K4D553238F-JC33 Samsung, K4D553238F-JC33 Datasheet

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K4D553238F-JC33

Manufacturer Part Number
K4D553238F-JC33
Description
Manufacturer
Samsung
Datasheet

Specifications of K4D553238F-JC33

Dc
0428

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Part Number
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Part Number:
K4D553238F-JC33
Manufacturer:
SST
Quantity:
750
256M GDDR SDRAM
K4D553238F-JC
256Mbit GDDR SDRAM
2M x 32Bit x 4 Banks
Graphic Double Data Rate
Synchronous DRAM
with Bi-directional Data Strobe and DLL
(144-Ball FBGA)
Revision 1.0
March 2004
Samsung Electronics reserves the right to change products or specification without notice.
Rev 1.0 (Mar. 2004)
- 1 -

Related parts for K4D553238F-JC33

K4D553238F-JC33 Summary of contents

Page 1

... K4D553238F-JC 256Mbit GDDR SDRAM with Bi-directional Data Strobe and DLL Samsung Electronics reserves the right to change products or specification without notice 32Bit x 4 Banks Graphic Double Data Rate Synchronous DRAM (144-Ball FBGA) Revision 1.0 March 2004 - 1 - 256M GDDR SDRAM Rev 1.0 (Mar. 2004) ...

Page 2

... K4D553238F-JC Revision History Revision 1.0 (March 8, 2004) • DC Specification finalized Revision 0.1 (March 2 , 2004) - Revision 0.0 (October 28, 2003) - • Defined Target Specification Target Spec Target Spec - 2 - 256M GDDR SDRAM Rev 1.0 (Mar. 2004) ...

Page 3

... All inputs except data & DM are sampled at the positive going edge of the system clock • Differential clock input • No Wrtie-Interrupted by Read Function ORDERING INFORMATION Part NO. K4D553238F-JC2A K4D553238F-JC33 K4D553238F-JC36 K4D553238F-JC40 K4D553238F-JC50 1. K4D553238F-EC is the Lead Free package part number 2. For the K4D553238F-JC2A, VDD & VDDQ =2.8V + 0.1V GENERAL DESCRIPTION ...

Page 4

... K4D553238F-JC PIN CONFIGURATION DQS0 DM0 VSSQ C DQ4 VDDQ NC D DQ6 DQ5 VSSQ E DQ7 VDDQ VDD F DQ17 DQ16 VDDQ DQ19 DQ18 VDDQ G H DQS2 DM2 NC J DQ21 DQ20 VDDQ DQ22 DQ23 VDDQ K CAS WE VDD L RAS BA0 N NOTE: 1. RFU1 is reserved for A12 2 ...

Page 5

... K4D553238F-JC INPUT/OUTPUT FUNCTIONAL DESCRIPTION Symbol CK, CK*1 Input CKE Input CS Input RAS Input CAS Input WE Input DQS ~ DQS Input/Output Input Input/Output Input Input Power Supply Power Supply DDQ SSQ V Power Supply ...

Page 6

... K4D553238F-JC BLOCK DIAGRAM (2Mbit x 32I Bank) Bank Select CK,CK ADDR LCKE LRAS LCBR CK,CK CKE 32 Intput Buffer CK, CK Data Input Register Serial to parallel 64 2Mx32 2Mx32 2Mx32 2Mx32 Column Decoder Latency & Burst Length Programming Register LWE LCAS LWCBR Timing Register CS RAS CAS ...

Page 7

... K4D553238F-JC FUNCTIONAL DESCRIPTION • Power-Up Sequence GDDR SDRAMs must be powered up and initialized in a predefined manner to prevent undefined operations. 1. Apply power and keep CKE at low state (All other inputs may be undefined) - Apply VDD before VDDQ . - Apply VDDQ before VREF & VTT 2. Start clock and maintain stable condition for minimum 200us. ...

Page 8

... K4D553238F-JC MODE REGISTER SET(MRS) The mode register stores the data for controlling the various operating modes of GDDR SDRAM. It programs CAS latency, addressing mode, burst length, test mode, DLL reset and various vendor specific options to make GDDR SDRAM useful for variety of different applications. The default value of the mode register is not defined, therefore the mode register must be written after EMRS setting for proper operation ...

Page 9

... K4D553238F-JC EXTENDED MODE REGISTER SET(EMRS) The extended mode register stores the data for enabling or disabling DLL and selecting output driver strength. The default value of the extended mode register is not defined, therefore the extened mode register must be written after power up for enabling or disabling DLL. The extended mode register is written by assert- ing low on CS, RAS, CAS, WE and high on BA0(The GDDR SDRAM should be in all bank precharge with CKE already high prior to writing into the extended mode register) ...

Page 10

... IH DDQ 5. V (mim.)= -1.5V for a pulse width and it can not be greater than 1/3 of the cycle rate For any pin under test input of 0V < For the K4D553238F-JC2A, VDD & VDDQ = 2.8V + 0.1V Symbol OUT V ...

Page 11

... K4D553238F-JC DC CHARACTERISTICS Recommended operating conditions Unless Otherwise Noted, T Parameter Symbol Operating Current I CC1 (One Bank Active) Precharge Standby Current I P CC2 in Power-down mode Precharge Standby Current I N CC2 in Non Power-down mode Active Standby Current I P CC3 power-down mode Active Standby Current in ...

Page 12

... K4D553238F-JC AC OPERATING TEST CONDITIONS Parameter Input reference voltage for CK(for single ended) CK and CK signal maximum peak swing CK signal minimum slew rate Input Levels Input timing measurement reference level Output timing measurement reference level Output load condition Output CAPACITANCE (V =2.5V Parameter ...

Page 13

... K4D553238F-JC AC CHARACTERISTICS Sym- Parameter bol CL cycle time CK CL high level width low level width CL t DQS out access time from CK DQSCK t Output access time from Data strobe edge to Dout edge DQSQ t Read preamble RPRE t Read postamble RPST valid DQS-in ...

Page 14

... K4D553238F-JC Note The JEDEC GDDR specification currently defines the output data valid window(tDV) as the time period when the data strobe and all data associated with that data strobe are coincidentally valid. - The previously used definition of tDV(=0.35tCK) artificially penalizes system timing budgets by assuming the worst case ...

Page 15

... Note : 1. For normal write operation, even numbers of Din are to be written inside DRAM AC CHARACTERISTICS (II) K4D553238F-JC2A Frequency Cas Latency 350MHz ( 2.86ns ) 4 300MHz ( 3.3ns ) 4 275MHz ( 3.6ns ) 4 250MHz ( 4.0ns ) 3 200MHz ( 5.0ns ) 3 K4D553238F-JC33 Frequency Cas Latency 300MHz ( 3.3ns ) 4 275MHz ( 3.6ns ) 4 250MHz ( 4.0ns ) 3 200MHz ( 5.0ns ) 3 -2A -33 Min Max ...

Page 16

... K4D553238F-JC K4D553238F-JC36 Frequency Cas Latency 275MHz ( 3.6ns ) 4 250MHz ( 4.0ns ) 3 200MHz ( 5.0ns ) 3 K4D553238F-JC40 Frequency Cas Latency 250MHz ( 4.0ns ) 3 200MHz ( 5.0ns ) 3 K4D553238F-JC50 Frequency Cas Latency 200MHz ( 5.0ns ) 3 Simplified Timing( CK, CK BA[1:0] BAa BAa Ra A8/AP Ra ADDR (A0~A7 A9,A10) WE DQS DQ Da0 Da1 Da2 Da3 ...

Page 17

... K4D553238F-JC PACKAGE DIMENSIONS (144-Ball FBGA) 0.45 0.35 1.40 A1 INDEX MARK 12.0 <Top View> 0.8x11=8.8 0.10 Max 0 ± 0. ± 0.05 Max <Bottom View> 256M GDDR SDRAM 12.0 A1 INDEX MARK 0.8 0.40 0.40 Rev 1.0 (Mar. 2004) Unit : mm ...

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