AP9467AGH-HF Advanced Power Electronics Corp., AP9467AGH-HF Datasheet - Page 2

The TO-252 package is widely preferred for commercial-industrial surface mount applications and suited for low voltage applications such as DC/DC converters

AP9467AGH-HF

Manufacturer Part Number
AP9467AGH-HF
Description
The TO-252 package is widely preferred for commercial-industrial surface mount applications and suited for low voltage applications such as DC/DC converters
Manufacturer
Advanced Power Electronics Corp.
Datasheet

Specifications of AP9467AGH-HF

Vds
40V
Vgs
±20V
Rds(on) / Max(m?) Vgs@10v
11.5
Rds(on) / Max(m?) Vgs@4.5v
20
Qg (nc)
9.5
Qgs (nc)
2
Qgd (nc)
6.5
Id(a)
43
Pd(w)
39
Configuration
Single N
Package
TO-252
THIS PRODUCT IS SENSITIVE TO ELECTROSTATIC DISCHARGE, PLEASE HANDLE WITH CAUTION.
USE OF THIS PRODUCT AS A CRITICAL COMPONENT IN LIFE SUPPORT OR OTHER SIMILAR SYSTEMS IS NOT AUTHORIZED.
APEC DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED
HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
APEC RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE
RELIABILITY, FUNCTION OR DESIGN.
BV
R
V
g
I
I
Q
Q
Q
t
t
t
t
C
C
C
R
V
t
Q
Notes:
1.Pulse width limited by max. junction temperature
2.Pulse test
3.Surface mounted on 1 in
AP9467AGH-HF
Electrical Characteristics@T
Source-Drain Diode
DSS
GSS
d(on)
r
d(off)
f
rr
fs
GS(th)
SD
DS(ON)
iss
oss
rss
g
g
gs
gd
rr
DSS
Symbol
Symbol
Drain-Source Breakdown Voltage
Static Drain-Source On-Resistance
Gate Threshold Voltage
Forward Transconductance
Drain-Source Leakage Current
Gate-Source Leakage
Total Gate Charge
Gate-Source Charge
Gate-Drain ("Miller") Charge
Turn-on Delay Time
Rise Time
Turn-off Delay Time
Fall Time
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Gate Resistance
Forward On Voltage
Reverse Recovery Time
Reverse Recovery Charge
2
copper pad of FR4 board
Parameter
Parameter
2
2
2
2
j
=25
o
C(unless otherwise specified)
2
V
V
V
V
V
V
V
I
V
V
V
I
R
R
V
V
f=1.0MHz
f=1.0MHz
I
I
dI/dt=100A/µs
D
D
S
S
GS
GS
GS
DS
DS
DS
GS
DS
GS
DS
GS
DS
G
D
=30A, V
=10A,
=30A
=30A
=0.67Ω
=3.3Ω,V
=V
=10V, I
=40V, V
=32V
=20V
=25V
=0V, I
=10V, I
=4.5V, I
=+20V, V
=4.5V
=0V
GS
Test Conditions
Test Conditions
V
, I
D
GS
GS
D
=250uA
D
D
D
=250uA
GS
GS
=20A
=0V
=30A
=0
=20A
DS
=10V
=0V
V
=0V
,
Min.
Min.
40
1
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
Typ.
Typ.
660
140
9.5
6.5
2.2
38
64
18
85
21
14
2
7
6
-
-
-
-
-
-
-
+100
Max. Units
1060
Max. Units
11.5
3.3
1.2
20
10
15
3
-
-
-
-
-
-
-
-
-
-
-
-
mΩ
mΩ
nC
nC
nC
nC
uA
nA
pF
pF
pF
ns
ns
ns
ns
ns
Ω
V
V
S
V
2

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