IRF7341Q International Rectifier Corp., IRF7341Q Datasheet

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IRF7341Q

Manufacturer Part Number
IRF7341Q
Description
Manufacturer
International Rectifier Corp.
Datasheet

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IRF7341Q
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IRF7341QTRPBF
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Description
Absolute Maximum Ratings
Thermal Resistance
Typical Applications
Benefits
Specifically designed for Automotive applications, these
HEXFET ® Power MOSFET’s in a Dual SO-8 package utilize
the lastest processing techniques to achieve extremely low
on-resistance per silicon area. Additional features of these
Automotive qualified HEXFET Power MOSFET’s are a 175°C
junction operating temperature, fast switching speed and
improved repetitive avalanche rating. These benefits com-
bine to make this design an extremely efficient and reliable
device for use in Automotive applications and a wide variety
of other applications.
The 175°C rating for the SO-8 package provides improved
thermal performance with increased safe operating area and
dual MOSFET die capability make it ideal in a variety of
power applications. This dual, surface mount SO-8 can
dramatically reduce board space and is also available in
Tape & Reel.
www.irf.com
V
I
I
I
P
P
V
E
I
E
T
R
D
D
DM
AR
Air bag
J
Anti-lock Braking Systems (ABS)
Electronic Fuel Injection
Advanced Process Technology
Dual N-Channel MOSFET
Ultra Low On-Resistance
175°C Operating Temperature
Repetitive Avalanche Allowed up to Tjmax
Automotive [Q101] Qualified
DS
D
D
GS
AS
AR
θJA
@ T
@ T
, T
@T
@T
STG
A
A
A
A
= 25°C
= 70°C
= 25°C
= 70°C
Drain-Source Voltage
Continuous Drain Current, V
Continuous Drain Current, V
Pulsed Drain Current
Maximum Power Dissipation
Maximum Power Dissipation
Single Pulse Avalanche Energy‚
Avalanche Current
Repetitive Avalanche Energy
Junction and Storage Temperature Range
Parameter
Maximum Junction-to-Ambient
Gate-to-Source Voltage
Linear Derating Factor
Parameter

GS
GS
ƒ
ƒ
ƒ
@ 10V
@ 10V
Max.
G2
G1
S2
S1
V
55V
DSS
1
2
3
4
Top View
See Fig. 14, 15, 16
HEXFET
0.065@V
0.050@V
8
6
5
7
-55 to + 175
R
DS(on)
62.5
D1
D1
D2
D2
± 20
Max.
140
Units
5.1
4.2
2.4
1.7
55
42
16
5.1
IRF7341Q
®
GS
GS
Power MOSFET
max
= 4.5V
= 10V
SO-8
4.42A
5.1A
mW/°C
Units
I
°C/W
D
mJ
mJ
°C
W
W
V
A
V
A
1

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IRF7341Q Summary of contents

Page 1

... Parameter R Maximum Junction-to-Ambient θJA www.irf.com HEXFET V DSS 55V Top View @ 10V GS @ 10V GS  ƒ ƒ See Fig. 14, 15, 16 Max. ƒ IRF7341Q ® Power MOSFET R max I DS(on) D 0.050@V = 10V 5.1A GS 0.065@V = 4.5V 4.42A SO-8 Max. Units ...

Page 2

Electrical Characteristics @ T Parameter V Drain-to-Source Breakdown Voltage (BR)DSS ∆V Breakdown Voltage Temp. Coefficient /∆T (BR)DSS J R Static Drain-to-Source On-Resistance DS(on) V Gate Threshold Voltage GS(th) g Forward Transconductance fs I Drain-to-Source Leakage Current DSS Gate-to-Source Forward Leakage ...

Page 3

PULSE WIDTH Tj = 25°C 0.1 0 Drain-to-Source Voltage (V) Fig 1. Typical Output Characteristics 100 ° 175 20µs PULSE WIDTH ...

Page 4

0V MHZ C iss = 1200 SHORTED C rss = C gd 1000 C oss = Ciss 800 600 400 Coss 200 ...

Page 5

T , Case Temperature ( C) C Fig 9. Maximum Drain Current Vs. Case Temperature 100 D = 0.50 0.20 10 0.10 0.05 0.02 1 0.01 SINGLE PULSE ...

Page 6

7.1A 0.030 0.020 2.0 4.0 6.0 8.0 10.0 V GS, Gate -to -Source Voltage (V) Fig 11. Typical On-Resistance Vs. Gate Voltage Charge Fig 13a. ...

Page 7

Duty Cycle = Single Pulse 10 0.01 1 0.05 0.10 0.1 0.01 0.001 1.0E-06 1.0E-05 1.0E-04 Fig 15. Typical Avalanche Current Vs.Pulsewidth 140 TOP Single Pulse BOTTOM 10% Duty Cycle 120 5.1A 100 ...

Page 8

SO-8 Package Outline Dimensions are shown in millimeters (inches 0.25 [.010 NOT DIMENS IONING & ...

Page 9

SO-8 Tape and Reel Dimensions are shown in millimeters (inches) NOTES: 1. CONTROLLING DIMENSION : MILLIMETER. 2. ALL DIMENSIONS ARE SHOWN IN MILLIMETERS(INCHES). 3. OUTLINE CONFORMS TO EIA-481 & EIA-541. NOTES : 1. CONTROLLING DIMENSION : MILLIMETER. 2. OUTLINE CONFORMS ...

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