1-2013620-2 TE Connectivity, 1-2013620-2 Datasheet

1-2013620-2

Manufacturer Part Number

1-2013620-2

Description

Manufacturer

TE Connectivity

Datasheet

1.1-2013620-2.pdf (7 pages)

Specifications of 1-2013620-2

Insertion Force

ZIF

Pcb Mount Style

Surface Mount

Grid Size

35x36

Grid Spacing (mm [in])

1.00 x 1.00 [.039 x .039]

Chip Compatibility

Intel® Core rPGA988A

Frame Style

Open

Heat Sink Attachment

Without

Zif Actuator

Screwdriver/Cam

Profile

Low

Cover Material

High Temperature Thermoplastic

Leg Style

Ball Grid Array (BGA)

Socket Identifier

rPGA988A

Number Of Positions

988

Assembly Process Feature

Pick and Place Cover, Tape

Cover Color

Black

Contact Style

Stamped + Formed

Contact Base Material

Copper Alloy

Contact Plating, Mating Area, Material

Gold (15)

Housing Color

Black

Housing Material

High Temperature Thermoplastic

Ul Flammability Rating

UL 94V-0

Rohs/elv Compliance

RoHS compliant, ELV compliant

Lead Free Solder Processes

Reflow solder capable to 245°C, Reflow solder capable to 260°C

Rohs/elv Compliance History

Always was RoHS compliant

Application

Production

Packaging Method

Tape Mounted on Reel

Packaging Quantity

160

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