DS5000FP Maxim Integrated Products, DS5000FP Datasheet
DS5000FP
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DS5000FP Summary of contents
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... P2.6/A14 BD3 4 61 P2.5/A13 5 60 BD2 6 59 P2.4/A12 7 58 BD1 8 57 P2.3/A11 9 56 BD0 GND 12 DS5000FP 53 GND 13 52 P2.2/A10 14 51 P2.1/ P2.0/ XTAL1 17 48 XTAL2 18 47 P3.7/ P3.6/ P3. P3.4/T0 ...
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... ROM. Combining program and data storage in one device saves board space and cost. The DS5000FP can also access a second 32 kbytes of NV RAM but this area is restricted to data memory. The DS2250(T) and DS5000(T) are available for a user who wants a pre-constructed module using the DS5000FP, RAM, lithium cell, and optional real-time clock ...
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... DS5000FP BLOCK DIAGRAM Figure ...
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... Loader. At this time, will be pulled down externally. This should only be PSEN done once the DS5000FP is already in a reset state. The device that pulls down should be open drain since it must not interfere with operation. Address Latch Enable. Used to de-multiplex the multiplexed Expanded Address/Data bus on Port 0. This pin is normally connected to the clock input on a ’ ...
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PIN DESCRIPTION (continued) PIN NAME 11 P0.0–P0.7 79, 77 16, 8, 18, 80, 76 20, 24, BA14– 26, 28, 30, 33, BA0 35, 37 71, 69, 67, 65, BD7–BD0 ...
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... Also note that the DS5000FP is embodied in the DS5000(T) and DS2250(T) modules. The DS5000(T) combines the DS5000FP with one SRAM of either kbytes and a lithium cell. An optional Real Time Clock is also available in the DS5000T. This is packaged in a 40-pin DIP module. The DS2250( identical function in a SIMM form factor ...
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... Low-leakage SRAMs should be used for this reason. When a module is used, the lithium cell is selected by Dallas so absolute specifications are provided for the switch thresholds. When using the DS5000FP, the user must select the appropriate battery. The following formulas apply to the switch function: ...
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... DS5000FP CONNECTION SRAM Figure 3 DS5000FP CONNECTION TO 32k X 8 SRAM Figure ...
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ABSOLUTE MAXIMUM RATINGS Voltage Range on Any Pin Relative to Ground……………………………………...………-0. Voltage Range on V Relative to Ground…………………….……….……………………..………-0.3V to +7.0V CC Operating Temperature Range………………………………….….………………………………..…..0°C to +70°C Storage Temperature Range……………………………………...………………………………..…..-40°C to +70°C Soldering Temperature Range……………………………………………..See IPC/JEDEC J-STD-020 Specification ...
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DC CHARACTERISTICS (continued ±5 0°C to +70°C PARAMETER Operating Current at 16MHz Idle Mode Current at 12MHz Output Supply Voltage Output Supply Voltage (Battery-Backed Mode) Output Supply Current ...
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AC CHARACTERISTICS: EXPANDED BUS MODE TIMING SPECIFICATIONS = 5V ±5 0°C to +70°C PARAMETER 1 Oscillator Frequency 2 ALE Pulse Width 3 Address Valid to ALE Low 4 Address Hold After ALE Low 5 ...
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EXPANDED PROGRAM MEMORY READ CYCLE EXPANDED DATA MEMORY READ CYCLE ...
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EXPANDED DATA MEMORY WRITE CYCLE EXTERNAL CLOCK TIMING ...
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AC CHARACTERISTICS: EXTERNAL CLOCK DRIVE = 5V ±5 0°C to +70°C PARAMETER 28 External Clock High Time 29 External Clock Low Time 30 External Clock Rise Time 31 External Clock Fall Time AC CHARACTERISTICS: ...
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AC CHARACTERISTICS: POWER CYCLE TIMING = 5V ±5 0°C to +70°C PARAMETER 32 Slew Rate from CCmin 33 Crystal Startup Time 34 Power-On Reset Delay POWER CYCLE TIMING SYMBOL t LImax ...
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AC CHARACTERISTICS: PARALLEL PROGRAM LOAD TIMING = 5V ±5 0°C to +70°C PARAMETER 40 Oscillator Frequency 41 Address Setup to PROG 42 Address Hold after PROG 43 Data Setup to Low PROG 44 Data ...
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PARALLEL PROGRAM LOAD TIMING CAPACITANCE (T = +25°C, Test Frequency = 1MHz.) A PARAMETER Output Capacitance Input Capacitance SYMBOL MIN TYP MAX UNITS NOTES ...
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AC CHARACTERISTICS: BYTE-WIDE ADDRESS/DATA BUS TIMING = 5V ±5 0°C to +70°C PARAMETER Delay to Embedded Address Valid from 56 Low During Opcode Fetch 57 or Pulse Width CE1 CE2 Embedded Address Hold after ...
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BYTE-WIDE ADDRESS/DATA BUS OPCODE FETCH CYCLE BYTE-WIDE ADDRESS/DATA BUS OPCODE FETCH WITH DATA MEMORY READ ...
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BYTE-WIDE ADDRESS/DATA BUS OPCODE FETCH WITH DATA MEMORY WRITE ...
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PACKAGE INFORMATION (The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information www.maxim-ic.com/DallasPackInfo.) MILLIMETERS DIM MIN 0.25 A2 2.55 B 0.30 C 0.13 D 23.70 ...
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... The Maxim logo is a registered trademark of Maxim Integrated Products, Inc. The Dallas logo is a registered trademark of Dallas Semiconductor Corporation. DESCRIPTION relative to ground specification to Absolute Maximums © 2005 Maxim Integrated Products · Printed USA DS5000FP ...