MCP6541UT-I/LT Microchip Technology, MCP6541UT-I/LT Datasheet - Page 26

IC COMP 1.6V SNGL P-P SC70-5

MCP6541UT-I/LT

Manufacturer Part Number
MCP6541UT-I/LT
Description
IC COMP 1.6V SNGL P-P SC70-5
Manufacturer
Microchip Technology
Type
General Purposer
Datasheets

Specifications of MCP6541UT-I/LT

Output Type
CMOS, Push-Pull, Rail-to-Rail, TTL
Package / Case
6-TSSOP (5 lead), SC-88A, SOT-353
Number Of Elements
1
Voltage - Supply
1.6 V ~ 5.5 V
Mounting Type
Surface Mount
Number Of Channels
1 Channel
Product
Analog Comparators
Offset Voltage (max)
7 mV
Input Bias Current (max)
0.000001 uA
Supply Voltage (max)
5.5 V
Supply Voltage (min)
1.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 40 C
Comparator Type
Low Power
No. Of Comparators
1
Ic Output Type
Push Pull
Output Compatibility
CMOS, TTL
Supply Current
0.6µA
Supply Voltage Range
1.6V To 5.5V
Amplifier Case Style
SC-70
No. Of Pins
5
Rohs Compliant
Yes
Leaded Process Compatible
Yes
Peak Reflow Compatible (260 C)
Yes
Response Time
4µs
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
MCP6541UT-I/LT
MCP6541UT-I/LTTR

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MCP6541UT-I/LT
Manufacturer:
FREESCALE
Quantity:
7 660
Part Number:
MCP6541UT-I/LT
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
MCP6541/1R/1U/2/3/4
DS21696F-page 26
14-Lead Plastic Dual In-Line (P) – 300 mil Body [PDIP]
Notes:
1. Pin 1 visual index feature may vary, but must be located with the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
Note:
NOTE 1
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
A
A1
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing §
N
1
2
b
b1
3
D
Dimension Limits
e
Units
A2
A1
E1
eB
b1
N
D
A
E
b
e
L
c
A2
E1
.015
.290
.240
.735
.008
.045
.014
MIN
.115
.115
L
.100 BSC
INCHES
NOM
.130
.310
.250
.750
.130
.010
.060
.018
14
Microchip Technology Drawing C04-005B
© 2007 Microchip Technology Inc.
MAX
.210
.195
.325
.280
.775
.150
.015
.070
.022
.430
eB
E
c

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