AP3310GH Advanced Power Electronics Corp., AP3310GH Datasheet

Advanced Power MOSFETs from APEC provide the designer with the best combination of fast switching, low on-resistance and cost- effectiveness

AP3310GH

Manufacturer Part Number
AP3310GH
Description
Advanced Power MOSFETs from APEC provide the designer with the best combination of fast switching, low on-resistance and cost- effectiveness
Manufacturer
Advanced Power Electronics Corp.
Datasheet

Specifications of AP3310GH

Vds
-20V
Vgs
±12V
Rds(on) / Max(m?) Vgs@4.5v
150
Rds(on) / Max(m?) Vgs@2.5v
250
Qg (nc)
6
Qgs (nc)
1.5
Qgd (nc)
0.6
Id(a)
-10
Pd(w)
25
Configuration
Single P
Package
TO-252

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
AP3310GH
Manufacturer:
APEC/富鼎
Quantity:
20 000
▼ Simple Drive Requirement
▼ 2.5V Gate Drive Capability
▼ Fast Switching Characteristic
Data and specifications subject to change without notice
V
V
I
I
I
P
T
T
Rthj-c
Rthj-a
Rthj-a
Description
Absolute Maximum Ratings
Thermal Data
D
D
DM
Advanced Power MOSFETs from APEC provide the designer with the
best combination of fast switching, low on-resistance and cost-
effectiveness.
This device is suited for low voltage and battery power applications.
STG
J
DS
GS
D
@T
@T
@T
C
C
Symbol
Symbol
C
=25℃
=100℃
=25℃
Advanced Power
Electronics Corp.
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current, V
Continuous Drain Current, V
Pulsed Drain Current
Total Power Dissipation
Linear Derating Factor
Storage Temperature Range
Operating Junction Temperature Range
Maximum Thermal Resistance, Junction-case
Maximum Thermal Resistance, Junction-ambient (PCB mount)
Maximum Thermal Resistance, Junction-ambient
Parameter
Parameter
1
G
GS
GS
@ 4.5V
@ 4.5V
D
S
P-CHANNEL ENHANCEMENT MODE
POWER MOSFET
RoHS-compliant Product
3
-55 to 150
-55 to 150
G
Rating
BV
R
I
D
0.01
D
- 20
+12
-6.2
-10
-24
25
DS(ON)
S
DSS
G
Value
62.5
110
5.0
D
AP3310GH/J
S
TO-252(H)
TO-251(J)
150mΩ
200902096
-20V
Units
W/℃
Units
℃/W
℃/W
℃/W
-10A
W
V
V
A
A
A
1

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AP3310GH Summary of contents

Page 1

... Rthj-a Maximum Thermal Resistance, Junction-ambient (PCB mount) Rthj-a Maximum Thermal Resistance, Junction-ambient Data and specifications subject to change without notice P-CHANNEL ENHANCEMENT MODE POWER MOSFET Parameter @ 4. 4. Parameter AP3310GH/J RoHS-compliant Product BV -20V DSS R 150mΩ DS(ON) I -10A TO-252( TO-251(J) ...

Page 2

... AP3310GH/J Electrical Characteristics@T Symbol BV Drain-Source Breakdown Voltage DSS Breakdown Voltage Temperature Coefficient ΔBV /ΔT DSS j R Static Drain-Source On-Resistance DS(ON) V Gate Threshold Voltage GS(th) g Forward Transconductance fs I Drain-Source Leakage Current DSS Drain-Source Leakage Current (T I Gate-Source Leakage GSS Q Total Gate Charge g Q Gate-Source Charge ...

Page 3

... GS Fig 3. On-Resistance v.s. Gate Voltage 20 -4.5V -4.0V 15 -3.5V 10 -3.0V 5 -2. -2. 7.5 10.0 Fig 2. Typical Output Characteristics 1.8 = -2. = 1.5 1.2 0.9 0 Fig 4. Normalized On-Resistance AP3310GH =150 Drain-to-Source Voltage ( -2. -4. Junction Temperature ( j v.s. Junction Temperature -4.5V -4.0V -3.5V -3.0V -2. -2. 100 150 ...

Page 4

... AP3310GH 100 T , Case Temperature ( c Fig 5. Maximum Drain Current v.s. Case Temperature 100 10 T =25 °C C Single Pulse (V) DS Fig 7. Maximum Safe Operating Area 125 150 o C) Fig 6. Typical Power Dissipation 1 1ms 0.1 10ms 100ms DC 0 ...

Page 5

... SD Fig 11. Forward Characteristic of Reverse Diode 1000 100 Fig 10. Typical Capacitance Characteristics 1 0.5 0 1.3 1.5 Fig 12. Gate Threshold Voltage v.s. AP3310GH ( Junction Temperature ( j Junction Temperature f=1.0MHz Ciss Coss Crss 11 13 100 150 ...

Page 6

... AP3310GH Fig 13. Switching Time Circuit -1~-3mA I G Fig 15. Gate Charge Circuit THE DS OSCILLOSCOPE 0.3 x RATED THE OSCILLOSCOPE -5V 0.3 x RATED d(on) r Fig 14. Switching Time Waveform ...

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