AD8564AR-REEL7 Analog Devices Inc, AD8564AR-REEL7 Datasheet - Page 12

• Manufacturer Part Number: AD8564AR-REEL7
• Description: IC COMP QUAD 7NS ULT-FAST 16SOIC
• Manufacturer: Analog Devices Inc
• Type: General Purposer

Specifications of AD8564AR-REEL7

• Rohs Status: RoHS non-compliant
• Number Of Elements: 4
• Output Type: CMOS, TTL
• Mounting Type: Surface Mount
• Package / Case: 16-SOIC (0.154", 3.90mm Width)

AD8564
ORDERING GUIDE
Model
AD8564AN
AD8564ANZ
AD8564AR
AD8564AR-REEL
AD8564AR-REEL7
AD8564ARZ
AD8564ARZ-REEL
AD8564ARZ-REEL7
AD8564ARU-REEL
AD8564ARUZ-REEL
1
©1999–2007 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
Z = RoHS Compliant Part.
1
1
1
1
1
Temperature Range
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
0.15
0.05
C01103-0-8/07(B)
4.50
4.40
4.30
PIN 1
Figure 20. 16-Lead Thin Shrink Small Outline Package [TSSOP]
BSC
0.65
16
1
COPLANARITY
COMPLIANT TO JEDEC STANDARDS MO-153-AB
5.10
5.00
4.90
0.10
Package Description
16-Lead Plastic Dual In-Line Package [PDIP]
16-Lead Plastic Dual In-Line Package [PDIP]
16-Lead Standard Small Outline Package [SOIC_N]
16-Lead Standard Small Outline Package [SOIC_N]
16-Lead Standard Small Outline Package [SOIC_N]
16-Lead Standard Small Outline Package [SOIC_N]
16-Lead Standard Small Outline Package [SOIC_N]
16-Lead Standard Small Outline Package [SOIC_N]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
Dimensions shown in millimeters
0.30
0.19
9
8
Rev. B | Page 12 of 12
1.20
MAX
SEATING
PLANE
6.40
BSC
(RU-16)
0.20
0.09
8°
0°
0.75
0.60
0.45
Package Option
N-16
N-16
R-16
R-16
R-16
R-16
R-16
R-16
RU-16
RU-16