; body 1 pin 1 index DIMENSIONS (mm are the original dimensions) A UNIT max. 0.15 1.45 0.45 mm 1.6 0.25 0.05 1.35 0.30 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION ...

Page 28

... Philips Semiconductors 13. Soldering 13.1 Introduction to soldering surface mount packages This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our Data Handbook IC26; Integrated Circuit Packages (document order number 9398 652 90011). There is no soldering method that is ideal for all IC packages. Wave soldering can still be used for certain surface mount ICs, but it is not suitable for fi ...

Page 29

... SSOP, TSSOP, VSO, VSSOP [1] For more detailed information on the BGA packages refer to the (LF)BGA Application Note (AN01026); order a copy from your Philips Semiconductors sales office. [2] All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the Data Handbook IC26 ...

Page 30

... Philips Semiconductors [3] These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side, the solder might be deposited on the heatsink surface. ...

Page 31

... Philips Semiconductors 14. Revision history Table 12: Revision history Rev Date CPCN Description 01 20030508 - Product data (9397 750 11359); ECN 853-2422 29812 of 14 April 2003 9397 750 11359 Product data 80C51 8-bit microcontroller family with extended memory Rev. 01 — 08 May 2003 P89C669 © Koninklijke Philips Electronics N.V. 2003. All rights reserved. ...

Page 32

... Semiconductors reserves the right to change the specification in any manner without notice. This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. ...

Page 33

... Philips Semiconductors Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 2.1 Key features . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 2.2 Key benefi 2.3 Complete features . . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 3 3.1 Ordering options . . . . . . . . . . . . . . . . . . . . . . . . 3 4 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 4 5 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 5 6 Pinning information . . . . . . . . . . . . . . . . . . . . . . 6 6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 6.1.1 Plastic leaded chip carrier . . . . . . . . . . . . . . . . 6 6.1.2 Plastic low profile quad flat package ...

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