M27C256B-12XF1 SGS-Thomson-Microelectronics, M27C256B-12XF1 Datasheet

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M27C256B-12XF1

Manufacturer Part Number
M27C256B-12XF1
Description
256 Kbit (32Kb x 8) EPROM, 5V, 120ns
Manufacturer
SGS-Thomson-Microelectronics
Datasheet

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M27C256B-12XF1
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DESCRIPTION
The M27C256B is a 256 Kbit EPROM offered in
the two ranges UV (ultra violet erase) and OTP
(one time programmable). It is ideally suited for mi-
croprocessor systems and is organized as 32,768
by 8 bits.
The FDIP28W (window ceramic frit-seal package)
has a transparent lid which allows the user to ex-
pose the chip to ultraviolet light to erase the bit pat-
tern. A new pattern can then be written to the
device by following the programming procedure.
For applications where the content is programmed
only one time and erasure is not required, the
M27C256B is offered in PDIP28, PLCC32 and
TSOP28 (8 x 13.4 mm) packages.
April 2001
5V
OPERATION
ACCESS TIME: 45ns
LOW POWER CONSUMPTION:
– Active Current 30mA at 5MHz
– Standby Current 100 A
PROGRAMMING VOLTAGE: 12.75V
PROGRAMMING TIME: 100 s/word
ELECTRONIC SIGNATURE
– Manufacturer Code: 20h
– Device Code: 8Dh
10% SUPPLY VOLTAGE in READ
256 Kbit (32Kb x 8) UV EPROM and OTP EPROM
0.25V
Figure 1. Logic Diagram
28
A0-A14
1
FDIP28W (F)
PLCC32 (C)
G
E
15
V CC
M27C256B
V SS
V PP
28
M27C256B
1
PDIP28 (B)
TSOP28 (N)
8 x 13.4 mm
8
Q0-Q7
AI00755B
1/16

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M27C256B-12XF1 Summary of contents

Page 1

... PROGRAMMING TIME: 100 s/word ELECTRONIC SIGNATURE – Manufacturer Code: 20h – Device Code: 8Dh DESCRIPTION The M27C256B is a 256 Kbit EPROM offered in the two ranges UV (ultra violet erase) and OTP (one time programmable ideally suited for mi- croprocessor systems and is organized as 32,768 by 8 bits. ...

Page 2

... A11 A9 A8 A13 A14 M27C256B A12 AI00614B 2/16 Figure 2B. LCC Connections M27C256B Table 1. Signal Names A0-A14 Q0-Q7 A10 ...

Page 3

... M27C256B Value Unit –40 to 125 C –50 to 125 C –65 to 150 C – – –2 to 13.5 V – Q7- Data Out Data Data Out ...

Page 4

... Standby Mode The M27C256B has a standby mode which reduc- es the supply current from 30mA to 100 A. The M27C256B is placed in the standby mode by ap- plying a CMOS high signal to the E input. When in the standby mode, the outputs are in a high imped- ance state, independent of the G input. ...

Page 5

... READ line from the system control bus. This ensures that all deselect- ed memory devices are in their low power standby mode and that the output pins are only active when data is desired from a particular memory de- vice. M27C256B 10 ...

Page 6

... E. The magnitude of this transient current peaks is dependent on the capacitive and inductive loading of the device at the output. The associated transient voltage peaks can be suppressed by complying with the two line 6/16 ( M27C256B Test Conditio n -90 -10 Min Max Min Max ...

Page 7

... CC Programming When delivered (and after each erasure for UV EPROM), all bits of the M27C256B are in the ”1” state. Data is introduced by selectively program- ming ”0”s into the desired bit locations. Although only ”0”s will be programmed, both ”1”s and ”0”s can be present in the data word. The only way to change a ’ ...

Page 8

... Ex- cept for E, all like inputs including G of the parallel M27C256B may be common. A TTL low level pulse applied to a M27C256B’s E input, with V at 12.75V, will program that M27C256B. A high level E input inhibits the other M27C256Bs from being programmed ...

Page 9

... M27C256B in about 3 years, while it would take approximately 1 week to cause erasure when exposed to direct sunlight. If the M27C256B exposed to these types of lighting conditions for extended pe- riods of time suggested that opaque labels ...

Page 10

... Optio Additional Burn- Tape & Reel Packing Note: 1. High Speed, see AC Characteristics section for further information. For a list of available options (Speed, Package, etc...) or for further information on any aspect of this de- vice, please contact the STMicroelectronics Sales Office nearest to you. 10/16 M27C256B - ...

Page 11

... Table 12. Revision History Date July 1998 First Issue 09/20/00 AN620 Reference removed 11/29/00 PLCC codification changed (Table 11) 04/02/01 FDIP28W mechanical dimensions changed (Table 13) Revision Details M27C256B 11/16 ...

Page 12

... M27C256B Table 13. FDIP28W - 28 pin Ceramic Frit-seal DIP, with window, Package Mechanical Data millimeters Symbol Typ 1. 36.50 D2 33.02 E 15.24 E1 13.06 e 2.54 eA 14.99 eB 16. 7.11 N Figure 8. FDIP28W - 28 pin Ceramic Frit-seal DIP, with window, Package Outline Drawing is not to scale. 12/16 Min Max Typ 5 ...

Page 13

... M27C256B inches Min Max – 0.200 0.015 – 0.140 0.160 0.015 0.020 – – 0.008 0.012 1.450 1.470 – – – – 0.535 0.545 – – – ...

Page 14

... M27C256B Table 15. PLCC32 - 32 lead Plastic Leaded Chip Carrier, Package Mechanical Data millimeters Symbol Typ 12.32 D1 11. 1.27 E 14.86 E1 13.89 E2 12. 0. Figure 10. PLCC32 - 32 lead Plastic Leaded Chip Carrier, Package Outline PLCC Drawing is not to scale. 14/16 Min Max Typ 2 ...

Page 15

... Figure 11. TSOP28 - 28 lead Plastic Thin Small Outline 13.4 mm, Package Outline DIE TSOP-c Drawing is not to scale Min Max Typ 1.00 1.25 0.20 0.95 1.05 0.30 0.10 0.21 13.70 11.90 7.90 8. 0.022 0. M27C256B inches Min Max 0.039 0.049 0.008 0.037 0.041 0.012 0.004 0.008 0.516 0.539 0.461 0.469 0.311 0.325 - - 0.012 0.028 0.004 15/16 ...

Page 16

... M27C256B Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice ...

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