M24C01-MN3T STMicroelectronics, M24C01-MN3T Datasheet

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M24C01-MN3T

Manufacturer Part Number
M24C01-MN3T
Description
357-036-542-201 CARDEDGE 36POS DL .156 BLK LOPRO
Manufacturer
STMicroelectronics
Datasheet
Features
Table 1.
September 2007
Two-wire I²C serial interface
Supports 400 kHz protocol
Single supply voltage:
– 2.5 V to 5.5 V for M24Cxx-W
– 1.8 V to 5.5 V for M24Cxx-R
– 1.7 V to 5.5 V for M24Cxx-F
Write Control input
Byte and Page Write (up to 16 bytes)
Random and Sequential Read modes
Self-timed programming cycle
Automatic address incrementing
Enhanced ESD/latch-up protection
More than 1 million write cycles
More than 40-year data retention
Packages
– ECOPACK® (RoHS compliant)
16 Kbit, 8 Kbit, 4 Kbit, 2 Kbit and 1 Kbit serial I²C bus EEPROM
Reference
M24C16
M24C08
M24C04
M24C02
M24C01
Device summary
Part number
M24C16-W
M24C08-W
M24C04-W
M24C02-W
M24C01-W
M24C16-R
M24C08-R
M24C04-R
M24C02-R
M24C01-R
M24C16-F
M24C08-F
M24C04-F
M24C04, M24C02, M24C01
Rev 10
M24C16, M24C08
3 x 3 mm body size
2 x 3 mm (MLP)
UFDFPN8 (MB)
TSSOP8 (DW)
150 mils width
169 mils width
TSSOP8 (DS)
PDIP8 (BN)
SO8 (MN)
www.st.com
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Related parts for M24C01-MN3T

M24C01-MN3T Summary of contents

Page 1

... More than 1 million write cycles More than 40-year data retention Packages – ECOPACK® (RoHS compliant) Table 1. Device summary Reference M24C16 M24C08 M24C04 M24C02 M24C01 September 2007 M24C04, M24C02, M24C01 Part number M24C16-W M24C16-R M24C16-F M24C08-W M24C08-R M24C08-F M24C04-W M24C04-R M24C04-F M24C02-W M24C02-R ...

Page 2

... Read operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 3.7.1 3.7.2 3.7.3 3.7.4 4 Initial delivery state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 5 Maximum rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . and AC parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 2/34 M24C16, M24C08, M24C04, M24C02, M24C01 Write Control (WC Operating supply voltage Power-up conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Device reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Power-down conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Byte Write . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Page Write . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Minimizing system delays by polling on ACK . . . . . . . . . . . . . . . . . . . . . 15 Random Address Read . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Current Address Read ...

Page 3

... M24C16, M24C08, M24C04, M24C02, M24C01 7 Package mechanical . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 8 Part numbering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 9 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 Contents 3/34 ...

Page 4

... Available M24C08 products (package, voltage range, temperature grade Table 25. Available M24C04 products (package, voltage range, temperature grade Table 26. Available M24C02 products (package, voltage range, temperature grade Table 27. Available M24C01 products (package, voltage range, temperature grade Table 28. Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 4/34 M24C16, M24C08, M24C04, M24C02, M24C01 ...

Page 5

... M24C16, M24C08, M24C04, M24C02, M24C01 List of figures Figure 1. Logic diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Figure 2. 8-pin package connections (top view Figure 3. Device select code . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Figure 4. Maximum R value versus bus parasitic capacitance (C) for an I²C bus . . . . . . . . . . . . . . 9 P Figure 5. I²C bus protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Figure 6. Write mode sequences with (data write inhibited Figure 7 ...

Page 6

... Stop condition after an Ack for Write, and after a NoAck for Read. Table 2. Signal names Signal name E0, E1, E2 SDA SCL 6/34 M24C16, M24C08, M24C04, M24C02, M24C01 E0-E2 M24Cxx SCL Table 3), terminated by an acknowledge bit. Function Chip Enable Serial Data ...

Page 7

... M24C16, M24C08, M24C04, M24C02, M24C01 Figure 2. 8-pin package connections (top view) 16Kb Not connected 2. See Section 7: Package mechanical M24Cxx /8Kb /4Kb /2Kb /1Kb for package dimensions, and how to identify pin-1. ...

Page 8

... Control (WC) is driven High. When unconnected, the signal is internally read as V Write operations are allowed. When Write Control (WC) is driven High, device select and address bytes are acknowledged, data bytes are not acknowledged. 8/34 M24C16, M24C08, M24C04, M24C02, M24C01 indicates how the value of the pull-up resistor can be calculated M24Cxx ...

Page 9

... M24C16, M24C08, M24C04, M24C02, M24C01 2.4 Supply voltage (V 2.4.1 Operating supply voltage V Prior to selecting the memory and issuing instructions to it, a valid and stable V within the specified [V Table 8). In order to secure a stable DC supply voltage recommended to decouple the V line with a suitable capacitor (usually of the order 100 nF) close to the ...

Page 10

... M24C08 select code M24C16 select code 1. The most significant bit, b7, is sent first. 2. E0, E1 and E2 are compared against the respective external pins on the memory device. 3. A10, A9 and A8 represent most significant bits of the address. 10/34 M24C16, M24C08, M24C04, M24C02, M24C01 SDA SDA START Input Change ...

Page 11

... M24C16, M24C08, M24C04, M24C02, M24C01 3 Device operation The device supports the I²C protocol. This is summarized in data on to the bus is defined transmitter, and any device that reads the data receiver. The device that controls the data transfer is known as the bus master, and the other as the slave device ...

Page 12

... A9, and E2 is not available for devices that need to use address line A10 (see up to eight M24C02 (or M24C01), four M24C04, two M24C08 or one M24C16 devices can be connected to one I²C bus. In each case, and in the hybrid cases, this gives a total memory capacity of 16 Kbits, 2 KBytes (except where M24C01 devices are used) ...

Page 13

... M24C16, M24C08, M24C04, M24C02, M24C01 Figure 6. Write mode sequences with (data write inhibited) WC Byte Write WC Page Write WC (cont'd) Page Write (cont'd) 3.6 Write operations Following a Start condition the bus master sends a device select code with the Read/Write bit (RW) reset to 0. The device acknowledges this, as shown in address byte ...

Page 14

... Stop condition. Figure 7. Write mode sequences with (data write enabled) WC BYTE WRITE WC PAGE WRITE WC (cont'd) PAGE WRITE (cont'd) 14/34 M24C16, M24C08, M24C04, M24C02, M24C01 ACK ACK DEV SEL BYTE ADDR DATA IN R/W ACK ACK DEV SEL BYTE ADDR ...

Page 15

... M24C16, M24C08, M24C04, M24C02, M24C01 Figure 8. Write cycle polling flowchart using ACK First byte of instruction with already decoded by the device ReSTART 3.6.3 Minimizing system delays by polling on ACK During the internal Write cycle, the device disconnects itself from the bus, and writes a copy of the data from its internal latches to the memory cells ...

Page 16

... Read/Write bit (RW) set to 1. The device acknowledges this, and outputs the contents of the addressed byte. The bus master must not acknowledge the byte, and terminates the transfer with a Stop condition. 16/34 M24C16, M24C08, M24C04, M24C02, M24C01 ACK NO ACK DEV SEL ...

Page 17

... M24C16, M24C08, M24C04, M24C02, M24C01 3.7.2 Current Address Read For the Current Address Read operation, following a Start condition, the bus master only sends a device select code with the Read/Write bit (RW) set to 1. The device acknowledges this, and outputs the byte addressed by the internal address counter. The counter is then incremented ...

Page 18

... European directive on Restrictions on Hazardous Substances (RoHS) 2002/95/EU max must not be applied for more than 10s. LEAD 3. AEC-Q100-002 (compliant with JEDEC Std JESD22-A114A 100 pF 1500 , R2 = 500 ). 18/34 M24C16, M24C08, M24C04, M24C02, M24C01 Table 5 may cause permanent damage to Parameter (3) Min. Max. ...

Page 19

... M24C16, M24C08, M24C04, M24C02, M24C01 6 DC and AC parameters This section summarizes the operating and measurement conditions, and the DC and AC characteristics of the device. The parameters in the DC and AC characteristic tables that follow are derived from tests performed under the measurement conditions summarized in the relevant tables. Designers should check that the operating conditions in their circuit match the measurement conditions when relying on the quoted parameters ...

Page 20

... CC I Standby supply current CC1 Input low voltage (SDA SCL, WC) Input high voltage (SDA SCL, WC) V Output low voltage OL 20/34 M24C16, M24C08, M24C04, M24C02, M24C01 Test condition Parameter (in addition to those Standby mode OUT (rise/fall time < ...

Page 21

... M24C16, M24C08, M24C04, M24C02, M24C01 Table 12. DC characteristics (M24Cxx-F) Symbol Input leakage current I LI (SCL, SDA, E0, E1,and E2) I Output leakage current LO I Supply current CC I Standby supply current CC1 Input low voltage (SDA SCL, WC) Input high voltage (SDA SCL, WC) ...

Page 22

... Previous devices bearing the process letter “L” in the package marking guarantee a maximum write time of 10 ms. For more information about these devices and their device identification, please ask your ST Sales Office for Process Change Notices PCN MPG/EE/0061 and 0062 (PCEE0061 and PCEE0062). 22/34 M24C16, M24C08, M24C04, M24C02, M24C01 Test conditions specified in Table 6 Parameter ...

Page 23

... W process letter printed on the package: M24C01: process letter is either M24C02: process letter is either M24C04: process letter is Q M24C08: process letter is Q M24C016: process letter is either $ or Q Test conditions specified in Table 7 Parameter Clock frequency Clock pulse width high Clock pulse width low ...

Page 24

... Figure 11. AC waveforms tCHCL SCL tDLCL SDA In tCHDX START Condition SCL SDA In tCHDH STOP Condition SCL tCLQV SDA Out 24/34 M24C16, M24C08, M24C04, M24C02, M24C01 tCLCH tCLDX tDXCX SDA Change SDA Input tW Write Cycle tCLQX Data Valid tCHDH tDHDL START STOP Condition ...

Page 25

... M24C16, M24C08, M24C04, M24C02, M24C01 7 Package mechanical Figure 12. PDIP8 – 8 pin plastic DIP, 0.25 mm lead frame, package outline 1. Drawing is not to scale. Table 17. PDIP8 – 8 pin plastic DIP, 0.25 mm lead frame, package mechanical data Symbol ...

Page 26

... The ‘1’ that appears in the top view of the package shows the position of pin 1 and the ‘N’ indicates the total number of pins. Table 18. SO8 narrow – 8 lead plastic small outline, 150 mils body width, package mechanical data Symbol ccc 26/34 M24C16, M24C08, M24C04, M24C02, M24C01 A ccc millimeters Typ Min Max 1.75 0.10 0.25 1.25 0.28 0.48 0.17 ...

Page 27

... M24C16, M24C08, M24C04, M24C02, M24C01 Figure 14. UFDFPN8 (MLP8) 8-lead ultra thin fine pitch dual flat package no lead mm, outline 1. Drawing is not to scale. 2. The central pad (the area the above illustration) is pulled, internally allowed to be connected to any other voltage or signal line on the PCB, for example during the soldering process ...

Page 28

... The circle in the top view of the package indicates the position of pin 1. Table 20. TSSOP8 – 8 lead thin shrink small outline, package mechanical data Symbol 28/34 M24C16, M24C08, M24C04, M24C02, M24C01 millimeters Typ. Min. Max. 1.200 0.050 ...

Page 29

... M24C16, M24C08, M24C04, M24C02, M24C01 Figure 16. TSSOP8 – 8 lead thin shrink small outline body size, package outline A ccc 1. Drawing is not to scale. 2. The circle in the top view of the package indicates the position of pin 1. Table 21. TSSOP8 – 8 lead thin shrink small outline body size, ...

Page 30

... ST sales office. The category of second-level interconnect is marked on the package and on the inner box label, in compliance with JEDEC standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. 30/34 M24C16, M24C08, M24C04, M24C02, M24C01 M24C16 – (1) (2) over – ...

Page 31

... Package DIP8 (BN) SO8N (MN) UFDFPN8 (MB) TSSOP8 (DW) Table 26. Available M24C02 products (package, voltage range, temperature grade) Package DIP8 (BN) SO8N (MN) UFDFPN8 (MB) TSSOP8 (DW) Table 27. Available M24C01 products (package, voltage range, temperature grade) Package DIP8 (BN) SO8N (MN) UFDFPN8 (MB) TSSOP8 (DW) TSSOP8 3 × (DS) M24C16-W M24C16 5.5 V ...

Page 32

... M24C16, M24C08, M24C04, M24C02, M24C01 Changes TSSOP8 Turned-Die package removed (p 2 and order information) Lead temperature added for TSSOP8 in table 2 Labelling change to Fig-2D, correction of values for ‘E’ and main caption for Tab-13 Extra labelling to Fig-2D SBGA package information removed to an annex document ...

Page 33

... M24C16, M24C08, M24C04, M24C02, M24C01 Table 28. Document revision history (continued) Date Version 7-Oct-2005 6.0 17-Jan-2006 7.0 19-Sep-2006 03-Aug-2007 27-Sep-2007 Product List summary table added. AEC-Q100-002 compliance. Device Grade information clarified. Updated Figure 3, Figure 4, Table 16 Updated tW=5ms for the M24Cxx-W. Pin numbers removed from silhouettes (see ...

Page 34

... Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America 34/34 M24C16, M24C08, M24C04, M24C02, M24C01 Please Read Carefully: © 2007 STMicroelectronics - All rights reserved STMicroelectronics group of companies www ...

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