ISP1122NB Philips Semiconductors, ISP1122NB Datasheet
ISP1122NB
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ISP1122NB Summary of contents
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ISP1122 Universal Serial Bus stand-alone hub Rev. 02 — 4 October 1999 1. General description The ISP1122 is a stand-alone Universal Serial Bus (USB) hub device which complies with USB Specification Rev. 1 integrates a Serial Interface Engine ...
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... Ordering information Type number Package Name Description ISP1122D SO32 plastic small outline package; 32 leads; body width 7.5 mm ISP1122NB SDIP32 plastic shrink dual in-line package; 32 leads (400 mil) [1] ISP1122BD LQFP32 plastic low profile quad flat package; 32 leads; body 1.4 mm [1] For the availability of the LQFP32 package please contact your local Philips Semiconductors sales office. ...
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... Philips Semiconductors 5. Pinning information 5.1 ISP1122D (SO32) and ISP1122NB (SDIP32) 5.1.1 Pinning handbook, halfpage V reg(3. PSW2/GL2 GND 3 DM3 4 DP3 OC1 8 OC2 ISP1122D 9 OC3 10 OC4 11 OC5/GOC DM4 12 DP4 13 14 SP/BP 15 HUBGL 16 PSW3/GL3 MGR772 Fig 2. Pin configuration SO32. 5.1.2 Pin description Table 2: Symbol V reg(3 ...
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... Philips Semiconductors Table 2: Symbol OC2 OC3 OC4 OC5/GOC DM4 DP4 SP/BP HUBGL PSW3/GL3 PSW4/GL4 PSW5/GL5/ GPSW XTAL1 XTAL2 RESET OPTION/SCL INDV/SDA DM5 DP5 DM1 9397 750 06389 Product specification Pin description for SO32 and SDIP32 [1] Pin Type Description 8 AI/I overcurrent sense input for downstream port 2 (analog ...
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... Philips Semiconductors Table 2: Symbol DP1 DM0 DP0 DM2 DP2 PSW1/GL1 [1] Symbol names with an overscore (e.g. NAME) indicate active LOW signals. [2] The voltage at pin V connecting RESET to V [3] See [4] To disable a downstream port connect both D and disabled in reverse order starting from port 5. ...
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... Philips Semiconductors 5.2 ISP1122BD (LQFP32) 5.2.1 Pinning handbook, full pagewidth DP3 V CC OC1 OC2 OC3 OC4 OC5/GOC DM4 Fig 4. Pin configuration LQFP32. 5.2.2 Pin description Table 3: Symbol V reg(3.3) PSW2/GL2 GND DM3 DP3 V CC OC1 OC2 OC3 OC4 9397 750 06389 Product specification ...
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... Philips Semiconductors Table 3: Symbol OC5/GOC DM4 DP4 SP/BP HUBGL PSW3/GL3 PSW4/GL4 PSW5/GL5/ GPSW XTAL1 XTAL2 RESET OPTION/SCL INDV/SDA DM5 DP5 DM1 DP1 DM0 DP0 9397 750 06389 Product specification Pin description for LQFP32 …continued [1] Pin Type Description [3] 7 AI/I modes 5, 7: overcurrent sense input for downstream port 5 ...
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... Philips Semiconductors Table 3: Symbol DM2 DP2 PSW1/GL1 [1] Symbol names with an overscore (e.g. NAME) indicate active LOW signals. [2] The voltage at pin V connecting RESET to V [3] See [4] To disable a downstream port connect both D and disabled in reverse order starting from port 5. [5] Analog detection circuit can be switched off using an external EEPROM, see the pin functions as a logic input (TTL level) ...
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... Philips Semiconductors 6.2 Philips Serial Interface Engine (SIE) The Philips SIE implements the full USB protocol layer completely hardwired for speed and needs no firmware intervention. The functions of this block include: synchronization pattern recognition, parallel/serial conversion, bit (de-)stuffing, CRC checking/generation, Packet IDentifier (PID) verification/generation, address recognition, handshake evaluation/generation ...
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... Philips Semiconductors 6.9 PLL clock multiplier MHz clock multiplier Phase-Locked Loop (PLL) is integrated on-chip. This allows for the use of low-cost 6 MHz crystals. The low crystal frequency also minimizes Electro-Magnetic Interference (EMI). The PLL requires no external components. 6.10 Overcurrent detection An overcurrent detection circuit for downstream ports has been integrated on-chip self-reporting, resets automatically, has a low trip time and requires no external components ...
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... Philips Semiconductors 8. Endpoint descriptions Each USB device is logically composed of several independent endpoints. An endpoint acts as a terminus of a communication flow between the host and the device. At design time each endpoint is assigned a unique number (endpoint identifier, see during enumeration), the endpoint number and the transfer direction allows each endpoint to be uniquely referenced ...
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... Philips Semiconductors Table 6: Bit Host requests The ISP1122 handles all standard USB requests from the host via control endpoint 0. The control endpoint can handle a maximum of 64 bytes per transfer. Remark: Please note that the USB data transmission order is Least Significant Bit (LSB) fi ...
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... Philips Semiconductors Table 7: Standard USB requests Request name bmRequestType byte 0 [7:0] (Bin) Feature Clear Device Feature X000 0000 (REMOTE_WAKEUP) Clear Endpoint (1) X000 0010 Feature (HALT/STALL) Set Device Feature X000 0000 (REMOTE_WAKEUP) Set Endpoint (1) X000 0010 Feature (HALT/STALL) Status Get Device Status 1000 0000 ...
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... Philips Semiconductors Table 8: Hub specific requests …continued Request name bmRequestType byte 0 [7:0] (Bin) Status Get Hub Status 1010 0000 Get Port Status 1010 0011 Unsupported Get Bus Status 1010 0011 Clear Hub Feature X010 0000 (C_OVER_CURRENT) Set Hub Descriptor 0010 0000 ...
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... ISP1122 USB stand-alone hub Comments descriptor length = 18 bytes type = DEVICE USB Specification Rev. 1.1 HUB_CLASSCODE - - packet size = 64 bytes Philips Semiconductors vendor ID (04CC); can be customized using an external EEPROM (see Table 23) ISP1122 product ID; can be customized using an external EEPROM (see Table 23) device release 1.1; silicon revision ...
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... Philips Semiconductors Table 11: Configuration descriptor Values in square brackets are optional. Offset (bytes [1] Selected by input SP/BP. [2] Value in units of 2 mA. Table 12: Interface descriptor Offset (bytes Table 13: Endpoint descriptor Offset (bytes 9397 750 06389 Product specifi ...
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... USB Specification Rev. 1.0 Comments descriptor length = 4 bytes type = STRING LANGID code zero descriptor length = 46 bytes type = STRING [1] “Philips Semiconductors” descriptor length = 16 bytes type = STRING [1] “ISP1122” © Philips Electronics N.V. 1999. All rights reserved. [ ...
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... Philips Semiconductors 9.4 Hub responses This section describes the hub responses to requests from the USB host. 9.4.1 Get device status The hub returns 2 bytes, see Table 16: Get device status response Bit # 9.4.2 Get configuration The hub returns 1 byte, see Table 17: Get configuration response ...
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... Philips Semiconductors 9.4.5 Get port status The hub returns 4 bytes. The first 2 bytes contain the port status bits (wPortStatus, see Table Table Table 20: Get port status response (wPortStatus) Bit # Table 21: Get port status response (wPortChange) Bit # ...
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... Philips Semiconductors 9.4.6 Get configuration descriptor The hub returns 25 bytes containing the configuration descriptor (9 bytes, see Table (7 bytes, see 9.4.7 Get device descriptor The hub returns 18 bytes containing the device descriptor, see 9.4.8 Get hub descriptor The hub returns 9 bytes containing the hub descriptor, see 9 ...
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... Philips Semiconductors 10.2 Hardware connections Via the I (PCF8582 or equivalent). The hardware connections are shown in The SCL and SDA pins are multiplexed with pins OPTION and INDV respectively. idth Fig 5. EEPROM connection diagram. The slave address which ISP1122 uses to access the EEPROM is 1010000B. Page mode addressing is not supported, so pins A0, A1 and A2 of the EEPROM must be connected to GND (logic 0) ...
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... FAH) string descriptors disabled string descriptors enabled (strings: “Philips Semiconductors”, “ISP1122”) internal analog overcurrent detection circuit disabled; overcurrent pins OCn function as digital inputs (TTL level) internal analog overcurrent detection circuit enabled ...
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... Philips Semiconductors Assuming allows a voltage drop of 100 mV across the hub printed-circuit board (PCB) to each downstream connector. This includes a voltage drop across: • Power supply connector • Hub PCB (power and ground traces, ferrite beads) • Power switch (FET on-resistance) • ...
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... Philips Semiconductors The PCB resistance may cause a drop of 25 mV, which leaves 75 mV for the power switch and overcurrent sense device. The voltage drop components are shown in Figure For bus-powered hubs overcurrent protection is optional. It may be implemented for all downstream ports on a global or individual basis. ...
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... Philips Semiconductors The ISP1122 overcurrent detection circuit has been designed with a nominal trip voltage ( V a power switch with an on-resistance of 100 m 12.3 Tuning the overcurrent trip voltage The ISP1122 trip voltage can optionally be adjusted through external components to set the desired trip current. This is done by inserting tuning resistors at pins SP/BP or ...
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... Philips Semiconductors handbook, full pagewidth 5 V POWER SUPPLY 3% 4.85 V(min PSW1/GL1 GND PSW2/GL2 PSW3/GL3 100 PSW4/GL4 PSW5/GL5/GPSW INDV SP/BP OPTION ISP1122 OC5/GOC Power switches are low-ohmic PMOS devices as specified in Fig 10. Mode 5: self-powered hub; individual port power switching; individual overcurrent detection. ...
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... Philips Semiconductors dbook, full pagewidth 5.1 V KICK-UP POWER SUPPLY 3% 4.95 V(min GND 100 PSW5/GL5/GPSW INDV SP/BP OPTION ISP1122 Power switch is low-ohmic PMOS device as specified in Fig 11. Mode 1: self-powered hub; ganged port power switching; global overcurrent detection. 9397 750 06389 Product specification 4 ...
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... Philips Semiconductors upstream handbook, full pagewidth port 4.50 V(min) V BUS D D GND SHIELD PSW1/GL1 V CC PSW2/GL2 GND PSW3/GL3 PSW4/GL4 PSW5/GL5/GPSW INDV SP/BP OPTION ISP1122 OC1 OC2 OC3 OC4 OC5/GOC Power switches are low-ohmic PMOS devices as specified in Fig 12. Mode 4: bus-powered hub; individual port power switching; individual overcurrent detection. ...
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... Philips Semiconductors upstream handbook, full pagewidth port V BUS GND SHIELD V CC GND PSW5/GL5/GPSW INDV SP/BP OPTION ISP1122 Power switch is low-ohmic PMOS device as specified in Fig 13. Mode 0: bus-powered hub; ganged port power switching; global overcurrent detection. 9397 750 06389 Product specification 4.50 V(min) ...
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... Philips Semiconductors 13. Limiting values Table 24: Absolute maximum ratings In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter V supply voltage CC V input voltage I I latchup current latchup V electrostatic discharge voltage esd T storage temperature stg P total power dissipation tot [1] Equivalent to discharging a 100 pF capacitor via a 1.5 k resistor. ...
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... Philips Semiconductors 14. Static characteristics Table 26: Static characteristics; supply pins V = 4 GND amb Symbol Parameter V regulated supply voltage reg(3.3) I operating supply current suspend supply current CC(susp [1] In ‘suspend’ mode the minimum voltage is 2.7 V. Table 27: Static characteristics: digital pins V = 4.0 to 5.5 V ...
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... Philips Semiconductors Table 29: Static characteristics: analog I/O pins ( 4 GND amb Symbol Parameter Input levels V differential input sensitivity DI V differential common mode CM voltage V LOW-level input voltage IL V HIGH-level input voltage IH Output levels V LOW-level output voltage OL V HIGH-level output voltage ...
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... Philips Semiconductors Table 31: Dynamic characteristics: overcurrent sense pins V = 4 GND amb Symbol Parameter t overcurrent trip response time trip from OCn LOW to PSWn HIGH [1] Operating modes and 5; see Table 32: Dynamic characteristics: analog I/O pins ( full-speed mode V = 4 ...
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... Philips Semiconductors Table 33: Dynamic characteristics: analog I/O pins ( low-speed mode V = 4 GND amb Symbol Parameter Driver characteristics t rise time LR t fall time LF LRFM differential rise/fall time matching ( output signal crossover voltage CRS Hub timing (downstream ports configured as low-speed) ...
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... Philips Semiconductors T PERIOD handbook, full pagewidth 3.3 V crossover point differential data lines the bit duration corresponding with the USB data rate. PERIOD Fig 15. Source differential data jitter. T PERIOD handbook, full pagewidth 3.3 V crossover point differential data lines 0 V differential data the bit duration corresponding with the USB data rate ...
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... Philips Semiconductors handbook, halfpage Fig 18. Receiver SE0 width tolerance. 3.3 V handbook, full pagewidth crossover upstream point differential data lines 0 V hub delay downstream t HDD 3.3 V downstream differential data lines 0 V (A) downstream hub delay SOP distortion: t SOP = t HDD (next J) t HDD(SOP) Full-speed timing symbols have a subscript prefix ‘F’, low-speed timings a prefix ‘L’. ...
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... Philips Semiconductors 3.3 V handbook, full pagewidth upstream differential data lines EOP 3.3 V downstream differential data lines 0 V (A) downstream EOP delay EOP delay: t EOP = max (t EOP , t EOP ) EOP delay relative to t HDD : t EOPD = t EOP t HDD EOP skew: t HESK = t EOP t EOP Full-speed timing symbols have a subscript prefix ‘F’, low-speed timings a prefix ‘L’. ...
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... Philips Semiconductors handbook, full pagewidth SDA t BUF t LOW SCL HD;STA 2 Fig 21. I C-bus timing. 16. Test information The dynamic characteristics of the analog I/O ports (D and D and Table Fig 22. Load impedance for D+ and D- pins. 9397 750 06389 Product specification HD;STA t HIGH t SU ...
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... Philips Semiconductors 17. Package outline SO32: plastic small outline package; 32 leads; body width 7 pin 1 index 1 e DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT max 0.3 2.45 mm 2.65 0.25 0.1 2.25 0.012 0.096 inches 0.10 0.01 0.004 0.086 Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. ...
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... Philips Semiconductors SDIP32: plastic shrink dual in-line package; 32 leads (400 mil pin 1 index 1 DIMENSIONS (mm are the original dimensions UNIT max. min. max. mm 4.7 0.51 3.8 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION IEC SOT232-1 Fig 24. SDIP32 package outline. ...
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... Philips Semiconductors LQFP32: plastic low profile quad flat package; 32 leads; body 1 pin 1 index DIMENSIONS (mm are the original dimensions) A UNIT max. 0.20 1.45 0.4 mm 1.60 0.25 0.05 1.35 0.3 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. ...
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... Philips Semiconductors 18. Soldering 18.1 Introduction This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our Data Handbook IC26; Integrated Circuit Packages (document order number 9398 652 90011). There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mount components are mixed on one printed-circuit board ...
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... Philips Semiconductors During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications ...
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... Philips Semiconductors 18.4 Package related soldering information Table 35: Suitability of IC packages for wave, reflow and dipping soldering methods Mounting Through-hole mount Surface mount [1] All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the Data Handbook IC26 ...
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... Philips Semiconductors 19. Revision history Table 36: Revision history Rev Date CPCN Description 02 19991004 Product specification, second version; supersedes initial version ISP1122- June 1999 (9397 750 05154). Modifications: • Terminology made consistent: ganged power switching, global overcurrent detection • Added note on availability of LQFP32 to • ...
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... Product specification Production This data sheet contains final specifications. Philips Semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product. [1] Please consult the most recently issued data sheet before initiating or completing a design. ...
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... Korea: Tel. + 1412, Fax. + 1415 Malaysia: Tel. + 5214, Fax. + 4880 Mexico: Tel. +9-5 800 234 7381 Middle East: see Italy For all other countries apply to: Philips Semiconductors, International Marketing & Sales Communications, Building BE, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 272 4825 9397 750 06389 Product specifi ...
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... Philips Semiconductors Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 5.1 ISP1122D (SO32) and ISP1122NB (SDIP32 5.1.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 5.1.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 5.2 ISP1122BD (LQFP32 5.2.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 5.2.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 6 6 Functional description . . . . . . . . . . . . . . . . . . . 8 6.1 Analog transceivers . . . . . . . . . . . . . . . . . . . . . 8 6.2 Philips Serial Interface Engine (SIE 6.3 Hub repeater ...