M32L1632512A-8Q ETC-unknow, M32L1632512A-8Q Datasheet

no-image

M32L1632512A-8Q

Manufacturer Part Number
M32L1632512A-8Q
Description
Manufacturer
ETC-unknow
Datasheet

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
M32L1632512A-8Q
Manufacturer:
GSI
Quantity:
10
Part Number:
M32L1632512A-8Q
Manufacturer:
ELITEMT
Quantity:
20 000
Part Number:
M32L1632512A-8Q/UD
Manufacturer:
ALI
Quantity:
377
Part Number:
M32L1632512A-8Q/UD
Manufacturer:
ELITEMT
Quantity:
1 000
Part Number:
M32L1632512A-8Q/UD
Manufacturer:
ELITEMT
Quantity:
20 000
SGRAM
FEATURES
O
O
O
O
O
O
O
O
O
O
Graphic Features
O
O
O
Elite Semiconductor Memory Technology Inc.
- CAS Latency ( 2, 3 )
- Burst Length ( 1, 2, 4, 8 & full page )
- Burst Type ( Sequential & Interleave )
JEDEC standard 3.3V power supply
LVTTL compatible with multiplexed address
Dual bank / Pulse RAS
MRS cycle with address key programs
All inputs are sampled at the positive going
edge of the system clock
Burst Read Single-bit Write operation
DQM 0-3 for byte masking
Auto & self refresh
32ms refresh period (2K cycle)
100 pin QFP
SMRS cycle
Write Per Bit
Block Write (8 Columns)
- Load mask register
- Load color register
GENERAL DESCRIPTION
nous high data rate Dynamic RAM organized as 2 x
262, 144 words by 32 bits, fabricated with ESMT’s
high performance CMOS technology. Synchronous
design allows precise cycle control with the use of
system clock. I/O transactions are possible on every
clock cycle. Range of operating frequencies , progra-
mmable burst length, and programmable latencies
allows the same device to be useful for a variety of
high bandwidth, high performance memory system
applications.
performance in graphic systems.
ORDERING INFORMATION
M32L1632512A-5Q
M32L1632512A-5SQ
M32L1632512A-6Q
M32L1632512A-6SQ
M32L1632512A-7Q
M32L1632512A-7SQ
M32L1632512A-8Q
M32L1632512A-8SQ
The M32L1632512A is 16, 777, 216 bits synchro-
Write per bit and 8 columns block write improves
256K x 32 Bit x 2 Banks
Synchronous Graphic RAM
Part NO.
Cycle
time
5ns
5ns
6ns
6ns
7ns
7ns
8ns
8ns
Publication Date : Jun. 2001
Revision : 1.6
Frequency
200MHz
200MHz
166MHz
166MHz
143MHz
143MHz
125MHz
125MHz
Clock
M32L1632512A
time@CL=3
Access
4.5ns
4.5ns
5.5ns
5.5ns
6.0ns
6.0ns
6.5ns
6.5ns
1/54
t
(clk)
RDL
1
2
1
2
1
2
1
2

Related parts for M32L1632512A-8Q

M32L1632512A-8Q Summary of contents

Page 1

... Clock time Frequency M32L1632512A-5Q 5ns 200MHz M32L1632512A-5SQ 5ns 200MHz M32L1632512A-6Q 6ns 166MHz M32L1632512A-6SQ 6ns 166MHz M32L1632512A-7Q 7ns 143MHz M32L1632512A-7SQ 7ns 143MHz M32L1632512A-8Q 8ns 125MHz M32L1632512A-8SQ 8ns 125MHz Publication Date : Jun. 2001 Revision : 1.6 M32L1632512A Access t RDL time@CL=3 (clk) 4.5ns 1 4.5ns 2 5.5ns 1 5.5ns 2 6 ...

Page 2

... COLUMN ADDRESS BUFFER BUFFER ADDRESS REGISTER CLOCK ADDRESS M32L1632512A DQi (i=0~31) DQMi REFRESH COUNTER ) VSS ...

Page 3

... Enables write per bit, block write and special mode register set. (Voltage referenced to V Symbol OUT DDQ T STG M32L1632512A INPUT FUNCTION t ss prior to new t after the clock and masks the output. SHZ ) SS Value Unit -1.0 ~ 4.6 V -1.0 ~ 4.6 V -55 ~ +150 i 1 ...

Page 4

... OUT DD = 3.3V 1MH A Z Symbol C IN1 C IN2 C OUT Symbol & & V SSQ pins are connected in chip. DDQ pins are connected in chip. SSQ M32L1632512A = 0V) Max Unit Note 3 +0 0.8 V Note -2mA OH 0 Â 5 Note 2 µ ...

Page 5

... Page Burst All Banks Activated, = CCD CCD (min RC(min) CKE 0. mA, CC CC(min), BWC(min CCD(min). t BWC(min). M32L1632512A /V =2.0V/0.8V IH(min) IL(max) Version Unit Note 3 230 210 195 170 mA 2 230 210 195 170 ...

Page 6

... SLZ - 5 - 5.5 t SHZ - All AC parameters are measured from half to half. M32L1632512A 0.3V Value 2.4V/0. 1. 1ns/1ns R F 1.4V See Fig 1.4V REF è 50 è Z0 =50 30pF (Fig Output Load Circuit ...

Page 7

... RP(min RAS(min) t RAS(max RC(min) t CDL(min RDL(min BPL(min BAL(min) t BDL(min) t CCD(min BWC(min) CAS latency = 3 CAS latency = 2 M32L1632512A Version Unit -6S -7 - 100 CLK 1 CLK 2 ...

Page 8

... MHZ(10.0ns ) 2 M32L1632512A- -7SQ ) CAS Frequency Latency 143 MHZ(7.0ns ) 3 125 MHZ(8.0ns ) 3 100 MHZ(10.0ns ) 2 83 MHZ(12.0ns ) 2 M32L1632512A- -8SQ ) CAS Frequency Latency 125 MHZ(8.0ns ) 3 100 MHZ(10.0ns ) 3 83 MHZ(12.0ns ) 2 75 MHZ(13.4ns ) 2 Elite Semiconductor Memory Technology Inc. t ...

Page 9

... Valid Don’t Care Logic High Logic Low ) M32L1632512A DSF DQM A10 A9 A8~ CODE Row Address H L Column H L ...

Page 10

... Elite Semiconductor Memory Technology Inc. MRS Bank Active Bank Active MRS SMRS With Write per bit Disable CAS Latency M32L1632512A t after the end of burst. RP Write H L Bank Active Normal With Write Write per bit Enable Burst Length Publication Date : Jun ...

Page 11

... Reserved Reserved Reserved Reserved Load Color Load Mask A6 Function A5 0 Disable 0 1 Enable 1 M32L1632512A Burst Length Type Interleave Reserved Reserved Reserved Reserved ...

Page 12

... Byte 2 Byte I/O23~ I/O16 DQ24 DQ16 DQ25 DQ17 DQ26 DQ18 DQ27 DQ19 DQ28 DQ20 DQ29 DQ21 DQ30 DQ22 DQ31 DQ23 M32L1632512A Interleave Interleave ...

Page 13

... NOP condition. 3.Both banks must be precharged now. 4.Perform a minimum of 2 Auto refresh cycles to stabilize the internal circuitry. 5.Perform a MODE REGISTER SET cycle to program the CAS latency, burst length and M32L1632512A (and V ) supply. DD DDQ reaches the desired voltage Publication Date : Jun ...

Page 14

... SGRAM operation. Refer to the table for specific codes for various burst length, addressing modes and CAS latencies. Elite Semiconductor Memory Technology Inc. M32L1632512A BANK ACTIVATE The bank activate command is used to select a random row in an idle bank. By asserting low on RAS and CS with desired row and bank addresses, a row access is initiated ...

Page 15

... A10 of the bank to be precharged. The precharge command can be asserted t anytime after RAS (min) activate command in the desired bank. “ defined as the minimum time required to precharge a bank. Publication Date : Jun. 2001 Revision : 1.6 M32L1632512A is satisfy from the bank t ” 15/54 ...

Page 16

... The self refresh mode is entered from all banks t after RP idle state by asserting low RAS , CAS and CKE with high Once the self refresh mode is entered, only CKE state M32L1632512A . The minimum number of clock Publication Date : Jun. 2001 Revision : 1.6 16/ ...

Page 17

... The color register is the same width as the data port of the chip width via a SWCBR where data present on the DQ pins is Publication Date : Jun. 2001 Revision : 1.6 M32L1632512A feature allowing the 17/54 ...

Page 18

... DQM masking provides independent data byte masking during normal write operations, except that the control is extended to the consecutive 8 columns of the block write. Elite Semiconductor Memory Technology Inc. M32L1632512A Timing Diagram to Illustrate t 1. 2CLK Cycle Block Write HIG H ...

Page 19

... Each bit of the mask register directly controls a corresponding bit plane. Byte masking (pixel masking for 8bpp system) for color DQi M32L1632512A Benefits ...

Page 20

... M32L1632512A ...

Page 21

... CL3 ) * M32L1632512A * ...

Page 22

... To prevent bus contention, DQM should be issued which makes at least one gap between data in and data out. Elite Semiconductor Memory Technology Inc Hi M32L1632512A Publication Date : Jun. 2001 Revision : 1.6 22/54 ...

Page 23

... Block Write CMD M32L1632512A 2) Block Write xel * Publication Date : Jun ...

Page 24

... CMD DQ DQ Special Mode Register Set CMD ACT MRS M32L1632512A t from this point STO P * ACT SMR S ...

Page 25

... After self refresh entry, self refresh mode is kept while CKE is low. Elite Semiconductor Memory Technology Inc. 2) Power Down (=Precharge Power Down) Exit * CMD * CMD M32L1632512A CMD Publication Date : Jun. 2001 Revision : 1.6 25/54 ...

Page 26

... At MRS A2 =”001” auto precharge, should not be violated. RAS At MRS A2 =”010”. At MRS A2 =”011”. At MRS A2 =”111”. Wrap around mode (Infinite burst length) should be stopped by burst stop. RAS interrupt or CAS interrupt. M32L1632512A Publication Date : Jun. 2001 Revision : 1.6 26/54 ...

Page 27

... DQM3=0 DQM2 M32L1632512A should not be violated DQM1=0 ...

Page 28

... White DQ23=H Blue Green Blue Green Blue White White Green Blue Green Blue Green Blue White White Green M32L1632512A DQM1=0 DQM0=1 Color1=Yellow Color0=Red White DQ8=H White DQ0=L White DQ9=L White DQ1=H White DQ10=H White DQ2=H White DQ11=H White DQ3=H ...

Page 29

... Blue Blue Yellow Blue Blue Blue Blue Blue Blue Blue Yellow Blue I/O MASK PIXEL & I/O MASK M32L1632512A Yellow Red DQM1=0 DQM0 Green White ...

Page 30

... Term burst, Begin Read ; Latch CA ; Determine ILLEGAL L BA CA, AP Term burst, Begin Write ; Latch CA ; Determine CA, AP Term burst, Begin Write ; Latch CA ; Determine AP M32L1632512A ACTION Æ Row Active) Æ Row Active) Æ Row active Æ Row Active) Æ Æ Row Active) Row Active Publication Date : Jun ...

Page 31

... ILLEGAL Æ NOP Idle after Æ NOP Idle after ILLEGAL ILLEGAL ILLEGAL BA = Bank Address (A10 Column Address (A0~A7) M32L1632512A ACTION Note 2 3 Æ Æ Precharge) Precharge Æ 2 Æ Precharge) Precharge ...

Page 32

... Begin Clock Suspend next cycle Exit Clock Suspend next cycle Maintain Clock Suspend + one clock “ must be satisfy before any command other than exit. SS M32L1632512A ACTION Note Æ ÂÃÊ t after RC Æ ÂÃÊ t after RC Æ Æ ...

Page 33

... Elite Semiconductor Memory Technology Inc M32L1632512A ...

Page 34

... M32L1632512A ...

Page 35

... Bank B row active, enable write per bit function for bank B. 6. Block write/normal write is controlled by DSF. DSF Operation L Normal write H Block write Elite Semiconductor Memory Technology Inc. Operation Precharge Bank A Bank B Both Bank Operation Minimum cycle time t CCD t BWC M32L1632512A Publication Date : Jun. 2001 Revision : 1.6 35/54 ...

Page 36

... +CAS latency - RCD SAC M32L1632512A ...

Page 37

... before Row precharge, will be written. RDL M32L1632512A ...

Page 38

... M32L1632512A ...

Page 39

... M32L1632512A Publication Date : Jun ...

Page 40

... M32L1632512A ...

Page 41

... M32L1632512A ...

Page 42

... M32L1632512A ...

Page 43

... before internal precharge start. RAS M32L1632512A ...

Page 44

... after A Bank auto precharge starts. RP M32L1632512A ...

Page 45

... M32L1632512A ...

Page 46

... M32L1632512A ...

Page 47

... (=1CLK). BDL t (=1CLK). RDL M32L1632512A ...

Page 48

... M32L1632512A ...

Page 49

... Elite Semiconductor Memory Technology Inc M32L1632512A ...

Page 50

... ” prior to Row active command. SS M32L1632512A ...

Page 51

... required before exit from self refresh. RAS M32L1632512A Publication Date : Jun ...

Page 52

... Minimum 1 clock cycles should be met before new RAS activation. 3. Please refer to Mode Register Set table. Elite Semiconductor Memory Technology Inc. Auto Refresh Cycle M32L1632512A ...

Page 53

... Dimension in inch Min Norm Max 0.134 0.117 0.015 0.009 0.913 0.921 0.787 0.791 0.677 0.685 0.551 0.555 0.031 0.037 0.063 REF 0.026 REF 0 7 0.003 M32L1632512A SEE DETAIL "A" L1 DETAIL "A" A2 Publication Date : Jun. 2001 Revision : 1.6 L 53/54 ...

Page 54

... If products described here are to be used for such kinds of application, purchaser must do its own quality assurance testing appropriate to such applications. Elite Semiconductor Memory Technology Inc. Important Notice M32L1632512A Publication Date : Jun. 2001 Revision : 1.6 54/54 ...

Related keywords