LM2901DG ON Semiconductor, LM2901DG Datasheet - Page 11

• Manufacturer Part Number: LM2901DG
• Description: IC COMP QUAD SGL SUPPLY 14SOIC
• Manufacturer: ON Semiconductor
• Type: General Purposer

Specifications of LM2901DG

• Number Of Elements: 4
• Output Type: CMOS, Open-Collector, TTL
• Voltage - Supply: 3 V ~ 36 V, ±1.5 V ~ 18 V
• Mounting Type: Surface Mount
• Package / Case: 14-SOIC (0.154", 3.90mm Width)
• Package: 14SOIC
• Typical Response Time: 1.3 us
• Typical Response Time Range: 0.5 to 5 us
• Typical Voltage Gain Range: 90 to 110 dB
• Number Of Channels Per Chip: 4
• Minimum Single Supply Voltage: 3 V
• Power Supply Type: Single|Dual
• Number Of Channels: 4 Channels
• Response Time: 1.3 us
• Offset Voltage (max): 7 mV
• Input Bias Current (max): 250 nA
• Supply Voltage (max): 36 V
• Supply Voltage (min): 3 V
• Supply Current (max): 2 mA
• Maximum Power Dissipation: 1000 mW
• Maximum Operating Temperature: + 105 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• Comparator Type: General Purpose
• No. Of Comparators: 4
• Ic Output Type: CMOS, TTL
• Supply Current: 1mA
• Supply Voltage Range: 3V To 36V
• Amplifier Case Style: SOIC
• Rohs Compliant: Yes
• Number Of Elements: 4
• Technology: Bipolar
• Input Offset Voltage: 7mV
• Input Bias Current (typ): 250nA
• Single Supply Voltage (typ): 5/9/12/15/18/24/28V
• Dual Supply Voltage (typ): ±3/±5/±9/±12/±15V
• Power Supply Requirement: Single/Dual
• Voltage Gain In Db: 100dB
• Single Supply Voltage (min): 3V
• Single Supply Voltage (max): 36V
• Dual Supply Voltage (min): ±1.5V
• Dual Supply Voltage (max): ±18V
• Power Dissipation: 1W
• Operating Temp Range: -40C to 105C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 14
• Package Type: SOIC
• Output Compatibility: CMOS, TTL
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: LM2901DG; LM2901DGOS

−T−
0.15 (0.006) T
0.15 (0.006) T
0.10 (0.004)
SEATING
PLANE
L
U
U
PIN 1
IDENT.
2X
D
S
S
L/2
C
14
1
0.36
G
14X
14X
*For additional information on our Pb−Free strategy and soldering
−V−
A
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
K
0.10 (0.004)
REF
8
7
M
−U−
PACKAGE DIMENSIONS
SOLDERING FOOTPRINT*
1
B
T
H
1.26
14X
U
http://onsemi.com
J J1
N
CASE 948G−01
S
N
TSSOP−14
DETAIL E
ISSUE B
V
7.06
S
DETAIL E
11
SECTION N−N
Ç Ç Ç
É É É
Ç Ç Ç
É É É
F
K1
K
0.25 (0.010)
M
DIMENSIONS: MILLIMETERS
−W−
NOTES:
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
4. DIMENSION B DOES NOT INCLUDE
5. DIMENSION K DOES NOT INCLUDE DAMBAR
6. TERMINAL NUMBERS ARE SHOWN FOR
7. DIMENSION A AND B ARE TO BE
0.65
PITCH
ANSI Y14.5M, 1982.
FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION SHALL
NOT EXCEED 0.25 (0.010) PER SIDE.
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL
IN EXCESS OF THE K DIMENSION AT
MAXIMUM MATERIAL CONDITION.
REFERENCE ONLY.
DETERMINED AT DATUM PLANE −W−.
DIM
K1
J1
A
B
C
D
G
H
K
M
F
J
L
MILLIMETERS
MIN
4.90
4.30
0.05
0.50
0.50
0.09
0.09
0.19
0.19
−−−
0
0.65 BSC
6.40 BSC
_
MAX
5.10 0.193
4.50 0.169
1.20
0.15 0.002
0.75 0.020
0.60 0.020
0.20 0.004
0.16 0.004
0.30 0.007
0.25 0.007
8
_
MIN
−−− 0.047
0.026 BSC
0.252 BSC
0
INCHES
_
0.200
0.177
0.006
0.030
0.024
0.008
0.006
0.012
0.010
MAX
8
_