2069578-2 TE Connectivity, 2069578-2 Datasheet - Page 6

• Manufacturer Part Number: 2069578-2
• Manufacturer: TE Connectivity

Specifications of 2069578-2

• Product Type: Connector
• Number Of Contacts Loaded: 8
• Cable Style: Round Stranded
• Latch Style: Standard
• Keyed: No
• Small Conductor: No
• Qty./bag: 100
• Shield Material: Copper Alloy
• Shielded: Yes
• Number Of Positions: 8
• Plug Type: Industrial Mini
• Conductor O.d. (mm [in]): 0.74 – 0.86 [0.029 – 0.034]
• Shield Plating: Nickel
• Preloaded: Yes
• Contact Base Material: Copper Alloy
• Contact Plating, Mating Area, Material: Gold (20)
• For Cable Diameter (mm [in]): 6.70 [0.264]
• Connector Style: Plug - Modular
• Housing Material: Polyamide - GF
• Ul Flammability Rating: UL 94V-0
• Latch Color: White
• Rohs/elv Compliance: RoHS compliant, ELV compliant
• Lead Free Solder Processes: Not relevant for lead free process
• Rohs/elv Compliance History: Always was RoHS compliant
• Packaging Method: Package

3.5.15-
3.5.15-
3.5.15-
3.5.15-
3.5.14
3.5.14
Para.
項目
Rev F
1
1
2
2
衝撃
Physical Shock
はんだ付け性
(DIP 製品)
Solder ability
(DIP Products)
はんだ付け性
(SMT 製品)
Solder ability
(SMT Products)
Test Items
試験項目
衝撃により 1μsec.をこえる不連続
導通を生じないこと。
試験後、総合抵抗(ローレベル)の条
件に合致すること。
No electrical discontinuity greater
than 1μsec shall occur.
Termination Resistance
(Low Level).
10 倍の拡大鏡を用いて目視検査
し、ピンホール、ぬれ不良、はじき等
の異常がないこと。
Appearance of the specimen shall
be inspected after the test with the
assistance of a magnifier capable
of giving a magnifier of 10X.
The soldered surface shall be
covered with a smooth solder
coating with no more than small
amounts of scattering
imperfections such as pin-holes or
un-wet or de-wet areas.
10 倍の拡大鏡を用いて目視検査
し、ピンホール、ぬれ不良、はじき等
の異常がないこと。
Appearance of the specimen shall
be inspected after the test with the
assistance of a magnifier capable
of giving a magnifier of 10X.
The soldered surface shall be
covered with a smooth solder
coating with no more than small
amounts of scattering
imperfections such as pin-holes or
un-wet or de-wet areas.
Product Specification
製品規格
Requirements
規格値
Fig. 1 (CONT.)
Fig. 1 (続く)
加速度 :30G
衝撃パルス波形:半波正弦波
接続時間:11 ｍ sec.
衝撃回数:X、Y、Z 軸正逆方向に各 3 回宛、
EIA364-27
Accelerated Velocity : 30G
Waveform : Half-sin wave
Duration : 11 ｍ sec.
Number of drops : 3 drops each to normal
and reversed directions of X, Y and Z
axes, totally 18 drops.
EIA364-27
共晶はんだ
鉛フリーはんだ（Sn-Ag-Cu）
MIL-STD-202, 試験法 208
Eutectic solder
Lead-Free solder （Sn-Ag-Cu）
MIL-STD-202 Method 208
IEC60068-2-58 7.リフロー法に準拠する。
予備加熱:150±10℃、 60～120 秒
半田付け:235±5℃、 10±1 秒
リフロー回数: 2 回
Conform to IEC60068-2-58 7.Solder reflow
method.
Preheating: 150±10℃, 60～120sec
Soldering: 235±5℃, 10±1 sec
Number of reflow : 2
はんだ温度
はんだ浸漬時間
はんだ温度
はんだ浸漬時間
Solder Temperature : 235±5℃
Immersion Duration : 3±0.5 sec.
Solder Temperature : 245±5℃
Immersion Duration : 3±0.5 sec.
合計 18 回
Procedures
試験方法
235±5℃
245±5℃
3±0.5 秒
3±0.5 秒
108-78405
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