MC74LCX541DTG ON Semiconductor, MC74LCX541DTG Datasheet - Page 6

• Manufacturer Part Number: MC74LCX541DTG
• Description: IC BUFF/DVR TRI-ST 8BIT 20TSSOP
• Manufacturer: ON Semiconductor
• Series: 74LCXr

Specifications of MC74LCX541DTG

• Logic Type: Buffer/Line Driver, Non-Inverting
• Number Of Elements: 1
• Number Of Bits Per Element: 8
• Current - Output High, Low: 24mA, 24mA
• Voltage - Supply: 2 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 20-TSSOP
• Circuit Type: Low-Voltage TTL
• Current, Supply: 10 μA
• Function Type: 8-Channels
• Logic Function: Buffer
• Number Of Circuits: Octal
• Package Type: TSSOP-20
• Special Features: Non-Inverting, Tri-State
• Temperature, Operating, Range: -40 to +85 °C
• Voltage, Supply: 2.3 to 3.6 V
• Logic Family: LCX
• Number Of Channels Per Chip: 8
• Polarity: Non-Inverting
• Supply Voltage (max): 3.6 V
• Supply Voltage (min): 2 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• High Level Output Current: - 24 mA
• Low Level Output Current: 24 mA
• Maximum Power Dissipation: 200 mW
• Minimum Operating Temperature: - 40 C
• Number Of Lines (input / Output): 8 / 3
• Output Type: 3-State
• Propagation Delay Time: 7.5 ns at 2.7 V, 6.5 ns at 3 V to 3.6 V
• Logic Device Type: Buffer, Non Inverting
• Supply Voltage Range: 2V To 3.6V
• Logic Case Style: TSSOP
• No. Of Pins: 20
• Operating Temperature Range: -40°C To +85°C
• Filter Terminals: SMD
• Rohs Compliant: Yes
• Family Type: LCX
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: MC74LCX541DTG; MC74LCX541DTGOS

0.15 (0.006) T
0.15 (0.006) T
20
1
L
2X
−T−
U
PIN 1
IDENT
U
18X
L/2
20X
C
0.100 (0.004)
S
S
SEATING
PLANE
e
B
0.25
D
20
1
D
M
T
A
20X
S
−V−
0.10 (0.004)
K
A
B
10
11
REF
S
G
A1
B
E
A
A
H
T
M
PACKAGE DIMENSIONS
SEATING
PLANE
10
11
T
U
http://onsemi.com
MC74LCX541
−U−
CASE 948E−02
S
B
CASE 751D−05
DT SUFFIX
TSSOP−20
DW SUFFIX
V
ISSUE B
SOIC−20
ISSUE G
S
6
J J1
N
C
N
Í Í Í Í
Í Í Í Í
Í Í Í Í
DETAIL E
SECTION N−N
DETAIL E
F
q
K1
0.25 (0.010)
K
M
NOTES:
1. DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCES
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD
4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.
5. DIMENSION B DOES NOT INCLUDE DAMBAR
−W−
PER ASME Y14.5M, 1994.
PROTRUSION.
PROTRUSION. ALLOWABLE PROTRUSION
SHALL BE 0.13 TOTAL IN EXCESS OF B
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
DIM
A1
A
B
C
D
H
E
e
h
L
q
NOTES:
12.65
10.05
1. DIMENSIONING AND TOLERANCING
2. CONTROLLING DIMENSION:
3. DIMENSION A DOES NOT INCLUDE
4. DIMENSION B DOES NOT INCLUDE
5. DIMENSION K DOES NOT INCLUDE
6. TERMINAL NUMBERS ARE SHOWN
7. DIMENSION A AND B ARE TO BE
MILLIMETERS
MIN
2.35
0.10
0.35
0.23
7.40
0.25
0.50
PER ANSI Y14.5M, 1982.
MILLIMETER.
MOLD FLASH, PROTRUSIONS OR GATE
BURRS. MOLD FLASH OR GATE BURRS
SHALL NOT EXCEED 0.15 (0.006) PER
SIDE.
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION
SHALL NOT EXCEED 0.25 (0.010) PER
SIDE.
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08
(0.003) TOTAL IN EXCESS OF THE K
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
FOR REFERENCE ONLY.
DETERMINED AT DATUM PLANE −W−.
1.27 BSC
0
DIM
K1
J1
A
B
C
D
G
H
K
M
F
J
L
_
12.95
10.55
MAX
2.65
0.25
0.49
0.32
7.60
0.75
0.90
MILLIMETERS
MIN
6.40
4.30
0.05
0.50
0.27
0.09
0.09
0.19
0.19
−−−
0
7
0.65 BSC
6.40 BSC
_
_
MAX
6.60
4.50
1.20
0.15
0.75
0.37
0.20
0.16
0.30
0.25
8
_
0.252
0.169
0.002
0.020
0.004
0.004
0.007
0.007
0.011
MIN
−−−
0
0.026 BSC
0.252 BSC
INCHES
_
0.260
0.177
0.047
0.006
0.030
0.015
0.008
0.006
0.012
0.010
MAX
8
_