BAP64LX NXP Semiconductors, BAP64LX Datasheet - Page 2

Planar PIN diode in a SOD882T leadless ultra small plastic SMD package

BAP64LX

Manufacturer Part Number
BAP64LX
Description
Planar PIN diode in a SOD882T leadless ultra small plastic SMD package
Manufacturer
NXP Semiconductors
Datasheet

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
BAP64LX
Manufacturer:
NXP/恩智浦
Quantity:
20 000
NXP Semiconductors
4. Marking
5. Limiting values
6. Thermal characteristics
7. Characteristics
Table 6.
T
BAP64LX_1
Product data sheet
Symbol
V
I
C
r
ISL
R
D
amb
F
d
= 25 C unless otherwise specified.
Characteristics
Parameter
forward voltage
reverse current
diode capacitance
diode forward resistance
isolation
Table 3.
Table 4.
In accordance with the Absolute Maximum Rating System (IEC 60134).
Table 5.
Type number
BAP64LX
Symbol
V
I
P
T
T
Symbol
R
F
stg
j
R
tot
th(j-sp)
Marking
Limiting values
Thermal characteristics
Parameter
thermal resistance from junction
to solder point
Parameter
reverse voltage
forward current
total power dissipation
storage temperature
junction temperature
Conditions
I
V
see
see
see
F
R
= 100 mA
V
V
V
I
I
I
I
f = 900 MHz
f = 1800 MHz
f = 2450 MHz
F
F
F
F
= 100 V
R
R
R
Figure
Figure
Figure
= 0.5 mA
= 1 mA
= 10 mA
= 100 mA
= 0 V
= 1 V
= 20 V
Rev. 01 — 29 June 2007
1; f = 1 MHz;
2; f = 100 MHz;
3; V
R
= 0 V;
Conditions
T
sp
= 90 C
Conditions
Marking code
LE
Min
-
-
-
-
-
-
-
-
-
-
-
-
Min
-
-
-
65
65
Typ
0.95
-
0.48
0.34
0.17
31
16
2.6
0.9
22
16
14
BAP64LX
Max
60
100
150
+150
+150
Typ
56
© NXP B.V. 2007. All rights reserved.
Silicon PIN diode
Max
1.1
100
-
-
0.30
50
26
4.4
1.5
-
-
-
Unit
V
mA
mW
Unit
K/W
C
C
Unit
V
nA
pF
pF
pF
dB
dB
dB
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