MAX4895EETE+ Maxim Integrated Products, MAX4895EETE+ Datasheet - Page 2

• Manufacturer Part Number: MAX4895EETE+
• Description: IC PORT PROTECTOR VGA 16TQFN
• Manufacturer: Maxim Integrated Products
• Type: VGA Port Protectorr

Specifications of MAX4895EETE+

• Applications: Desktop, Notebook PCs
• Mounting Type: Surface Mount
• Package / Case: 16-TQFN Exposed Pad
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

VGA Port Protector
ABSOLUTE MAXIMUM RATINGS
(All voltages referenced to GND.)
V
V
R, G, B, H1, V1, SCL1, SDA1...................-0.3V to +(V
EN, H0, V0, SCL0, SDA0 ............................-0.3V to +(V
Continuous Current through SDA_, SCL_.........................±30mA
Continuous Short-Circuit Current H1, V1..........................±20mA
ELECTRICAL CHARACTERISTICS
(V
V
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
2
SUPPLY OPERATION
Supply Voltage
Logic Supply Voltage
V
V
RGB CHANNELS
R, G, B Capacitance
R, G, B Leakage
H_, V_, EN CHANNELS
Input Threshold Low
Input Threshold High
Input Hysteresis
Input Leakage Current
Output-Voltage Low
Output-Voltage High
Propagation Delay
Enable Time
SDA_, SCL_ (DDC) CHANNELS
On-Resistance, SDA, SCL
Leakage Current, SDA, SCL
CC
L
L
CC
CC
L
.............................................................-0.3V to +(V
= +3.3V, and T
Supply Current
_______________________________________________________________________________________
........................................................................-0.3V to +6.0V
Supply Current
= +4.5V to +5.5V, V
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
PARAMETER
A
= +25°C.) (Note 2)
L
= +2.0V to V
SYMBOL
t
ON
V
C
I
I
R
V
LEAK
V
V
LEAK
HYST
I
V
t
V
V
CC
OUT
, t
I
PD
OH
CC
OL
ON
L
IH
IL
L
OFF
CC
, T
A
V
V
V
f = 1MHz, V
V
V
V
V
I
I
R
V
V
V
V
OUT
OUT
L
H0
H0
CC
L
L
L
CC
L
L
OH
SDA, SCL
= T
= +3.0V
= +3.6V
= +3.3V, V
= 0V
CC
CC
= 2.2k , C
, V
, V
= +5.5V
= +5.5V, I
V
L
= +2.4V
= 10mA sink, V
= 10mA source, V
MIN
CC
V0
V0
+ 0.3V)
+ 0.3V)
+ 0.3V)
= 0V, V
= 0V, V
to T
= +0.5V
R,G,B
CC
MAX
L
SDA, SCL
CONDITIONS
= 10pF, V
EN
EN
= +5.5V
= 1V
, unless otherwise noted. Typical values are at V
= V
= V
Continuous Power Dissipation (T
Operating Temperature Range ...........................-40°C to +85°C
Junction Temperature ......................................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Soldering Temperature (reflow) .......................................+260°C
CC
16-Pin TQFN (derate 20.8mW/°C above +70°C) .......1667mW
Junction-to-Case Thermal Resistance (θ
Junction-to-Ambient Thermal Resistance (θ
(Note 1) ........................................................................48°C/W
L
L
P-P
CC
= ±10mA,
= +4.5V
(no load)
OL
(Note 3)
= +4.5V
= +0.8V,
MIN
4.5
2.0
2.4
-1
-1
-1
2
A
= +70°C) for multilayer board:
TYP
100
3.3
0.5
0.5
2.2
15
15
20
JC
) (Note 1) ......7°C/W
JA
MAX
5.5
5.5
5.0
5.0
0.8
0.8
+1
+1
+1
55
)
CC
= +5.0V,
UNITS
mV
μA
μA
pF
μA
μA
μA
ns
ns
V
V
V
V
V
V