MCP6548-I/SN Microchip Technology, MCP6548-I/SN Datasheet - Page 22

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MCP6548-I/SN

Manufacturer Part Number
MCP6548-I/SN
Description
IC COMP OPENDRN 1.6V SNGL 8-SOIC
Manufacturer
Microchip Technology
Type
General Purposer
Datasheets

Specifications of MCP6548-I/SN

Output Type
CMOS, Open-Drain, Rail-to-Rail, TTL
Package / Case
8-SOIC (0.154", 3.90mm Width)
Number Of Elements
1
Voltage - Supply
1.6 V ~ 5.5 V
Mounting Type
Surface Mount
Number Of Channels
1 Channel
Product
Analog Comparators
Response Time
4 us
Offset Voltage (max)
7 mV
Input Bias Current (max)
1 pA
Supply Voltage (max)
5.5 V
Supply Voltage (min)
1.6 V
Supply Current (max)
1 uA
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Other names
MCP6548I/SN
MCP6546/6R/6U/7/8/9
DS21714F-page 22
8-Lead Plastic Dual In-Line (P) – 300 mil Body [PDIP]
Notes:
1. Pin 1 visual index feature may vary, but must be located with the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing §
NOTE 1
A
A1
b1
b
N
1
2
D
Dimension Limits
3
e
Units
L
A2
A1
E1
eB
E1
b1
N
D
A
E
b
e
L
c
A2
.015
.290
.240
.348
.008
.040
.014
MIN
.115
.115
eB
.100 BSC
E
INCHES
NOM
.130
.310
.250
.365
.130
.010
.060
.018
8
Microchip Technology Drawing C04-018B
© 2007 Microchip Technology Inc.
MAX
.210
.195
.325
.280
.400
.150
.015
.070
.022
.430
c

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