MCP6544-E/SL Microchip Technology, MCP6544-E/SL Datasheet - Page 25

IC COMP 1.6V QUAD P-P 14SOIC

MCP6544-E/SL

Manufacturer Part Number
MCP6544-E/SL
Description
IC COMP 1.6V QUAD P-P 14SOIC
Manufacturer
Microchip Technology
Type
General Purposer
Datasheets

Specifications of MCP6544-E/SL

Output Type
CMOS, Push-Pull, Rail-to-Rail, TTL
Package / Case
14-SOIC (0.154", 3.90mm Width)
Number Of Elements
4
Voltage - Supply
1.6 V ~ 5.5 V
Mounting Type
Surface Mount
Number Of Channels
4 Channels
Product
Analog Comparators
Offset Voltage (max)
7 mV
Input Bias Current (max)
0.000001 uA
Supply Voltage (max)
5.5 V
Supply Voltage (min)
1.6 V
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
8-Lead Plastic Micro Small Outline Package (MS) (MSOP)
© 2006 Microchip Technology Inc.
Note:
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions
3. Dimensioning and tolerancing per ASME Y14.5M
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
NOTE 1
shall not exceed 0.15 mm per side.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
A
A1
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff
Overall Width
Molded Package Width
Overall Length
Foot Length
Footprint
Foot Angle
Lead Thickness
Lead Width
N
1
2
b
D
e
Dimension Limits
E1
A2
Microchip Technology Drawing No. C04–111, Sept. 8, 2006
E
Units
c
A2
A1
E1
L1
N
D
e
A
E
L
ϕ
b
c
MCP6541/1R/1U/2/3/4
MIN
0.75
0.00
0.40
0.08
0.22
MILLIMETERS
L1
0.65 BSC
4.90 BSC
3.00 BSC
3.00 BSC
0.95 REF
NOM
0.85
0.60
8
MAX
1.10
0.95
0.15
0.80
0.23
0.40
L
DS21696E-page 25
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